GB1228693A - - Google Patents
Info
- Publication number
- GB1228693A GB1228693A GB1228693DA GB1228693A GB 1228693 A GB1228693 A GB 1228693A GB 1228693D A GB1228693D A GB 1228693DA GB 1228693 A GB1228693 A GB 1228693A
- Authority
- GB
- United Kingdom
- Prior art keywords
- etchant
- hydrogen
- methylurea
- ditolylthiourea
- phenylurea
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
1,228,693. Etching. ALLIED CHEMICAL CORP. 27 March, 1969 [9 Aug., 1968], No. 16215/69. Addition to 1,160,314. Heading B6J. An etchant for copper, iron, nickel, cadmium, zinc, germanium, lead, steel aluminium or an alloy of any of these, comprises an acidified aqueous hydrogen peroxide solution containing a catalytic amount (20-2000 p.p.m.) of an additive having the structure: wherein X is oxygen or sulphur and each of R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP> and R<SP>4</SP> is hydrogen, a non-aromatic hydrocarbon radical, an acyl group or a mono- or di-nuclear aromatic hydrocarbon radical whose aromatic ring is linked to the nitrogen atom directly or through an alkylene or a carbonyl group, the hydrocarbon radicals containing up to 18 carbon atoms, at least one of R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP> and R<SP>4</SP> being a radical other than hydrogen and, when X is oxygen and one or two of R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP> and R<SP>4</SP> are unsubstituted phenyl, the remainder being not all or both hydrogen. The additive may be methylurea, ethylurea, butylurea cyclohexylurea, dimethylurea, diethylurea, trimethylurea, tetramethylurea, allylurea, malonylurea, acetylurea, diacetylurea, benzoylurea, N - acetyl - N<SP>1</SP> - methylurea, acetonylurea, triphenylurea, tetraphenylurea, tolylurea, chlorophenylurea, phenetylurea, benzylurea, dibenzylurea, N - alkyl - N<SP>1</SP>- phenylurea, N-ethyl-N<SP>1</SP>-phenylurea, carbonilide, N,N<SP>1</SP> - dimethylcarbanilide, N,N<SP>1</SP> - diethylcarbanilide, methylthiourea, diethylthiourea, acetylthiourea, allylthiourea, phenylthiourea, diphenylthiourea, ditolylthiourea, benzylthiourea, N - methyl - ditolylthiourea naphthylthiourea, 1 - acetyl - 3 - methylurea and pchlorophenylurea. The acidifying acid may be sulphuric, nitric or fluoboric. Sulphathiazole, phenacetin, silver ions and water-soluble silver salts may also be present. The etchant may be prepared by acidifying and diluting a concentrate comprising an aqueous solution containing 20-70% by weight of hydrogen peroxide and 200-20,000 p.p.m. of at least one of the abovementioned additives. The etchant is particularly suitable for the production of printed circuits from copper-surfaced laminates. The etchant may also be used for chemical milling, graining, bright dipping or polishing.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US75138868A | 1968-08-09 | 1968-08-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1228693A true GB1228693A (en) | 1971-04-15 |
Family
ID=25021760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1228693D Expired GB1228693A (en) | 1968-08-09 | 1969-03-27 |
Country Status (4)
Country | Link |
---|---|
US (1) | US3668131A (en) |
DE (1) | DE1919820A1 (en) |
FR (1) | FR2019333A1 (en) |
GB (1) | GB1228693A (en) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4174253A (en) * | 1977-11-08 | 1979-11-13 | Dart Industries Inc. | Dissolution of metals utilizing a H2 O2 -H2 SO4 solution catalyzed with hydroxy substituted cycloparaffins |
US4220706A (en) * | 1978-05-10 | 1980-09-02 | Rca Corporation | Etchant solution containing HF-HnO3 -H2 SO4 -H2 O2 |
US4225350A (en) * | 1979-06-04 | 1980-09-30 | Dart Industries Inc. | Non-chromate conversion coatings |
US4225351A (en) * | 1979-06-04 | 1980-09-30 | Dart Industries Inc. | Non-chromate conversion coatings |
US4222779A (en) * | 1979-06-04 | 1980-09-16 | Dart Industries Inc. | Non-chromate conversion coatings |
US4233113A (en) * | 1979-06-25 | 1980-11-11 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 O2 -H2 SO4 -thioamide etchant |
US4233112A (en) * | 1979-06-25 | 1980-11-11 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -polysulfide etchant |
US4233111A (en) * | 1979-06-25 | 1980-11-11 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -3-sulfopropyldithiocarbamate etchant |
US4236957A (en) * | 1979-06-25 | 1980-12-02 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 SOY --H2 O.sub. -mercapto containing heterocyclic nitrogen etchant |
US4351675A (en) * | 1981-03-02 | 1982-09-28 | Rohco, Inc. | Conversion coatings for zinc and cadmium surfaces |
US4370197A (en) * | 1981-06-24 | 1983-01-25 | International Business Machines Corporation | Process for etching chrome |
US4401509A (en) * | 1982-09-07 | 1983-08-30 | Fmc Corporation | Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide |
US4636282A (en) * | 1985-06-20 | 1987-01-13 | Great Lakes Chemical Corporation | Method for etching copper and composition useful therein |
EP0265578A1 (en) * | 1986-10-30 | 1988-05-04 | Jan-Olof Eriksson | A non-abrasive polish or cleaning composition and process for its preparation |
US4859281A (en) * | 1987-06-04 | 1989-08-22 | Pennwalt Corporation | Etching of copper and copper bearing alloys |
CH682023A5 (en) * | 1990-10-26 | 1993-06-30 | Recytec Sa | |
GB9425090D0 (en) * | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
US20040140288A1 (en) * | 1996-07-25 | 2004-07-22 | Bakul Patel | Wet etch of titanium-tungsten film |
US6117783A (en) | 1996-07-25 | 2000-09-12 | Ekc Technology, Inc. | Chemical mechanical polishing composition and process |
US20040134873A1 (en) * | 1996-07-25 | 2004-07-15 | Li Yao | Abrasive-free chemical mechanical polishing composition and polishing process containing same |
US5783489A (en) * | 1996-09-24 | 1998-07-21 | Cabot Corporation | Multi-oxidizer slurry for chemical mechanical polishing |
US6033596A (en) * | 1996-09-24 | 2000-03-07 | Cabot Corporation | Multi-oxidizer slurry for chemical mechanical polishing |
US6039891A (en) | 1996-09-24 | 2000-03-21 | Cabot Corporation | Multi-oxidizer precursor for chemical mechanical polishing |
US6068787A (en) * | 1996-11-26 | 2000-05-30 | Cabot Corporation | Composition and slurry useful for metal CMP |
US5958288A (en) * | 1996-11-26 | 1999-09-28 | Cabot Corporation | Composition and slurry useful for metal CMP |
US6126853A (en) * | 1996-12-09 | 2000-10-03 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US5954997A (en) | 1996-12-09 | 1999-09-21 | Cabot Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US6309560B1 (en) | 1996-12-09 | 2001-10-30 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US6083419A (en) * | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
US6284309B1 (en) | 1997-12-19 | 2001-09-04 | Atotech Deutschland Gmbh | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
US6435947B2 (en) | 1998-05-26 | 2002-08-20 | Cabot Microelectronics Corporation | CMP polishing pad including a solid catalyst |
US6177026B1 (en) | 1998-05-26 | 2001-01-23 | Cabot Microelectronics Corporation | CMP slurry containing a solid catalyst |
US6117250A (en) * | 1999-02-25 | 2000-09-12 | Morton International Inc. | Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions |
US6444140B2 (en) | 1999-03-17 | 2002-09-03 | Morton International Inc. | Micro-etch solution for producing metal surface topography |
