GB1214231A - Heat transfer measurement device - Google Patents

Abstract

1,214,231. Thermocouple assemblies. J. GREY, and E. L. WHITE. 9 Jan., 1969 [12 Aug., 1968], No. 1278/69. Heading H1K. [Also in Division G1] An arrangement for measuring heat transfer rate consists of a body including at least three heat conducting regions arranged serially in the direction of heat flow to define two or more thermoelectric junctions, together with means for measuring the potentials developed across each junction. The thermal conductance of the body as a whole in the direction of heat flow is matched to that of the wall of a support body in which it is mounted. In the example (Fig. 4) the body consists of a constantan wafer 20 diffusion welded between two copper wafers 19, 21 with contacts 28-30, of the same material as the wafers from which they extend insulated from the remaining wafers by sleeves 34, 37. The dimensions of the contacts and sleeves and the material of which the sleeves are made are so chosen that the thermal conductance of the assembly is uniform throughout its area. The body is mounted as shown in a brass support wall which may be an internally liquid cooled probe. The surface of outer wafer 27 may be coated so as to have the same radiation absorption characteristics as the support. Lateral flow of heat is reduced by providing between the body and support wall a gap which may be filled with heat insulating boron nitride. Other combinations of materials suggested for the body wafers are tungsten-rhenium, ironconstantan and Chromel-Alumel (Trade Mark).