NL144473B - PROCESS FOR MANUFACTURING A CERAMIC CHAIN PACKAGE, CONSISTING OF A NUMBER OF LAYERS, AND A CHAIN PACKAGE, MANUFACTURED IN ACCORDANCE WITH THIS PROCESS. - Google Patents

PROCESS FOR MANUFACTURING A CERAMIC CHAIN PACKAGE, CONSISTING OF A NUMBER OF LAYERS, AND A CHAIN PACKAGE, MANUFACTURED IN ACCORDANCE WITH THIS PROCESS.

Info

Publication number
NL144473B
NL144473B NL676704510A NL6704510A NL144473B NL 144473 B NL144473 B NL 144473B NL 676704510 A NL676704510 A NL 676704510A NL 6704510 A NL6704510 A NL 6704510A NL 144473 B NL144473 B NL 144473B
Authority
NL
Netherlands
Prior art keywords
chain package
manufactured
layers
accordance
manufacturing
Prior art date
Application number
NL676704510A
Other languages
Dutch (nl)
Other versions
NL6704510A (en
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of NL6704510A publication Critical patent/NL6704510A/xx
Publication of NL144473B publication Critical patent/NL144473B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Products (AREA)
  • Conductive Materials (AREA)
NL676704510A 1966-03-30 1967-03-30 PROCESS FOR MANUFACTURING A CERAMIC CHAIN PACKAGE, CONSISTING OF A NUMBER OF LAYERS, AND A CHAIN PACKAGE, MANUFACTURED IN ACCORDANCE WITH THIS PROCESS. NL144473B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US53877066A 1966-03-30 1966-03-30

Publications (2)

Publication Number Publication Date
NL6704510A NL6704510A (en) 1967-10-02
NL144473B true NL144473B (en) 1974-12-16

Family

ID=24148353

Family Applications (1)

Application Number Title Priority Date Filing Date
NL676704510A NL144473B (en) 1966-03-30 1967-03-30 PROCESS FOR MANUFACTURING A CERAMIC CHAIN PACKAGE, CONSISTING OF A NUMBER OF LAYERS, AND A CHAIN PACKAGE, MANUFACTURED IN ACCORDANCE WITH THIS PROCESS.

Country Status (8)

Country Link
BE (1) BE694305A (en)
CH (1) CH452016A (en)
DE (1) DE1301378B (en)
ES (1) ES338549A1 (en)
FR (1) FR1512995A (en)
GB (1) GB1178745A (en)
NL (1) NL144473B (en)
SE (1) SE337856B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL169260C (en) * 1971-04-16 1982-06-16 Tam Ceramics Inc METHOD OF MANUFACTURING SINTERED CERAMIC OBJECTS CONTAINING CONDUCTORS
DE2306236C2 (en) * 1973-02-08 1982-11-25 Siemens AG, 1000 Berlin und 8000 München Process for the production of multilayer circuits with conductive layers on both sides of a ceramic substrate
US3999004A (en) * 1974-09-27 1976-12-21 International Business Machines Corporation Multilayer ceramic substrate structure
GB2103422B (en) * 1981-07-30 1985-02-27 Standard Telephones Cables Ltd Ceramic capacitors
EP0089550A3 (en) * 1982-03-19 1984-09-26 DRALORIC Electronic GmbH Monolithic condenser, and method of making it
US4584629A (en) * 1984-07-23 1986-04-22 Avx Corporation Method of making ceramic capacitor and resulting article
JP2579937B2 (en) * 1987-04-15 1997-02-12 株式会社東芝 Electronic circuit device and method of manufacturing the same
KR920006856B1 (en) * 1990-04-07 1992-08-20 한국과학기술연구원 Manufacturing method of multi-layer ceramic condenser by using injection electrode method
CN101248709A (en) * 2005-05-18 2008-08-20 哈佛大学 Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks
WO2013120908A1 (en) * 2012-02-17 2013-08-22 Sony Dadc Austria Ag Microstructured polymer devices
CN109511218A (en) * 2018-12-16 2019-03-22 天津荣事顺发电子有限公司 A kind of multilayer ceramic circuit board preparation method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE631489A (en) * 1962-04-27

Also Published As

Publication number Publication date
DE1301378B (en) 1969-08-21
GB1178745A (en) 1970-01-21
ES338549A1 (en) 1968-04-01
SE337856B (en) 1971-08-23
NL6704510A (en) 1967-10-02
CH452016A (en) 1968-05-15
BE694305A (en) 1967-07-31
FR1512995A (en) 1968-02-09

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee
NL80 Information provided on patent owner name for an already discontinued patent

Owner name: I B M