GB1228651A - - Google Patents

Info

Publication number
GB1228651A
GB1228651A GB1228651DA GB1228651A GB 1228651 A GB1228651 A GB 1228651A GB 1228651D A GB1228651D A GB 1228651DA GB 1228651 A GB1228651 A GB 1228651A
Authority
GB
United Kingdom
Prior art keywords
holes
plates
pack
metal
stacking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1228651A publication Critical patent/GB1228651A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1,228,651. Printed circuits. TELEFUNKEN PATENT VERWERTUNGS G.m.b.H. 18 June, 1968 [28 June, 1967], No. 28876/68. Heading H1R. A method of manufacturing a multilayer printed circuit board having at least four layers of printed circuitry comprises the steps of: making similar holes in corresponding positions in a plurality of insulating support plates 1 having metal-clad surfaces; depositing metal on the surfaces of the holes to line the holes; forming required printed circuits in the metalclad surfaces which when the pack is assembled form internal surfaces of the pack; applying adhesive layers 11 to the surfaces of the plates 1, stacking the plates 1 so that the holes therein are aligned and allowing the adhesive to set; removing any surplus adhesive 12 from the holes; depositing another coating of metal on the surfaces of the aligned holes over the original lining to form a through connection through the pack; and forming required circuit patterns from the two metal clad surfaces constituting the outer surfaces of the pack. Each support plate 1 is made of larger dimensions than the finished article so as to leave a margin and after stacking the plates guide holes are drilled simultaneously through all the margins of the stack. The plates are thus held in register by guide pins passing through the guide holes during drilling of the holes to be plated through the pack. The plates are then disassembled for the plating through and formation of the printed circuits. A mounting jig having pins 7 is then employed for the permanent stacking and insulating sheets 8 may be inserted between neighbouring plates. The circuit patterns may be reinforced by an electroless deposition of tin.
GB1228651D 1967-06-28 1968-06-18 Expired GB1228651A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DET0034206 1967-06-28

Publications (1)

Publication Number Publication Date
GB1228651A true GB1228651A (en) 1971-04-15

Family

ID=7558340

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1228651D Expired GB1228651A (en) 1967-06-28 1968-06-18

Country Status (2)

Country Link
DE (1) DE1690274A1 (en)
GB (1) GB1228651A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2250866A (en) * 1990-11-27 1992-06-17 Mitsubishi Electric Corp Method of coating solder on a printed circuit
EP1265467A3 (en) * 2001-06-07 2004-10-27 Ngk Insulators, Ltd. Multilayer board having precise perforations and circuit substrate having precise through-holes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2250866A (en) * 1990-11-27 1992-06-17 Mitsubishi Electric Corp Method of coating solder on a printed circuit
EP1265467A3 (en) * 2001-06-07 2004-10-27 Ngk Insulators, Ltd. Multilayer board having precise perforations and circuit substrate having precise through-holes
US6894888B2 (en) 2001-06-07 2005-05-17 Ngk Insulators, Ltd. Multilayer board having precise perforations and circuit substrate having precise through-holes

Also Published As

Publication number Publication date
DE1690274A1 (en) 1971-05-13

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees