GB1213097A - Improvements in or relating to copper plating - Google Patents
Improvements in or relating to copper platingInfo
- Publication number
- GB1213097A GB1213097A GB21349/69A GB2134969A GB1213097A GB 1213097 A GB1213097 A GB 1213097A GB 21349/69 A GB21349/69 A GB 21349/69A GB 2134969 A GB2134969 A GB 2134969A GB 1213097 A GB1213097 A GB 1213097A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sulphonates
- aromatic
- aliphatic
- sultones
- polysulphide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C255/00—Carboxylic acid nitriles
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
1,213,097. Polysulphide sulphonates. M. & T. CHEMICALS Inc. 25 April, 1969 [29 April, 1968], No. 21349/69. Heading C2C. [Also in Division C7] Numerous polysulphide sulphonates of the formula R<SP>1</SP>-(S) n -R-SO 3 M where R is a divalent aliphatic or aromatic radical, R<SP>1</SP> is H, a metal cation, a monovalent aliphatic or aromatic group, -R-SO 3 M or -R-(S) q - RSO 3 M; M is a cation and n and q are 2, 3, 4 or 5 are specified for use as brighteners in copper plating baths. They may be prepared by direct sulphonation of organo polysulphides, or by reaction of alkali metal salts of hydropolysulphides and sultones. Instead of sultones, haloalkane sulphonates, prepared by reacting epichlorohydrin with alkali metal bisulphites, may be used. Examples of polysulphides include Na 2 S 2 , Na 2 S 4 , R<SP>1</SP>S 2 H and R<SP>1</SP>S 2 Na, where R<SP>1</SP> is an aliphatic or aromatic C 1-20 group. Other reactions include SCl 2 or S 2 Cl 2 with NaS(CH 2 ) 3 - SO 3 Na, or ClCH 2 CH 2 Cl with NaSS(CH 2 ) 2 SO 3 - Na, or R<SP>1</SP>SNa with S and a (e.g. propane) sultone in a methanol solution containing sodium methoxide, acetone being added to give additional solid which is filtered.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US72520968A | 1968-04-29 | 1968-04-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1213097A true GB1213097A (en) | 1970-11-18 |
Family
ID=24913601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB21349/69A Expired GB1213097A (en) | 1968-04-29 | 1969-04-25 | Improvements in or relating to copper plating |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US3542655A (en) |
| JP (1) | JPS4934887B1 (en) |
| BE (1) | BE732051A (en) |
| BR (1) | BR6908411D0 (en) |
| CA (1) | CA924259A (en) |
| CH (1) | CH537462A (en) |
| DE (1) | DE1921845C3 (en) |
| ES (1) | ES366560A1 (en) |
| FR (1) | FR2007169A1 (en) |
| GB (1) | GB1213097A (en) |
| NL (1) | NL165513C (en) |
| SE (1) | SE357771B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3351657A1 (en) * | 2017-01-23 | 2018-07-25 | Rohm and Haas Electronic Materials LLC | Electroless copper plating compositions |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3715289A (en) * | 1971-02-08 | 1973-02-06 | Stauffer Chemical Co | Brightener composition for acid copper electroplating baths |
| US3770598A (en) * | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
| US3725220A (en) * | 1972-04-27 | 1973-04-03 | Lea Ronal Inc | Electrodeposition of copper from acidic baths |
| US3804729A (en) * | 1972-06-19 | 1974-04-16 | M & T Chemicals Inc | Electrolyte and process for electro-depositing copper |
| US3966565A (en) * | 1972-12-14 | 1976-06-29 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3956079A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3956084A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| DE2360892A1 (en) * | 1972-12-14 | 1974-06-20 | M & T Chemicals Inc | AQUATIC ACID GALVANIC COPPER BATH |
| US3956120A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3956078A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| US3940320A (en) * | 1972-12-14 | 1976-02-24 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4036710A (en) * | 1974-11-21 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4014760A (en) * | 1974-11-21 | 1977-03-29 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4036711A (en) * | 1975-12-18 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| US4781801A (en) * | 1987-02-03 | 1988-11-01 | Mcgean-Rohco, Inc. | Method of copper plating gravure rolls |
| US4948474A (en) * | 1987-09-18 | 1990-08-14 | Pennsylvania Research Corporation | Copper electroplating solutions and methods |
| US4786746A (en) * | 1987-09-18 | 1988-11-22 | Pennsylvania Research Corporation | Copper electroplating solutions and methods of making and using them |
| DE69110208T2 (en) * | 1990-08-03 | 1995-10-19 | Rohco Inc Mcgean | Copper plating of gravure cylinders. |
| TWI330587B (en) * | 2002-07-26 | 2010-09-21 | Clopay Plastic Prod Co | Breathable materials comprising low-elongation fabrics, and methods |
| EP1422320A1 (en) * | 2002-11-21 | 2004-05-26 | Shipley Company, L.L.C. | Copper electroplating bath |
| EP2537962A1 (en) * | 2011-06-22 | 2012-12-26 | Atotech Deutschland GmbH | Method for copper plating |
| CN109778264A (en) * | 2017-11-10 | 2019-05-21 | 丹阳市金地生态园林发展有限公司 | A kind of antistatic electroplate liquid of metal alloy containing epoxychloropropane |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2700020A (en) * | 1952-06-02 | 1955-01-18 | Houdaille Hershey Corp | Plating copper |
| US2663684A (en) * | 1952-06-02 | 1953-12-22 | Houdaille Hershey Corp | Method of and composition for plating copper |
| US2840518A (en) * | 1954-07-19 | 1958-06-24 | Westinghouse Electric Corp | Acid copper addition agents and plating electrolytes embodying the same |
| NL291575A (en) * | 1962-04-16 | |||
| US3288690A (en) * | 1962-04-16 | 1966-11-29 | Udylite Corp | Electrodeposition of copper from acidic baths |
| US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
-
1968
- 1968-04-29 US US725209A patent/US3542655A/en not_active Expired - Lifetime
-
1969
- 1969-04-21 FR FR6912391A patent/FR2007169A1/fr not_active Withdrawn
- 1969-04-24 BE BE732051D patent/BE732051A/xx not_active IP Right Cessation
- 1969-04-25 GB GB21349/69A patent/GB1213097A/en not_active Expired
- 1969-04-28 BR BR208411/69A patent/BR6908411D0/en unknown
- 1969-04-28 ES ES366560A patent/ES366560A1/en not_active Expired
- 1969-04-28 CH CH642769A patent/CH537462A/en not_active IP Right Cessation
- 1969-04-28 SE SE06009/69A patent/SE357771B/xx unknown
- 1969-04-29 CA CA050039A patent/CA924259A/en not_active Expired
- 1969-04-29 NL NL6906599.A patent/NL165513C/en not_active IP Right Cessation
- 1969-04-29 DE DE1921845A patent/DE1921845C3/en not_active Expired
- 1969-04-30 JP JP44033504A patent/JPS4934887B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3351657A1 (en) * | 2017-01-23 | 2018-07-25 | Rohm and Haas Electronic Materials LLC | Electroless copper plating compositions |
Also Published As
| Publication number | Publication date |
|---|---|
| NL165513B (en) | 1980-11-17 |
| NL6906599A (en) | 1969-10-31 |
| ES366560A1 (en) | 1971-07-16 |
| CA924259A (en) | 1973-04-10 |
| DE1921845C3 (en) | 1980-07-31 |
| JPS4934887B1 (en) | 1974-09-18 |
| BE732051A (en) | 1969-10-01 |
| BR6908411D0 (en) | 1973-01-09 |
| FR2007169A1 (en) | 1970-01-02 |
| DE1921845A1 (en) | 1969-11-06 |
| DE1921845B2 (en) | 1979-11-15 |
| NL165513C (en) | 1981-04-15 |
| US3542655A (en) | 1970-11-24 |
| CH537462A (en) | 1973-05-31 |
| SE357771B (en) | 1973-07-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |