GB1231042A - - Google Patents

Info

Publication number
GB1231042A
GB1231042A GB3830568A GB1231042DA GB1231042A GB 1231042 A GB1231042 A GB 1231042A GB 3830568 A GB3830568 A GB 3830568A GB 1231042D A GB1231042D A GB 1231042DA GB 1231042 A GB1231042 A GB 1231042A
Authority
GB
United Kingdom
Prior art keywords
bonding pad
bonding
aug
lead
ballbonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3830568A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1231042A publication Critical patent/GB1231042A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/482—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors
    • H10W20/484—Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

Landscapes

  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
GB3830568A 1966-05-28 1968-08-10 Expired GB1231042A (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4967166 1966-05-28
GB3830568 1968-08-10

Publications (1)

Publication Number Publication Date
GB1231042A true GB1231042A (enExample) 1971-05-05

Family

ID=26263764

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3830568A Expired GB1231042A (enExample) 1966-05-28 1968-08-10

Country Status (3)

Country Link
US (1) US3450965A (enExample)
GB (1) GB1231042A (enExample)
NL (1) NL6911934A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2158230A1 (enExample) * 1971-11-03 1973-06-15 Ibm
FR2319975A1 (fr) * 1975-08-01 1977-02-25 Siemens Ag Plage de contact a faible capacite, notamment pour un composant a semi-conducteurs
FR2358749A1 (fr) * 1976-07-15 1978-02-10 Itt Dispositif semi-conducteur planaire a surfaces de contact discontinues
US4223337A (en) * 1977-09-16 1980-09-16 Nippon Electric Co., Ltd. Semiconductor integrated circuit with electrode pad suited for a characteristic testing
EP0028823A1 (de) * 1979-11-12 1981-05-20 Siemens Aktiengesellschaft Elektrisch leitende Verbindung der aktiven Teile eines elektrischen Bauelements oder einer integrierten Schaltung mit Anschlusspunkten
US4536786A (en) * 1976-08-23 1985-08-20 Sharp Kabushiki Kaisha Lead electrode connection in a semiconductor device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3546543A (en) * 1968-08-30 1970-12-08 Nat Beryllia Corp Hermetically sealed electronic package for semiconductor devices with high current carrying conductors
US3766448A (en) * 1972-02-04 1973-10-16 Gen Instrument Corp Integrated igfet circuits with increased inversion voltage under metallization runs
US4023053A (en) * 1974-12-16 1977-05-10 Tokyo Shibaura Electric Co., Ltd. Variable capacity diode device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2680220A (en) * 1950-06-09 1954-06-01 Int Standard Electric Corp Crystal diode and triode
US3356858A (en) * 1963-06-18 1967-12-05 Fairchild Camera Instr Co Low stand-by power complementary field effect circuitry
US3379584A (en) * 1964-09-04 1968-04-23 Texas Instruments Inc Semiconductor wafer with at least one epitaxial layer and methods of making same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2158230A1 (enExample) * 1971-11-03 1973-06-15 Ibm
FR2319975A1 (fr) * 1975-08-01 1977-02-25 Siemens Ag Plage de contact a faible capacite, notamment pour un composant a semi-conducteurs
FR2358749A1 (fr) * 1976-07-15 1978-02-10 Itt Dispositif semi-conducteur planaire a surfaces de contact discontinues
US4536786A (en) * 1976-08-23 1985-08-20 Sharp Kabushiki Kaisha Lead electrode connection in a semiconductor device
US4223337A (en) * 1977-09-16 1980-09-16 Nippon Electric Co., Ltd. Semiconductor integrated circuit with electrode pad suited for a characteristic testing
EP0028823A1 (de) * 1979-11-12 1981-05-20 Siemens Aktiengesellschaft Elektrisch leitende Verbindung der aktiven Teile eines elektrischen Bauelements oder einer integrierten Schaltung mit Anschlusspunkten

Also Published As

Publication number Publication date
NL6911934A (enExample) 1970-02-12
US3450965A (en) 1969-06-17

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees