GB1234894A - Process for polishing the surface of semiconductor materials - Google Patents

Process for polishing the surface of semiconductor materials

Info

Publication number
GB1234894A
GB1234894A GB08372/69A GB1837269A GB1234894A GB 1234894 A GB1234894 A GB 1234894A GB 08372/69 A GB08372/69 A GB 08372/69A GB 1837269 A GB1837269 A GB 1837269A GB 1234894 A GB1234894 A GB 1234894A
Authority
GB
United Kingdom
Prior art keywords
polishing
solution
suspension
sio
discs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08372/69A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacker Chemie AG
Original Assignee
Wacker Chemie AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemie AG filed Critical Wacker Chemie AG
Publication of GB1234894A publication Critical patent/GB1234894A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
GB08372/69A 1968-04-11 1969-04-10 Process for polishing the surface of semiconductor materials Expired GB1234894A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681752163 DE1752163A1 (de) 1968-04-11 1968-04-11 Verfahren zum Polieren von Halbleiteroberflaechen

Publications (1)

Publication Number Publication Date
GB1234894A true GB1234894A (en) 1971-06-09

Family

ID=5692658

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08372/69A Expired GB1234894A (en) 1968-04-11 1969-04-10 Process for polishing the surface of semiconductor materials

Country Status (6)

Country Link
US (1) US3877183A (enExample)
BE (1) BE731353A (enExample)
CH (1) CH505466A (enExample)
DE (1) DE1752163A1 (enExample)
FR (1) FR2006054A1 (enExample)
GB (1) GB1234894A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008080096A3 (en) * 2006-12-21 2008-11-06 Advanced Tech Materials Compositions and methods for the selective removal of silicon nitride

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2531431C3 (de) * 1975-07-14 1979-03-01 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen Poliermittel zur Herstellung schleierfreier Halbleiteroberflächen
DE2538855A1 (de) * 1975-09-01 1977-03-10 Wacker Chemitronic Verfahren zur herstellung von schleierfreien halbleiteroberflaechen, insbesondere schleierfreien oberflaechen von (111)-orientiertem galliumarsenid
FR2327036A1 (fr) * 1975-10-08 1977-05-06 Du Pont Procede de polissage de materiaux semi-conducteurs de germanium et de silicium
JPS55113700A (en) * 1979-02-19 1980-09-02 Fujimi Kenmazai Kogyo Kk Polishing method for gadolinium gallium garnet single crystal
JPS5935429A (ja) * 1982-08-12 1984-02-27 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 半導体ウエハの製造方法
DE3237235C2 (de) * 1982-10-07 1986-07-10 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum Polieren von III-V-Halbleiteroberflächen
US4588421A (en) * 1984-10-15 1986-05-13 Nalco Chemical Company Aqueous silica compositions for polishing silicon wafers
US5993685A (en) * 1997-04-02 1999-11-30 Advanced Technology Materials Planarization composition for removing metal films
US6319095B1 (en) * 2000-03-09 2001-11-20 Agere Systems Guardian Corp. Colloidal suspension of abrasive particles containing magnesium as CMP slurry
EP2799185B1 (en) * 2011-12-27 2017-02-01 Konica Minolta, Inc. Method for separating polishing material and regenerated polishing material
CN111253910B (zh) * 2020-03-18 2021-07-16 昆山捷纳电子材料有限公司 一种无机聚电解质-氧化硅复合抛光磨粒的制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2275049A (en) * 1942-03-03 Polish
US2375825A (en) * 1941-10-16 1945-05-15 Interchem Corp Polishing compositions
US2375823A (en) * 1941-10-16 1945-05-15 Interchem Corp Polishing composition
US2399237A (en) * 1942-12-15 1946-04-30 William T Maloney Polishing material and process of preparing same
US2955030A (en) * 1959-02-25 1960-10-04 Nat Lead Co Polishing compositions
US3170273A (en) * 1963-01-10 1965-02-23 Monsanto Co Process for polishing semiconductor materials
US3527028A (en) * 1967-09-26 1970-09-08 Bell Telephone Labor Inc Preparation of semiconductor surfaces
US3647381A (en) * 1968-04-08 1972-03-07 Gabriel Reiter Dental-prophylaxis composition
US3541017A (en) * 1969-02-04 1970-11-17 Indiana University Foundation Denture cleanser preparations comprising zirconium silicate and zirconium dioxide
US3754941A (en) * 1971-01-04 1973-08-28 Colgate Palmolive Co Removal of metallic stains from porcelain surfaces

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008080096A3 (en) * 2006-12-21 2008-11-06 Advanced Tech Materials Compositions and methods for the selective removal of silicon nitride
US8778210B2 (en) 2006-12-21 2014-07-15 Advanced Technology Materials, Inc. Compositions and methods for the selective removal of silicon nitride
US9158203B2 (en) 2006-12-21 2015-10-13 Advanced Technology Materials, Inc. Compositions and methods for the selective removal of silicon nitride
TWI509690B (zh) * 2006-12-21 2015-11-21 恩特葛瑞斯股份有限公司 選擇性移除氮化矽之組合物及方法
US9691629B2 (en) 2006-12-21 2017-06-27 Entegris, Inc. Compositions and methods for the selective removal of silicon nitride

Also Published As

Publication number Publication date
DE1752163A1 (de) 1971-05-13
DE1752163C3 (enExample) 1975-03-20
BE731353A (enExample) 1969-10-10
DE1752163B2 (enExample) 1974-07-25
FR2006054A1 (enExample) 1969-12-19
CH505466A (de) 1971-03-31
US3877183A (en) 1975-04-15

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