GB1210321A - Laminated circuit components and method of manufacture thereof - Google Patents

Laminated circuit components and method of manufacture thereof

Info

Publication number
GB1210321A
GB1210321A GB233868A GB233868A GB1210321A GB 1210321 A GB1210321 A GB 1210321A GB 233868 A GB233868 A GB 233868A GB 233868 A GB233868 A GB 233868A GB 1210321 A GB1210321 A GB 1210321A
Authority
GB
United Kingdom
Prior art keywords
plate
trough
plates
connection
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB233868A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bunker Ramo Corp
Original Assignee
Bunker Ramo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bunker Ramo Corp filed Critical Bunker Ramo Corp
Publication of GB1210321A publication Critical patent/GB1210321A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguides (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electric Cables (AREA)
GB233868A 1967-02-02 1968-01-16 Laminated circuit components and method of manufacture thereof Expired GB1210321A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61365267A 1967-02-02 1967-02-02

Publications (1)

Publication Number Publication Date
GB1210321A true GB1210321A (en) 1970-10-28

Family

ID=24458155

Family Applications (1)

Application Number Title Priority Date Filing Date
GB233868A Expired GB1210321A (en) 1967-02-02 1968-01-16 Laminated circuit components and method of manufacture thereof

Country Status (5)

Country Link
JP (1) JPS4540835B1 (https=)
DE (1) DE1616235B1 (https=)
FR (1) FR1553381A (https=)
GB (1) GB1210321A (https=)
NL (1) NL163702C (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2177851A (en) * 1985-06-05 1987-01-28 Spence Bate Laminated low power circuitry components
US7405363B2 (en) 2003-09-30 2008-07-29 J.S.T. Mfg. Co., Ltd. Connecting sheet

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3704455A (en) * 1971-02-01 1972-11-28 Alfred D Scarbrough 3d-coaxial memory construction and method of making

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1100734B (de) * 1959-09-01 1961-03-02 Siemens Ag Kontaktstueck in einer mit flaechenhaften Leitungszuegen versehenen Isolierstoffplatte
DE1127970B (de) * 1959-12-08 1962-04-19 Licentia Gmbh Verfahren zur Herstellung leitender Verbindungen zwischen zwei Leiterstreifen einer beiderseits bedruckten Schaltungsplatine
US2990310A (en) * 1960-05-11 1961-06-27 Burroughs Corp Laminated printed circuit board
US3335489A (en) * 1962-09-24 1967-08-15 North American Aviation Inc Interconnecting circuits with a gallium and indium eutectic
FR1407843A (fr) * 1964-06-26 1965-08-06 Electronique & Automatisme Sa Perfectionnements apportés à la réalisation des circuits dits hybrides

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2177851A (en) * 1985-06-05 1987-01-28 Spence Bate Laminated low power circuitry components
US7405363B2 (en) 2003-09-30 2008-07-29 J.S.T. Mfg. Co., Ltd. Connecting sheet

Also Published As

Publication number Publication date
NL163702B (nl) 1980-04-15
NL163702C (nl) 1980-09-15
FR1553381A (https=) 1969-01-10
JPS4540835B1 (https=) 1970-12-22
DE1616235B1 (de) 1971-05-06
NL6801269A (https=) 1968-08-05

Similar Documents

Publication Publication Date Title
US4247883A (en) Encapsulated capacitor
KR101546572B1 (ko) 반도체 패키지 및 그 제조 방법
GB1337652A (en) Electrical circuit packaging structure and method of fabrication thereof
GB911718A (en) Multiplanar printed circuits and methods for their manufacture
IE39666L (en) Circuit board
US3541225A (en) Electrical conductor with improved solder characteristics
GB1212626A (en) Electrical interconnection means and method of fabrication thereof
US3558993A (en) Electrical component assemblies with improved printed circuit construction
GB1282371A (en) Coaxial circuit construction and method of making
KR20180002025A (ko) 반도체 패키지 및 그의 제조방법
US3500538A (en) Method for producing a wire having improved soldering characteristics
US3568312A (en) Method of making printed circuit boards
GB1210321A (en) Laminated circuit components and method of manufacture thereof
GB1152809A (en) Electric Circuit Assembly
CN103225094A (zh) 一种盲孔板电镀单面电流保护方法
US3158926A (en) Method of making an electrical terminal board
US4282645A (en) Method of assembling an encapsulated chip capacitor
GB1126370A (en) Improvements relating to printed circuits
GB1278971A (en) Improvements in and relating to electrolytic capacitors
US3848077A (en) Package for electronic semiconductor devices
US3626081A (en) Sandwich-type voltage and ground plane
US3155930A (en) Flanged conductive sleeve for connecting strip line with coaxial line
JPS6448423A (en) Dividing method of semiconductor chip
JP2926902B2 (ja) プリント配線基板
GB1084598A (en) A method of making passivated semiconductor devices

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee