GB1246784A - Circuit boards - Google Patents
Circuit boardsInfo
- Publication number
- GB1246784A GB1246784A GB1175370A GB1175370A GB1246784A GB 1246784 A GB1246784 A GB 1246784A GB 1175370 A GB1175370 A GB 1175370A GB 1175370 A GB1175370 A GB 1175370A GB 1246784 A GB1246784 A GB 1246784A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sheets
- ceramic
- polymers
- free
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
1,246,784. Ceramic laminates. E. I. DU PONT DE NEMOURS & CO. 11 March, 1970 [11 March, 1969], No. 11753/70. Heading B5N. [Also in Division H1] A multi-layer ceramic circuit board is made by forming holes at desired locations in at least one of a plurality of sheets, each comprising finely divided ceramic particles and a temporary binder therefor; filling the holes with a paste comprising non-oxidizable, gas-free precious metal particles and a temporary binder; forming patterns on selected surface areas of at least one of the sheets with a paste comprising non-oxidizable gas-free metal particles and a temporary binder; bonding the sheets into a laminate; and firing the laminate for a time and at a temperature sufficient to volatilize the binders and sinter the ceramic particles and metal particles into a manolithic structure. Alternatively, the holes may be filled with paste after the formation of the conducting patterns, either prior to or subsequent to the bonding of the sheets into a laminate. The required characteristic of the metal powder is that it is gas-free, i.e. it should not evolve gases during firing. Non-oxidizable gas-free platinum, silver or gold powders may be used. The ceramic sheets may be made of alumina, steatite, zircon, aluminium silicate, zirconium dioxide, titanium dioxide, beryllium oxide, magnesium silicates, or various combinations thereof. Suitable binders for the ceramic particles include polyvinyl chloride polymers, polystyrene polymers, polymethyl methacrylate resins, ethyl cellulose, cellulose acetate polymers, polyester polymers, and cellulose acetatebutyrate polymers. The binder is preferably used together with a suitable solvent, and also a plasticizer, a wetting agent and/or a deflocculant to enhance the sheet-forming characteristics of the ceramic slurry. The conducting pattern may be formed on the sheets by screenprinting. The ceramic sheets may be formed by spraying the sheet formulation on to a support, or an incompatible liquid, or by doctor-blading.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80625669A | 1969-03-11 | 1969-03-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1246784A true GB1246784A (en) | 1971-09-22 |
Family
ID=25193668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1175370A Expired GB1246784A (en) | 1969-03-11 | 1970-03-11 | Circuit boards |
Country Status (5)
Country | Link |
---|---|
BE (1) | BE747168A (en) |
DE (1) | DE2011628A1 (en) |
FR (1) | FR2034818A1 (en) |
GB (1) | GB1246784A (en) |
NL (1) | NL7003372A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4470098A (en) * | 1982-02-18 | 1984-09-04 | Itt Industries, Inc. | Multilayer ceramic dielectric capacitors |
GB2212333A (en) * | 1987-11-11 | 1989-07-19 | Gen Electric Co Plc | Method of fabricating multi-layer circuits |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2964342D1 (en) * | 1978-06-23 | 1983-01-27 | Ibm | Multi-layer dielectric substrate |
-
1970
- 1970-03-10 FR FR7008595A patent/FR2034818A1/fr not_active Withdrawn
- 1970-03-10 NL NL7003372A patent/NL7003372A/xx unknown
- 1970-03-11 BE BE747168D patent/BE747168A/en unknown
- 1970-03-11 GB GB1175370A patent/GB1246784A/en not_active Expired
- 1970-03-11 DE DE19702011628 patent/DE2011628A1/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4470098A (en) * | 1982-02-18 | 1984-09-04 | Itt Industries, Inc. | Multilayer ceramic dielectric capacitors |
GB2212333A (en) * | 1987-11-11 | 1989-07-19 | Gen Electric Co Plc | Method of fabricating multi-layer circuits |
Also Published As
Publication number | Publication date |
---|---|
FR2034818A1 (en) | 1970-12-18 |
BE747168A (en) | 1970-08-17 |
DE2011628A1 (en) | 1970-09-24 |
NL7003372A (en) | 1970-09-15 |
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