GB1178745A - Improvements in and relating to Multilayer Circuit Structures - Google Patents
Improvements in and relating to Multilayer Circuit StructuresInfo
- Publication number
- GB1178745A GB1178745A GB00554/67A GB1055467A GB1178745A GB 1178745 A GB1178745 A GB 1178745A GB 00554/67 A GB00554/67 A GB 00554/67A GB 1055467 A GB1055467 A GB 1055467A GB 1178745 A GB1178745 A GB 1178745A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sheets
- metal
- paste
- filled
- zaep
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 abstract 7
- 239000002184 metal Substances 0.000 abstract 7
- 229910017309 Mo—Mn Inorganic materials 0.000 abstract 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 2
- 238000007654 immersion Methods 0.000 abstract 2
- 150000002736 metal compounds Chemical class 0.000 abstract 2
- 150000002739 metals Chemical class 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 229910052726 zirconium Inorganic materials 0.000 abstract 2
- 239000001856 Ethyl cellulose Substances 0.000 abstract 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 abstract 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 229920001249 ethyl cellulose Polymers 0.000 abstract 1
- 235000019325 ethyl cellulose Nutrition 0.000 abstract 1
- 238000010304 firing Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000003801 milling Methods 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 229910052573 porcelain Inorganic materials 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000012255 powdered metal Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 239000002002 slurry Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 229910052721 tungsten Inorganic materials 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
- Ceramic Products (AREA)
Abstract
1,178,745. Making circuit boards. INTERNATIONAL BUSINESS MACHINES CORP. 7 March, 1967 [30 March, 1966], No. 10554/67. Heading B3A. [Also in Divisions C1 and H1] In a method of making a multilayer printed circuit board, circuit patterns 16, 18, 20, Fig. 2, are formed on a plurality of green ceramic sheets 10, 12, 14 with a paste comprising powdered metal or reducible metal compound in a volatile binder, through-holes 22, 24, 26 in said sheets also being filled with said paste; the sheets are then stacked and fired to sinter the sheets together, Fig. 5, to convert any metal compound to the metal, and to cause the metal to form capillary paths 42 along said circuit pattern; finally the said capillary paths are filled with molten conductor metal 52. A preferred ceramic for the sheets is zirconium alkaline earth porcelain (ZAEP); aluminas, beryllias, forsterites, steatites, and mullites may also be employed. Preferred metals include Mo, Mo-Mn, Zr, Fe, Cb, W, Ti, Ta, and mixtures thereof; compounds of the said metals and oxides of Li-Mo may alternatively be used. The capillary paths may be either metallized tubes, as shown, or porous lattice-like structures; they are filled by immersion in a bath of molten metal, e.g. Cu or Al, in a reduced pressure atmosphere; alternatively, metal preforms are butted against the capillary ends and melted. A preferred composition of ZAEP is:- After milling for 8 hours the slurry is dried, pulverized, calcined, repulverized and micromilled, after which it is mixed with resin, solvents, and wetting and plasticizing agents in the following proportions:- In a first example, ZAEP green sheets are screen printed with a circuit pattern of paste comprising 40 gms powdered MoO 3 and 13À5 gms. medium containing betaterpenyl and ethyl cellulose. After stacking, the sheets are subjected to a burn-off in air at 400 C. followed by firing in dry H 2 at 1210 C. Capillaries are filled by immersion in a molten Cu bath at 1140 C. In another example, terephthalic acid is added to the paste, the sintering is carried out at 1285 C. in, a moist H 2 atmosphere, and the capillaries are filled in an Al bath at 700 C. Other examples using Mo-Mn powder to form the paste are described in the Specification.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US53877066A | 1966-03-30 | 1966-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1178745A true GB1178745A (en) | 1970-01-21 |
Family
ID=24148353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB00554/67A Expired GB1178745A (en) | 1966-03-30 | 1967-03-07 | Improvements in and relating to Multilayer Circuit Structures |
Country Status (8)
| Country | Link |
|---|---|
| BE (1) | BE694305A (en) |
| CH (1) | CH452016A (en) |
| DE (1) | DE1301378B (en) |
| ES (1) | ES338549A1 (en) |
| FR (1) | FR1512995A (en) |
| GB (1) | GB1178745A (en) |
| NL (1) | NL144473B (en) |
| SE (1) | SE337856B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2568053A1 (en) * | 1984-07-23 | 1986-01-24 | Avx Corp | METHOD FOR MANUFACTURING A MULTILAYER CERAMIC CAPACITOR AND CAPACITOR SO OBTAINED |
| GB2242784A (en) * | 1990-04-07 | 1991-10-09 | Korea Inst Sci & Tech | Method for manufacturing multilayer ceramic capacitor |
| WO2007061448A2 (en) * | 2005-05-18 | 2007-05-31 | President And Fellows Of Harvard College | Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks |
| WO2013120908A1 (en) * | 2012-02-17 | 2013-08-22 | Sony Dadc Austria Ag | Microstructured polymer devices |
| CN109511218A (en) * | 2018-12-16 | 2019-03-22 | 天津荣事顺发电子有限公司 | A kind of multilayer ceramic circuit board preparation method |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL169260C (en) * | 1971-04-16 | 1982-06-16 | Tam Ceramics Inc | METHOD OF MANUFACTURING SINTERED CERAMIC OBJECTS CONTAINING CONDUCTORS |
| DE2306236C2 (en) * | 1973-02-08 | 1982-11-25 | Siemens AG, 1000 Berlin und 8000 München | Process for the production of multilayer circuits with conductive layers on both sides of a ceramic substrate |
| US3999004A (en) * | 1974-09-27 | 1976-12-21 | International Business Machines Corporation | Multilayer ceramic substrate structure |
| GB2103422B (en) * | 1981-07-30 | 1985-02-27 | Standard Telephones Cables Ltd | Ceramic capacitors |
| EP0089550A3 (en) * | 1982-03-19 | 1984-09-26 | DRALORIC Electronic GmbH | Monolithic condenser, and method of making it |
| JP2579937B2 (en) * | 1987-04-15 | 1997-02-12 | 株式会社東芝 | Electronic circuit device and method of manufacturing the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE631489A (en) * | 1962-04-27 |
-
1967
- 1967-02-17 DE DEJ33027A patent/DE1301378B/en active Pending
- 1967-02-20 BE BE694305D patent/BE694305A/xx not_active IP Right Cessation
- 1967-02-22 FR FR8376A patent/FR1512995A/en not_active Expired
- 1967-03-07 GB GB00554/67A patent/GB1178745A/en not_active Expired
- 1967-03-15 CH CH379667A patent/CH452016A/en unknown
- 1967-03-28 ES ES338549A patent/ES338549A1/en not_active Expired
- 1967-03-30 SE SE04423/67A patent/SE337856B/xx unknown
- 1967-03-30 NL NL676704510A patent/NL144473B/en not_active IP Right Cessation
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2568053A1 (en) * | 1984-07-23 | 1986-01-24 | Avx Corp | METHOD FOR MANUFACTURING A MULTILAYER CERAMIC CAPACITOR AND CAPACITOR SO OBTAINED |
| US4584629A (en) * | 1984-07-23 | 1986-04-22 | Avx Corporation | Method of making ceramic capacitor and resulting article |
| GB2242784A (en) * | 1990-04-07 | 1991-10-09 | Korea Inst Sci & Tech | Method for manufacturing multilayer ceramic capacitor |
| GB2242784B (en) * | 1990-04-07 | 1994-08-24 | Korea Inst Sci & Tech | Method for manufacturing multilayer ceramic capacitor |
| WO2007061448A2 (en) * | 2005-05-18 | 2007-05-31 | President And Fellows Of Harvard College | Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks |
| WO2007061448A3 (en) * | 2005-05-18 | 2008-08-28 | Harvard College | Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks |
| WO2013120908A1 (en) * | 2012-02-17 | 2013-08-22 | Sony Dadc Austria Ag | Microstructured polymer devices |
| US9823221B2 (en) | 2012-02-17 | 2017-11-21 | STRATEC CONSUMABLES GmbH | Microstructured polymer devices |
| CN109511218A (en) * | 2018-12-16 | 2019-03-22 | 天津荣事顺发电子有限公司 | A kind of multilayer ceramic circuit board preparation method |
Also Published As
| Publication number | Publication date |
|---|---|
| ES338549A1 (en) | 1968-04-01 |
| CH452016A (en) | 1968-05-15 |
| DE1301378B (en) | 1969-08-21 |
| BE694305A (en) | 1967-07-31 |
| NL144473B (en) | 1974-12-16 |
| SE337856B (en) | 1971-08-23 |
| FR1512995A (en) | 1968-02-09 |
| NL6704510A (en) | 1967-10-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3852877A (en) | Multilayer circuits | |
| US3838204A (en) | Multilayer circuits | |
| GB1178745A (en) | Improvements in and relating to Multilayer Circuit Structures | |
| US4755490A (en) | Low firing temperature ceramic materials | |
| US4474731A (en) | Process for the removal of carbon residues during sintering of ceramics | |
| GB1020061A (en) | Multilayer circuits | |
| GB1487800A (en) | Plated through-holes for printed circuits | |
| KR20000052335A (en) | Ferrite tape composition, inductor coils, embedded inductor, and method for fabricating embedded inductor | |
| US4075681A (en) | Capacitor with noble metal electrodes | |
| US4329271A (en) | Flexible ceramic tape and method of making same | |
| JPS6341165B2 (en) | ||
| US4880599A (en) | Method of making a ferrite composite containing silver metallization | |
| JP2002524270A (en) | Method for producing paste and weld joint for welding ceramic and metal | |
| US5000909A (en) | Ferrite body containing metallization | |
| US5068210A (en) | Low dielectric constant ceramic materials | |
| JPS6210552B2 (en) | ||
| JP3735228B2 (en) | Method for producing soft magnetic ferrite powder and method for producing multilayer chip inductor | |
| US3511640A (en) | Degassing platinum powders | |
| US4966625A (en) | Ferrite composite containing silver metallization | |
| JPS6258680B2 (en) | ||
| JPH0147439B2 (en) | ||
| JP2735027B2 (en) | Conductive paste for dielectric ceramic capacitors | |
| JPS6150395A (en) | Method of producing ceramic multilayer circuit board | |
| JPS58151099A (en) | Method of producing ceramic multilayer circuit board | |
| JPH06251619A (en) | Metallized paste for concurrent baking |