GB1246784A - Circuit boards - Google Patents

Circuit boards

Info

Publication number
GB1246784A
GB1246784A GB1175370A GB1175370A GB1246784A GB 1246784 A GB1246784 A GB 1246784A GB 1175370 A GB1175370 A GB 1175370A GB 1175370 A GB1175370 A GB 1175370A GB 1246784 A GB1246784 A GB 1246784A
Authority
GB
United Kingdom
Prior art keywords
sheets
ceramic
polymers
free
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1175370A
Inventor
Denis George Kelemen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of GB1246784A publication Critical patent/GB1246784A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1,246,784. Ceramic laminates. E. I. DU PONT DE NEMOURS & CO. 11 March, 1970 [11 March, 1969], No. 11753/70. Heading B5N. [Also in Division H1] A multi-layer ceramic circuit board is made by forming holes at desired locations in at least one of a plurality of sheets, each comprising finely divided ceramic particles and a temporary binder therefor; filling the holes with a paste comprising non-oxidizable, gas-free precious metal particles and a temporary binder; forming patterns on selected surface areas of at least one of the sheets with a paste comprising non-oxidizable gas-free metal particles and a temporary binder; bonding the sheets into a laminate; and firing the laminate for a time and at a temperature sufficient to volatilize the binders and sinter the ceramic particles and metal particles into a manolithic structure. Alternatively, the holes may be filled with paste after the formation of the conducting patterns, either prior to or subsequent to the bonding of the sheets into a laminate. The required characteristic of the metal powder is that it is gas-free, i.e. it should not evolve gases during firing. Non-oxidizable gas-free platinum, silver or gold powders may be used. The ceramic sheets may be made of alumina, steatite, zircon, aluminium silicate, zirconium dioxide, titanium dioxide, beryllium oxide, magnesium silicates, or various combinations thereof. Suitable binders for the ceramic particles include polyvinyl chloride polymers, polystyrene polymers, polymethyl methacrylate resins, ethyl cellulose, cellulose acetate polymers, polyester polymers, and cellulose acetatebutyrate polymers. The binder is preferably used together with a suitable solvent, and also a plasticizer, a wetting agent and/or a deflocculant to enhance the sheet-forming characteristics of the ceramic slurry. The conducting pattern may be formed on the sheets by screenprinting. The ceramic sheets may be formed by spraying the sheet formulation on to a support, or an incompatible liquid, or by doctor-blading.
GB1175370A 1969-03-11 1970-03-11 Circuit boards Expired GB1246784A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80625669A 1969-03-11 1969-03-11

Publications (1)

Publication Number Publication Date
GB1246784A true GB1246784A (en) 1971-09-22

Family

ID=25193668

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1175370A Expired GB1246784A (en) 1969-03-11 1970-03-11 Circuit boards

Country Status (5)

Country Link
BE (1) BE747168A (en)
DE (1) DE2011628A1 (en)
FR (1) FR2034818A1 (en)
GB (1) GB1246784A (en)
NL (1) NL7003372A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4470098A (en) * 1982-02-18 1984-09-04 Itt Industries, Inc. Multilayer ceramic dielectric capacitors
GB2212333A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Method of fabricating multi-layer circuits

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2964342D1 (en) * 1978-06-23 1983-01-27 Ibm Multi-layer dielectric substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4470098A (en) * 1982-02-18 1984-09-04 Itt Industries, Inc. Multilayer ceramic dielectric capacitors
GB2212333A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Method of fabricating multi-layer circuits

Also Published As

Publication number Publication date
FR2034818A1 (en) 1970-12-18
BE747168A (en) 1970-08-17
DE2011628A1 (en) 1970-09-24
NL7003372A (en) 1970-09-15

Similar Documents

Publication Publication Date Title
US3189978A (en) Method of making multilayer circuits
US3852877A (en) Multilayer circuits
EP0064872A3 (en) Ceramic wiring boards
ES8800867A1 (en) Process for producing multilayer ceramic circuit board with copper.
GB1246784A (en) Circuit boards
ES338549A1 (en) Improvements in and relating to Multilayer Circuit Structures
IL45512A0 (en) Ceramic capacitors and circuit boards and matrices therefor
JPS5821390A (en) Method of producing ceramic substrate
JPS6054148B2 (en) Processing method of unfired ceramic substrate
JPS55130197A (en) Method of fabricating printed circuit board
US3546776A (en) Process for manufacturing a ceramic multilayer circuit module
JP3495203B2 (en) Circuit board manufacturing method
JPS51124183A (en) Fire resistant, decorative wood boards
JPS526974A (en) Multilayered circuit board and manufacturing it
JPH0250494A (en) Manufacture of laminated ceramic substrate
CA1044300A (en) Gaseous breakdown display device and process for producing same
JPH04179194A (en) Ceramic green sheet and manufacture thereof
JPS5314369A (en) Method of checking stacking structure of multilayer printed circuit board
JPS62167Y2 (en)
JP2976088B2 (en) Surface mounting component having side electrode and method of manufacturing the same
JPH01239994A (en) Manufacture of ceramic multilayer substrate
Kuczynski A Note About So-Called" Activated" Sintering
JPS6243559B2 (en)
JPS529927A (en) Porous core sandwich board and its preparation method
JPS54146203A (en) Producing perforated plate made from processed and sintered metal foil