WO2001053559A1 (en) * | 2000-01-24 | 2001-07-26 | Smart Therapeutics, Inc. | Thin-film shape memory alloy device and method |
US20040099637A1 (en) * | 2000-06-16 | 2004-05-27 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
US20030178391A1 (en) * | 2000-06-16 | 2003-09-25 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
JP3930885B2 (en) * | 2000-12-27 | 2007-06-13 | 荏原ユージライト株式会社 | Microetching agents for copper and copper alloys |
JP3930732B2 (en) * | 2000-12-27 | 2007-06-13 | 荏原ユージライト株式会社 | MICRO ETCHING AGENT FOR COPPER AND COPPER ALLOY AND METHOD OF FINE Roughening of COPPER OR COPPER ALLOY USING THE SAME |
JP3932193B2 (en) * | 2000-12-27 | 2007-06-20 | 荏原ユージライト株式会社 | MICRO ETCHING AGENT FOR COPPER AND COPPER ALLOY AND METHOD OF FINE Roughening of COPPER OR COPPER ALLOY USING THE SAME |
US6383065B1 (en) | 2001-01-22 | 2002-05-07 | Cabot Microelectronics Corporation | Catalytic reactive pad for metal CMP |
US6841084B2 (en) * | 2002-02-11 | 2005-01-11 | Nikko Materials Usa, Inc. | Etching solution for forming an embedded resistor |
JP2006199888A (en) * | 2005-01-24 | 2006-08-03 | Seiko Epson Corp | Aqueous ink composition, ink jet recording method using the same, and recorded matter |
US8584767B2 (en) * | 2007-01-25 | 2013-11-19 | Tini Alloy Company | Sprinkler valve with active actuation |
WO2008092028A1 (en) * | 2007-01-25 | 2008-07-31 | Tini Alloy Company | Frangible shape memory alloy fire sprinkler valve actuator |
US8007674B2 (en) | 2007-07-30 | 2011-08-30 | Tini Alloy Company | Method and devices for preventing restenosis in cardiovascular stents |
US8303832B2 (en) * | 2009-08-17 | 2012-11-06 | Palo Alto Research Center Incorporated | Solid inks for masks for printed circuit boards and other electronic devices |
US8211617B2 (en) * | 2009-08-17 | 2012-07-03 | Palo Alto Research Center Incorporated | Solid inks for printed masks |
US8858755B2 (en) | 2011-08-26 | 2014-10-14 | Tel Nexx, Inc. | Edge bevel removal apparatus and method |
CN103184523B (en) * | 2011-12-27 | 2016-01-27 | 中建材浚鑫科技股份有限公司 | The preparation method of a kind of silicon single crystal Wool-making agent and textured mono-crystalline silicon |
US11040230B2 (en) | 2012-08-31 | 2021-06-22 | Tini Alloy Company | Fire sprinkler valve actuator |
US10124197B2 (en) | 2012-08-31 | 2018-11-13 | TiNi Allot Company | Fire sprinkler valve actuator |
CN112831658B (en) * | 2019-11-25 | 2023-08-22 | 荆门格林循环电子废弃物处置有限公司 | Recovery method of gold in waste circuit board |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2894986A (en) * | 1956-07-23 | 1959-07-14 | Monsanto Chemicals | Diphenyl urea derivatives |
DE1155432B (en) * | 1960-02-27 | 1963-10-10 | Dehydag Gmbh | Process for the preparation of thiourea pellets |
NL279497A (en) * | 1961-06-08 | |||
US3074825A (en) * | 1962-04-03 | 1963-01-22 | Chemical Cleaning Inc | Method of removing copper-containing iron oxide incrustations from ferriferous surfaces |
DE1255443B (en) * | 1964-08-22 | 1967-11-30 | Degussa | Process for chemical etching of printed circuits |
US3407141A (en) * | 1966-02-03 | 1968-10-22 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide solutions |
-
1968
- 1968-08-09 US US751388A patent/US3668131A/en not_active Expired - Lifetime
-
1969
- 1969-03-27 GB GB1228693D patent/GB1228693A/en not_active Expired
- 1969-04-18 DE DE19691919820 patent/DE1919820A1/en active Pending
- 1969-05-07 FR FR6914659A patent/FR2019333A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
FR2019333A1 (en) | 1970-07-03 |
US3668131A (en) | 1972-06-06 |
DE1919820A1 (en) | 1970-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PLNP | Patent lapsed through nonpayment of renewal fees |