FR1512995A - Multi-layer circuit - Google Patents

Multi-layer circuit

Info

Publication number
FR1512995A
FR1512995A FR8376A FR06008376A FR1512995A FR 1512995 A FR1512995 A FR 1512995A FR 8376 A FR8376 A FR 8376A FR 06008376 A FR06008376 A FR 06008376A FR 1512995 A FR1512995 A FR 1512995A
Authority
FR
France
Prior art keywords
layer circuit
circuit
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8376A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of FR1512995A publication Critical patent/FR1512995A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Products (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Conductive Materials (AREA)
FR8376A 1966-03-30 1967-02-22 Multi-layer circuit Expired FR1512995A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53877066A 1966-03-30 1966-03-30

Publications (1)

Publication Number Publication Date
FR1512995A true FR1512995A (en) 1968-02-09

Family

ID=24148353

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8376A Expired FR1512995A (en) 1966-03-30 1967-02-22 Multi-layer circuit

Country Status (8)

Country Link
BE (1) BE694305A (en)
CH (1) CH452016A (en)
DE (1) DE1301378B (en)
ES (1) ES338549A1 (en)
FR (1) FR1512995A (en)
GB (1) GB1178745A (en)
NL (1) NL144473B (en)
SE (1) SE337856B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2193795A2 (en) * 1971-04-16 1974-02-22 Nl Industries Inc Monolithic ceramic capacitor - comprises dense and porous ceramic layers
FR2286580A1 (en) * 1974-09-27 1976-04-23 Ibm SINGLE AND MULTI-LAYER CERAMIC SUPPORT STRUCTURE AND ITS MANUFACTURING PROCESS
FR2510806A1 (en) * 1981-07-30 1983-02-04 Itt METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITORS AND PRODUCTS OBTAINED
FR2614168A1 (en) * 1987-04-15 1988-10-21 Toshiba Kk MULTI-LAYERED ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURING METHOD

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2306236C2 (en) * 1973-02-08 1982-11-25 Siemens AG, 1000 Berlin und 8000 München Process for the production of multilayer circuits with conductive layers on both sides of a ceramic substrate
EP0089550A3 (en) * 1982-03-19 1984-09-26 DRALORIC Electronic GmbH Monolithic condenser, and method of making it
US4584629A (en) * 1984-07-23 1986-04-22 Avx Corporation Method of making ceramic capacitor and resulting article
KR920006856B1 (en) * 1990-04-07 1992-08-20 한국과학기술연구원 Manufacturing method of multi-layer ceramic condenser by using injection electrode method
KR20080023303A (en) * 2005-05-18 2008-03-13 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks
WO2013120908A1 (en) * 2012-02-17 2013-08-22 Sony Dadc Austria Ag Microstructured polymer devices
CN109511218A (en) * 2018-12-16 2019-03-22 天津荣事顺发电子有限公司 A kind of multilayer ceramic circuit board preparation method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE631489A (en) * 1962-04-27

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2193795A2 (en) * 1971-04-16 1974-02-22 Nl Industries Inc Monolithic ceramic capacitor - comprises dense and porous ceramic layers
FR2286580A1 (en) * 1974-09-27 1976-04-23 Ibm SINGLE AND MULTI-LAYER CERAMIC SUPPORT STRUCTURE AND ITS MANUFACTURING PROCESS
FR2510806A1 (en) * 1981-07-30 1983-02-04 Itt METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITORS AND PRODUCTS OBTAINED
FR2614168A1 (en) * 1987-04-15 1988-10-21 Toshiba Kk MULTI-LAYERED ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURING METHOD

Also Published As

Publication number Publication date
ES338549A1 (en) 1968-04-01
NL144473B (en) 1974-12-16
BE694305A (en) 1967-07-31
SE337856B (en) 1971-08-23
CH452016A (en) 1968-05-15
DE1301378B (en) 1969-08-21
GB1178745A (en) 1970-01-21
NL6704510A (en) 1967-10-02

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