GB1206341A - Improvements in or relating to circuit board assemblies - Google Patents
Improvements in or relating to circuit board assembliesInfo
- Publication number
- GB1206341A GB1206341A GB750868A GB750868A GB1206341A GB 1206341 A GB1206341 A GB 1206341A GB 750868 A GB750868 A GB 750868A GB 750868 A GB750868 A GB 750868A GB 1206341 A GB1206341 A GB 1206341A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductors
- connector block
- board
- block half
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
1,206,341. Circuit assemblies. INTERNATIONAL COMPUTERS Ltd. 8 Jan., 1969 [15 Feb., 1968], No. 7508/68. Heading H1R. A circuit board assembly comprises a component board 11 and a connection board 10 plugged together face-to-face by connector blocks 13, 14 along two adjacent edges. Semiconductor devices 15 such as gating circuits and delay circuits are connected at their inputs to connector block half 14B by conductors 16 running through holes in the board 11 and at their outputs to connector block half 13B by conductors 17. Connection board 10 carrying mating connector block halves 14A, 13A is provided with a set of conductors 19 on its lower surface connected to connector block half 14A and a second set of conductors 18 on its upper surface connected to connector block half 13A. Connections between selected ones of the conductors are made by conductive links passing through holes 20. The assembly is plugged into a backboard by connector block 12A to which are connected conductors 21, carrying input signals and which are connected by links to conductors 19, and conductors 21A which carry output signals from the assembly. Power supplies may be fed in by certain of the conductors 21 and distributed by conductors (not shown) which approach the devices 15 from the opposite sides to the connector block halves 13B, 14B.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB750868A GB1206341A (en) | 1968-02-15 | 1968-02-15 | Improvements in or relating to circuit board assemblies |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB750868A GB1206341A (en) | 1968-02-15 | 1968-02-15 | Improvements in or relating to circuit board assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1206341A true GB1206341A (en) | 1970-09-23 |
Family
ID=9834469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB750868A Expired GB1206341A (en) | 1968-02-15 | 1968-02-15 | Improvements in or relating to circuit board assemblies |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1206341A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3132485A1 (en) * | 1980-09-12 | 1982-06-16 | Siemens AG, 1000 Berlin und 8000 München | Insulated push-in unit with a high dielectric strength |
US4903168A (en) * | 1988-04-22 | 1990-02-20 | Ag Communication Systems Corporation | Substrate carrier device |
US5200885A (en) * | 1990-04-26 | 1993-04-06 | Micro Control Company | Double burn-in board assembly |
US5667388A (en) * | 1994-11-14 | 1997-09-16 | Intel Corporation | Printed circuit board adapter carrier for input/output cards |
WO2001015498A1 (en) * | 1999-08-25 | 2001-03-01 | Qualcomm Incorporated | Bidirectional interface tool for pwb development |
DE10110587A1 (en) * | 2001-03-06 | 2002-10-02 | Msr-Technik Dipl-Ing Win Barth | System for modular stacking of PC boards interconnected by multipole plug-in connectors to provide plug-in multiple-contact strip on each board. |
-
1968
- 1968-02-15 GB GB750868A patent/GB1206341A/en not_active Expired
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3132485A1 (en) * | 1980-09-12 | 1982-06-16 | Siemens AG, 1000 Berlin und 8000 München | Insulated push-in unit with a high dielectric strength |
US4903168A (en) * | 1988-04-22 | 1990-02-20 | Ag Communication Systems Corporation | Substrate carrier device |
US5200885A (en) * | 1990-04-26 | 1993-04-06 | Micro Control Company | Double burn-in board assembly |
US5667388A (en) * | 1994-11-14 | 1997-09-16 | Intel Corporation | Printed circuit board adapter carrier for input/output cards |
WO2001015498A1 (en) * | 1999-08-25 | 2001-03-01 | Qualcomm Incorporated | Bidirectional interface tool for pwb development |
AU765017B2 (en) * | 1999-08-25 | 2003-09-04 | Qualcomm Incorporated | Bidirectional interface tool for PWB development |
DE10110587A1 (en) * | 2001-03-06 | 2002-10-02 | Msr-Technik Dipl-Ing Win Barth | System for modular stacking of PC boards interconnected by multipole plug-in connectors to provide plug-in multiple-contact strip on each board. |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLNP | Patent lapsed through nonpayment of renewal fees |