GB1190128A - Improvements relating to the Manufacture of Stacked Printed Circuit Boards - Google Patents

Improvements relating to the Manufacture of Stacked Printed Circuit Boards

Info

Publication number
GB1190128A
GB1190128A GB3748268A GB3748268A GB1190128A GB 1190128 A GB1190128 A GB 1190128A GB 3748268 A GB3748268 A GB 3748268A GB 3748268 A GB3748268 A GB 3748268A GB 1190128 A GB1190128 A GB 1190128A
Authority
GB
United Kingdom
Prior art keywords
layers
conductors
eyelets
rigid
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3748268A
Inventor
Victor Fritz Dahlgren
Sidney Kenneth Tally
Thomas Hoban Stearns
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Mechanisms Inc
Original Assignee
Electro Mechanisms Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Mechanisms Inc filed Critical Electro Mechanisms Inc
Priority to GB3748268A priority Critical patent/GB1190128A/en
Publication of GB1190128A publication Critical patent/GB1190128A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

1,190,128. Printed circuits. ELECTROMECHANISMS Inc. 6 Aug., 1968, No. 37482/68. Heading H1R. In a stacked printed circuit assembly comprising a plurality of flexible circuit layers 10, 11, 12 interposed between and connected selectively with a plurality of rigid circuit boards 13 and 14, 14 and 15, and 15 and 16, the flexible circuit layers extend from the stack and the extended portions 10a-12a are provided with terminals 26a-28a. The flexible circuit layers 10, 11, 12 are transparent and are formed by bonding or cementing by heat and pressure a plastics material sheet to the exposed surfaces of a printed circuit having foillike conductors formed by etching on another layer of plastic, the circuit conductors being encapsulated in the layers of plastic. The rigid circuit boards 13, 14, 15 and 16 are formed in a similar manner except that the plastic layers are reinforced with a glass fibre fabric. Since the rigid boards act as insulators the flexible circuit layers 10, 11, 12 require cover layers of plastic only in their extended portions 10a-12a. Terminals 26a-27a in the form of copper eyelets having flanges 30 are provided at the ends of the conductors in the flexible circuit layers, the surface of the copper eyelets and the underside of the flange being provided with a coating of a silver brazing alloy which on the application of heat brazes the eyelets to the conductors. Terminals 32 in the form of eyelets extend through each of the superposed flexible and rigid circuits to engage the conductors of the various layers. Component leads are connected to the eyelets. The flexible circuit layers need not be interposed between the rigid cables in the stack.
GB3748268A 1968-08-06 1968-08-06 Improvements relating to the Manufacture of Stacked Printed Circuit Boards Expired GB1190128A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3748268A GB1190128A (en) 1968-08-06 1968-08-06 Improvements relating to the Manufacture of Stacked Printed Circuit Boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3748268A GB1190128A (en) 1968-08-06 1968-08-06 Improvements relating to the Manufacture of Stacked Printed Circuit Boards

Publications (1)

Publication Number Publication Date
GB1190128A true GB1190128A (en) 1970-04-29

Family

ID=10396810

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3748268A Expired GB1190128A (en) 1968-08-06 1968-08-06 Improvements relating to the Manufacture of Stacked Printed Circuit Boards

Country Status (1)

Country Link
GB (1) GB1190128A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947878A (en) * 1971-04-30 1974-05-09
US4677529A (en) * 1985-03-12 1987-06-30 Alps Electric Co., Ltd. Circuit board
US4845313A (en) * 1985-07-22 1989-07-04 Tokyo Communication Equipment Co., Ltd. Metallic core wiring substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947878A (en) * 1971-04-30 1974-05-09
US4677529A (en) * 1985-03-12 1987-06-30 Alps Electric Co., Ltd. Circuit board
US4845313A (en) * 1985-07-22 1989-07-04 Tokyo Communication Equipment Co., Ltd. Metallic core wiring substrate

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Legal Events

Date Code Title Description
PS Patent sealed
PLE Entries relating assignments, transmissions, licences in the register of patents
PLE Entries relating assignments, transmissions, licences in the register of patents
PCNP Patent ceased through non-payment of renewal fee