FR1512995A - Multi-layer circuit - Google Patents
Multi-layer circuitInfo
- Publication number
- FR1512995A FR1512995A FR8376A FR06008376A FR1512995A FR 1512995 A FR1512995 A FR 1512995A FR 8376 A FR8376 A FR 8376A FR 06008376 A FR06008376 A FR 06008376A FR 1512995 A FR1512995 A FR 1512995A
- Authority
- FR
- France
- Prior art keywords
- layer circuit
- circuit
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Products (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53877066A | 1966-03-30 | 1966-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1512995A true FR1512995A (en) | 1968-02-09 |
Family
ID=24148353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8376A Expired FR1512995A (en) | 1966-03-30 | 1967-02-22 | Multi-layer circuit |
Country Status (8)
Country | Link |
---|---|
BE (1) | BE694305A (en) |
CH (1) | CH452016A (en) |
DE (1) | DE1301378B (en) |
ES (1) | ES338549A1 (en) |
FR (1) | FR1512995A (en) |
GB (1) | GB1178745A (en) |
NL (1) | NL144473B (en) |
SE (1) | SE337856B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2193795A2 (en) * | 1971-04-16 | 1974-02-22 | Nl Industries Inc | Monolithic ceramic capacitor - comprises dense and porous ceramic layers |
FR2286580A1 (en) * | 1974-09-27 | 1976-04-23 | Ibm | SINGLE AND MULTI-LAYER CERAMIC SUPPORT STRUCTURE AND ITS MANUFACTURING PROCESS |
FR2510806A1 (en) * | 1981-07-30 | 1983-02-04 | Itt | METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITORS AND PRODUCTS OBTAINED |
FR2614168A1 (en) * | 1987-04-15 | 1988-10-21 | Toshiba Kk | MULTI-LAYERED ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURING METHOD |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2306236C2 (en) * | 1973-02-08 | 1982-11-25 | Siemens AG, 1000 Berlin und 8000 München | Process for the production of multilayer circuits with conductive layers on both sides of a ceramic substrate |
EP0089550A3 (en) * | 1982-03-19 | 1984-09-26 | DRALORIC Electronic GmbH | Monolithic condenser, and method of making it |
US4584629A (en) * | 1984-07-23 | 1986-04-22 | Avx Corporation | Method of making ceramic capacitor and resulting article |
KR920006856B1 (en) * | 1990-04-07 | 1992-08-20 | 한국과학기술연구원 | Manufacturing method of multi-layer ceramic condenser by using injection electrode method |
KR20080023303A (en) * | 2005-05-18 | 2008-03-13 | 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 | Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks |
WO2013120908A1 (en) * | 2012-02-17 | 2013-08-22 | Sony Dadc Austria Ag | Microstructured polymer devices |
CN109511218A (en) * | 2018-12-16 | 2019-03-22 | 天津荣事顺发电子有限公司 | A kind of multilayer ceramic circuit board preparation method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE631489A (en) * | 1962-04-27 |
-
1967
- 1967-02-17 DE DEJ33027A patent/DE1301378B/en active Pending
- 1967-02-20 BE BE694305D patent/BE694305A/xx not_active IP Right Cessation
- 1967-02-22 FR FR8376A patent/FR1512995A/en not_active Expired
- 1967-03-07 GB GB00554/67A patent/GB1178745A/en not_active Expired
- 1967-03-15 CH CH379667A patent/CH452016A/en unknown
- 1967-03-28 ES ES338549A patent/ES338549A1/en not_active Expired
- 1967-03-30 NL NL676704510A patent/NL144473B/en not_active IP Right Cessation
- 1967-03-30 SE SE04423/67A patent/SE337856B/xx unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2193795A2 (en) * | 1971-04-16 | 1974-02-22 | Nl Industries Inc | Monolithic ceramic capacitor - comprises dense and porous ceramic layers |
FR2286580A1 (en) * | 1974-09-27 | 1976-04-23 | Ibm | SINGLE AND MULTI-LAYER CERAMIC SUPPORT STRUCTURE AND ITS MANUFACTURING PROCESS |
FR2510806A1 (en) * | 1981-07-30 | 1983-02-04 | Itt | METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITORS AND PRODUCTS OBTAINED |
FR2614168A1 (en) * | 1987-04-15 | 1988-10-21 | Toshiba Kk | MULTI-LAYERED ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURING METHOD |
Also Published As
Publication number | Publication date |
---|---|
ES338549A1 (en) | 1968-04-01 |
NL144473B (en) | 1974-12-16 |
BE694305A (en) | 1967-07-31 |
SE337856B (en) | 1971-08-23 |
CH452016A (en) | 1968-05-15 |
DE1301378B (en) | 1969-08-21 |
GB1178745A (en) | 1970-01-21 |
NL6704510A (en) | 1967-10-02 |
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