GB1228693A - - Google Patents

Info

Publication number
GB1228693A
GB1228693A GB1228693DA GB1228693A GB 1228693 A GB1228693 A GB 1228693A GB 1228693D A GB1228693D A GB 1228693DA GB 1228693 A GB1228693 A GB 1228693A
Authority
GB
United Kingdom
Prior art keywords
etchant
hydrogen
methylurea
ditolylthiourea
phenylurea
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1228693A publication Critical patent/GB1228693A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

1,228,693. Etching. ALLIED CHEMICAL CORP. 27 March, 1969 [9 Aug., 1968], No. 16215/69. Addition to 1,160,314. Heading B6J. An etchant for copper, iron, nickel, cadmium, zinc, germanium, lead, steel aluminium or an alloy of any of these, comprises an acidified aqueous hydrogen peroxide solution containing a catalytic amount (20-2000 p.p.m.) of an additive having the structure: wherein X is oxygen or sulphur and each of R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP> and R<SP>4</SP> is hydrogen, a non-aromatic hydrocarbon radical, an acyl group or a mono- or di-nuclear aromatic hydrocarbon radical whose aromatic ring is linked to the nitrogen atom directly or through an alkylene or a carbonyl group, the hydrocarbon radicals containing up to 18 carbon atoms, at least one of R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP> and R<SP>4</SP> being a radical other than hydrogen and, when X is oxygen and one or two of R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP> and R<SP>4</SP> are unsubstituted phenyl, the remainder being not all or both hydrogen. The additive may be methylurea, ethylurea, butylurea cyclohexylurea, dimethylurea, diethylurea, trimethylurea, tetramethylurea, allylurea, malonylurea, acetylurea, diacetylurea, benzoylurea, N - acetyl - N<SP>1</SP> - methylurea, acetonylurea, triphenylurea, tetraphenylurea, tolylurea, chlorophenylurea, phenetylurea, benzylurea, dibenzylurea, N - alkyl - N<SP>1</SP>- phenylurea, N-ethyl-N<SP>1</SP>-phenylurea, carbonilide, N,N<SP>1</SP> - dimethylcarbanilide, N,N<SP>1</SP> - diethylcarbanilide, methylthiourea, diethylthiourea, acetylthiourea, allylthiourea, phenylthiourea, diphenylthiourea, ditolylthiourea, benzylthiourea, N - methyl - ditolylthiourea naphthylthiourea, 1 - acetyl - 3 - methylurea and pchlorophenylurea. The acidifying acid may be sulphuric, nitric or fluoboric. Sulphathiazole, phenacetin, silver ions and water-soluble silver salts may also be present. The etchant may be prepared by acidifying and diluting a concentrate comprising an aqueous solution containing 20-70% by weight of hydrogen peroxide and 200-20,000 p.p.m. of at least one of the abovementioned additives. The etchant is particularly suitable for the production of printed circuits from copper-surfaced laminates. The etchant may also be used for chemical milling, graining, bright dipping or polishing.
GB1228693D 1968-08-09 1969-03-27 Expired GB1228693A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US75138868A 1968-08-09 1968-08-09

Publications (1)

Publication Number Publication Date
GB1228693A true GB1228693A (en) 1971-04-15

Family

ID=25021760

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1228693D Expired GB1228693A (en) 1968-08-09 1969-03-27

Country Status (4)

Country Link
US (1) US3668131A (en)
DE (1) DE1919820A1 (en)
FR (1) FR2019333A1 (en)
GB (1) GB1228693A (en)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
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US4174253A (en) * 1977-11-08 1979-11-13 Dart Industries Inc. Dissolution of metals utilizing a H2 O2 -H2 SO4 solution catalyzed with hydroxy substituted cycloparaffins
US4220706A (en) * 1978-05-10 1980-09-02 Rca Corporation Etchant solution containing HF-HnO3 -H2 SO4 -H2 O2
US4225350A (en) * 1979-06-04 1980-09-30 Dart Industries Inc. Non-chromate conversion coatings
US4225351A (en) * 1979-06-04 1980-09-30 Dart Industries Inc. Non-chromate conversion coatings
US4222779A (en) * 1979-06-04 1980-09-16 Dart Industries Inc. Non-chromate conversion coatings
US4233113A (en) * 1979-06-25 1980-11-11 Dart Industries Inc. Dissolution of metals utilizing an aqueous H2 O2 -H2 SO4 -thioamide etchant
US4233112A (en) * 1979-06-25 1980-11-11 Dart Industries Inc. Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -polysulfide etchant
US4233111A (en) * 1979-06-25 1980-11-11 Dart Industries Inc. Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -3-sulfopropyldithiocarbamate etchant
US4236957A (en) * 1979-06-25 1980-12-02 Dart Industries Inc. Dissolution of metals utilizing an aqueous H2 SOY --H2 O.sub. -mercapto containing heterocyclic nitrogen etchant
US4351675A (en) * 1981-03-02 1982-09-28 Rohco, Inc. Conversion coatings for zinc and cadmium surfaces
US4370197A (en) * 1981-06-24 1983-01-25 International Business Machines Corporation Process for etching chrome
US4401509A (en) * 1982-09-07 1983-08-30 Fmc Corporation Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide
US4636282A (en) * 1985-06-20 1987-01-13 Great Lakes Chemical Corporation Method for etching copper and composition useful therein
EP0265578A1 (en) * 1986-10-30 1988-05-04 Jan-Olof Eriksson A non-abrasive polish or cleaning composition and process for its preparation
US4859281A (en) * 1987-06-04 1989-08-22 Pennwalt Corporation Etching of copper and copper bearing alloys
CH682023A5 (en) * 1990-10-26 1993-06-30 Recytec Sa
GB9425090D0 (en) * 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating
US20040140288A1 (en) * 1996-07-25 2004-07-22 Bakul Patel Wet etch of titanium-tungsten film
US6117783A (en) 1996-07-25 2000-09-12 Ekc Technology, Inc. Chemical mechanical polishing composition and process
US20040134873A1 (en) * 1996-07-25 2004-07-15 Li Yao Abrasive-free chemical mechanical polishing composition and polishing process containing same
US5783489A (en) * 1996-09-24 1998-07-21 Cabot Corporation Multi-oxidizer slurry for chemical mechanical polishing
US6033596A (en) * 1996-09-24 2000-03-07 Cabot Corporation Multi-oxidizer slurry for chemical mechanical polishing
US6039891A (en) 1996-09-24 2000-03-21 Cabot Corporation Multi-oxidizer precursor for chemical mechanical polishing
US6068787A (en) * 1996-11-26 2000-05-30 Cabot Corporation Composition and slurry useful for metal CMP
US5958288A (en) * 1996-11-26 1999-09-28 Cabot Corporation Composition and slurry useful for metal CMP
US6126853A (en) * 1996-12-09 2000-10-03 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
US5954997A (en) 1996-12-09 1999-09-21 Cabot Corporation Chemical mechanical polishing slurry useful for copper substrates
US6309560B1 (en) 1996-12-09 2001-10-30 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
US6083419A (en) * 1997-07-28 2000-07-04 Cabot Corporation Polishing composition including an inhibitor of tungsten etching
US6284309B1 (en) 1997-12-19 2001-09-04 Atotech Deutschland Gmbh Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
US6435947B2 (en) 1998-05-26 2002-08-20 Cabot Microelectronics Corporation CMP polishing pad including a solid catalyst
US6177026B1 (en) 1998-05-26 2001-01-23 Cabot Microelectronics Corporation CMP slurry containing a solid catalyst
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6444140B2 (en) 1999-03-17 2002-09-03 Morton International Inc. Micro-etch solution for producing metal surface topography
WO2001053559A1 (en) * 2000-01-24 2001-07-26 Smart Therapeutics, Inc. Thin-film shape memory alloy device and method
US20040099637A1 (en) * 2000-06-16 2004-05-27 Shipley Company, L.L.C. Composition for producing metal surface topography
US20030178391A1 (en) * 2000-06-16 2003-09-25 Shipley Company, L.L.C. Composition for producing metal surface topography
JP3930885B2 (en) * 2000-12-27 2007-06-13 荏原ユージライト株式会社 Microetching agents for copper and copper alloys
JP3930732B2 (en) * 2000-12-27 2007-06-13 荏原ユージライト株式会社 MICRO ETCHING AGENT FOR COPPER AND COPPER ALLOY AND METHOD OF FINE Roughening of COPPER OR COPPER ALLOY USING THE SAME
JP3932193B2 (en) * 2000-12-27 2007-06-20 荏原ユージライト株式会社 MICRO ETCHING AGENT FOR COPPER AND COPPER ALLOY AND METHOD OF FINE Roughening of COPPER OR COPPER ALLOY USING THE SAME
US6383065B1 (en) 2001-01-22 2002-05-07 Cabot Microelectronics Corporation Catalytic reactive pad for metal CMP
US6841084B2 (en) * 2002-02-11 2005-01-11 Nikko Materials Usa, Inc. Etching solution for forming an embedded resistor
JP2006199888A (en) * 2005-01-24 2006-08-03 Seiko Epson Corp Aqueous ink composition, ink jet recording method using the same, and recorded matter
US8584767B2 (en) * 2007-01-25 2013-11-19 Tini Alloy Company Sprinkler valve with active actuation
WO2008092028A1 (en) * 2007-01-25 2008-07-31 Tini Alloy Company Frangible shape memory alloy fire sprinkler valve actuator
US8007674B2 (en) 2007-07-30 2011-08-30 Tini Alloy Company Method and devices for preventing restenosis in cardiovascular stents
US8303832B2 (en) * 2009-08-17 2012-11-06 Palo Alto Research Center Incorporated Solid inks for masks for printed circuit boards and other electronic devices
US8211617B2 (en) * 2009-08-17 2012-07-03 Palo Alto Research Center Incorporated Solid inks for printed masks
US8858755B2 (en) 2011-08-26 2014-10-14 Tel Nexx, Inc. Edge bevel removal apparatus and method
CN103184523B (en) * 2011-12-27 2016-01-27 中建材浚鑫科技股份有限公司 The preparation method of a kind of silicon single crystal Wool-making agent and textured mono-crystalline silicon
US11040230B2 (en) 2012-08-31 2021-06-22 Tini Alloy Company Fire sprinkler valve actuator
US10124197B2 (en) 2012-08-31 2018-11-13 TiNi Allot Company Fire sprinkler valve actuator
CN112831658B (en) * 2019-11-25 2023-08-22 荆门格林循环电子废弃物处置有限公司 Recovery method of gold in waste circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2894986A (en) * 1956-07-23 1959-07-14 Monsanto Chemicals Diphenyl urea derivatives
DE1155432B (en) * 1960-02-27 1963-10-10 Dehydag Gmbh Process for the preparation of thiourea pellets
NL279497A (en) * 1961-06-08
US3074825A (en) * 1962-04-03 1963-01-22 Chemical Cleaning Inc Method of removing copper-containing iron oxide incrustations from ferriferous surfaces
DE1255443B (en) * 1964-08-22 1967-11-30 Degussa Process for chemical etching of printed circuits
US3407141A (en) * 1966-02-03 1968-10-22 Allied Chem Dissolution of metal with acidified hydrogen peroxide solutions

Also Published As

Publication number Publication date
FR2019333A1 (en) 1970-07-03
US3668131A (en) 1972-06-06
DE1919820A1 (en) 1970-06-25

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees