GB1175282A - Improvements relating to the Manufacture of Multiple-Layer Printed Circuit Boards. - Google Patents

Improvements relating to the Manufacture of Multiple-Layer Printed Circuit Boards.

Info

Publication number
GB1175282A
GB1175282A GB3625967A GB3625967A GB1175282A GB 1175282 A GB1175282 A GB 1175282A GB 3625967 A GB3625967 A GB 3625967A GB 3625967 A GB3625967 A GB 3625967A GB 1175282 A GB1175282 A GB 1175282A
Authority
GB
United Kingdom
Prior art keywords
printed circuit
layer printed
bromide
manufacture
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3625967A
Inventor
Arnold William Butterworth
David Anthony Luke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Priority to GB3625967A priority Critical patent/GB1175282A/en
Publication of GB1175282A publication Critical patent/GB1175282A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1,175,282. Etching. FERRANTI Ltd. 8 July, 1968 [8 Aug., 1967], No. 36259/67. Heading B6J. [Also in Division H1] A multiple-layer printed circuit comprising alternate layers of printed-circuit board and epoxy resin-impregrated glass fibre sheets is etched in a solution of sulphuric acid in water to remove excess epoxy resin from around holes drilled through the circuit, and then immersed in a solution of a cationic surface-active agent in a suitable solvent. The surface active agent may be a quaternary ammonium salt, e.g. cetyl pyridinium bromide, tetradecyl pyredinium bromide or cetyl trimethyl ammonium bromide. The solvent may be water or trichloroethylene.
GB3625967A 1967-08-08 1967-08-08 Improvements relating to the Manufacture of Multiple-Layer Printed Circuit Boards. Expired GB1175282A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3625967A GB1175282A (en) 1967-08-08 1967-08-08 Improvements relating to the Manufacture of Multiple-Layer Printed Circuit Boards.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3625967A GB1175282A (en) 1967-08-08 1967-08-08 Improvements relating to the Manufacture of Multiple-Layer Printed Circuit Boards.

Publications (1)

Publication Number Publication Date
GB1175282A true GB1175282A (en) 1969-12-23

Family

ID=10386471

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3625967A Expired GB1175282A (en) 1967-08-08 1967-08-08 Improvements relating to the Manufacture of Multiple-Layer Printed Circuit Boards.

Country Status (1)

Country Link
GB (1) GB1175282A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2615631A4 (en) * 2010-09-08 2015-03-04 Mitsubishi Gas Chemical Co Processing liquid for suppressing pattern collapse of microstructure, and method for producing microstructure using same
EP2615632A4 (en) * 2010-09-08 2015-03-04 Mitsubishi Gas Chemical Co Treatment liquid for inhibiting pattern collapse in microstructures, and microstructure manufacturing method using said treatment liquid

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2615631A4 (en) * 2010-09-08 2015-03-04 Mitsubishi Gas Chemical Co Processing liquid for suppressing pattern collapse of microstructure, and method for producing microstructure using same
EP2615632A4 (en) * 2010-09-08 2015-03-04 Mitsubishi Gas Chemical Co Treatment liquid for inhibiting pattern collapse in microstructures, and microstructure manufacturing method using said treatment liquid

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees