GB1225860A - - Google Patents

Info

Publication number
GB1225860A
GB1225860A GB1225860DA GB1225860A GB 1225860 A GB1225860 A GB 1225860A GB 1225860D A GB1225860D A GB 1225860DA GB 1225860 A GB1225860 A GB 1225860A
Authority
GB
United Kingdom
Prior art keywords
polyamide
sept
aqueous solution
copper ion
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1225860A publication Critical patent/GB1225860A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)

Abstract

1,225,860. Stabilized polyamides. ALLIED CHEMICAL CORP. 26 Sept., 1968 [28 Sept., 1967], No. 45871/68. Heading C3R. A polyamide is heat stabilized by addition of 30-300 p.p.m. of copper ion, 0À05-0À4% HI or NH 4 I and 0À05-2% KI. The polyamide may be prepared from a diamine-dicarboxylic acid salt or a C 6-12 lactam, e.g. epsilon caprolactam. The copper ion and NH 4 I or HI may be added in aqueous solution to the polyamide forming reactants before or during polymerization. The copper may be CuCl 2 . The polyamide may be impregnated with an aqueous solution of KI.
GB1225860D 1967-09-28 1968-09-26 Expired GB1225860A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US67268167A 1967-09-28 1967-09-28

Publications (1)

Publication Number Publication Date
GB1225860A true GB1225860A (en) 1971-03-24

Family

ID=24699570

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1225860D Expired GB1225860A (en) 1967-09-28 1968-09-26

Country Status (5)

Country Link
BE (1) BE721457A (en)
DE (1) DE1794227A1 (en)
FR (1) FR1581934A (en)
GB (1) GB1225860A (en)
NL (1) NL6813863A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006074912A1 (en) * 2005-01-12 2006-07-20 Dsm Ip Assets B.V. Heat stabilized moulding composition
JP2008530290A (en) * 2005-02-08 2008-08-07 ビーエーエスエフ ソシエタス・ヨーロピア Heat aging polyamide
US8772394B2 (en) 2005-01-17 2014-07-08 Dsm Ip Assets B.V. Heat stabilized moulding composition
CN111912801A (en) * 2020-08-21 2020-11-10 平顶山神马工程塑料有限责任公司 Method for measuring copper ion content in polyamide slice

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0063687A3 (en) * 1981-04-24 1983-04-13 Allied Corporation Nylon composition for use in rotational molding
DE4305166A1 (en) * 1993-02-19 1994-08-25 Bayer Ag Thermostable copper-containing polyamide molding compounds

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006074912A1 (en) * 2005-01-12 2006-07-20 Dsm Ip Assets B.V. Heat stabilized moulding composition
EA012906B1 (en) * 2005-01-12 2010-02-26 ДСМ АйПи АССЕТС Б.В. Thermoplastic moulding compositions, use thereof, process for making moulded part and a part
CN101103067B (en) * 2005-01-12 2012-07-04 帝斯曼知识产权资产管理有限公司 Heat stabilized moulding composition
US8772397B2 (en) 2005-01-12 2014-07-08 Dsm Ip Assets B.V. Heat stabilized moulding composition
US8975325B2 (en) 2005-01-12 2015-03-10 Dsm Ip Assets B.V. Heat stabilized moulding composition
US8772394B2 (en) 2005-01-17 2014-07-08 Dsm Ip Assets B.V. Heat stabilized moulding composition
US8969460B2 (en) 2005-01-17 2015-03-03 Dsm Ip Assets B.V. Heat stabilized moulding composition
JP2008530290A (en) * 2005-02-08 2008-08-07 ビーエーエスエフ ソシエタス・ヨーロピア Heat aging polyamide
CN111912801A (en) * 2020-08-21 2020-11-10 平顶山神马工程塑料有限责任公司 Method for measuring copper ion content in polyamide slice
CN111912801B (en) * 2020-08-21 2023-02-24 平顶山神马工程塑料有限责任公司 Method for measuring copper ion content in polyamide slice

Also Published As

Publication number Publication date
FR1581934A (en) 1969-09-19
DE1794227A1 (en) 1971-11-18
BE721457A (en) 1969-03-03
NL6813863A (en) 1969-04-01

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees