GB1168554A - Semiconductor Device - Google Patents

Semiconductor Device

Info

Publication number
GB1168554A
GB1168554A GB843267A GB843267A GB1168554A GB 1168554 A GB1168554 A GB 1168554A GB 843267 A GB843267 A GB 843267A GB 843267 A GB843267 A GB 843267A GB 1168554 A GB1168554 A GB 1168554A
Authority
GB
United Kingdom
Prior art keywords
plates
cooling
bodies
disposed
molybdenum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB843267A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Norden Holding AB
Original Assignee
ASEA AB
Allmanna Svenska Elektriska AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASEA AB, Allmanna Svenska Elektriska AB filed Critical ASEA AB
Publication of GB1168554A publication Critical patent/GB1168554A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0106—Neodymium [Nd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13034—Silicon Controlled Rectifier [SCR]

Abstract

1,168,554. Semi-conductor devices &c. ALLMANNA SVENSKA ELEKTRISKA A.B. 22 Feb., 1967 [23 Feb., 1966], No. 8432/67. Heading H1K. A semi-conductor device comprises a unit consisting of a semi-conductor body with or without associated electrode assemblies, mounted between terminal bodies at least one of which is in pressure contact with the unit. At least one of these bodies is connected to or forms part of a cooling body comprising a stack of spaced apart resilient plates. The plates extend laterally beyond the unit and clamping means for providing the pressure contact are disposed on the laterally extending parts. In a typical example the device is a silicon controlled rectifier consisting of a PNP disc soldered between molybdenum plates with aluminium and goldantimony alloy respectively. The disc is mounted between dished plates silver soldered at their periphery to ceramic rings, which are likewise soldered, to metal rings which are subsequently joined by cold welding or solder to form a sealed housing, from which the control electrode extends between the rings. The housing 13 (Fig. 1) is held between bosses formed on members 14, 15, which are bolted and riveted to resilient cooling plates held apart by spacers 24, the outermost plates being bent over to channel cooling air between the other plates. Members 14, 15 may be formed integral with the innermost cooling plates. The assembly is clamped together by a pair of bolts extending through each set of cooling plates and engaging nuts built into insulating bodies disposed between the sets of plates. In an alternative form in which the lower set of plates is omitted member 14 is extended laterally to accommodate the clamping bolts. In a simplified arrangement in which the housing contains a diode (Fig. 5, not shown) the bosses form the terminal parts of centrally disposed rivets holding the cooling plates together. In this case the plates in each set extend alternately mainly to left and right of the rivets with the overlapping sections acting to space the plates apart. Suitable materials for the spacers, plates and boss members are copper, aluminium and silumin. It is stated that the sealed devices may alternatively comprise germanium or silicon bodies with deposited electrodes of gold, silver, copper, aluminium, nickel, chromium, molybdenum, lead or alloys thereof, or disposed between electrode plates of fernico, tungsten or molybdenum.
GB843267A 1966-02-23 1967-02-22 Semiconductor Device Expired GB1168554A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE231566A SE321741B (en) 1966-02-23 1966-02-23

Publications (1)

Publication Number Publication Date
GB1168554A true GB1168554A (en) 1969-10-29

Family

ID=20259739

Family Applications (1)

Application Number Title Priority Date Filing Date
GB843267A Expired GB1168554A (en) 1966-02-23 1967-02-22 Semiconductor Device

Country Status (4)

Country Link
DE (1) DE1589428A1 (en)
FR (1) FR1512055A (en)
GB (1) GB1168554A (en)
SE (1) SE321741B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
US4646131A (en) * 1983-01-28 1987-02-24 Mitsubishi Denki Kabushiki Kaisha Rectifier device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3703873A1 (en) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr HEAT SINK, ESPECIALLY FOR COOLING ELECTRONIC COMPONENTS

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
US4646131A (en) * 1983-01-28 1987-02-24 Mitsubishi Denki Kabushiki Kaisha Rectifier device

Also Published As

Publication number Publication date
SE321741B (en) 1970-03-16
FR1512055A (en) 1968-02-02
DE1589428A1 (en) 1970-04-09

Similar Documents

Publication Publication Date Title
US4141030A (en) High-power semiconductor assembly in disk-cell configuration
US4313128A (en) Compression bonded electronic device comprising a plurality of discrete semiconductor devices
GB1172648A (en) An Improved Integral Heat Sink for Semiconductor Devices.
US3581160A (en) Semiconductor rectifier assembly having high explosion rating
US3736474A (en) Solderless semiconductor devices
GB1078779A (en) Semiconductor devices
GB768103A (en) Improvements in or relating to semiconductor devices
US3746947A (en) Semiconductor device
GB1168554A (en) Semiconductor Device
GB1334406A (en) Semiconductor device
GB1332861A (en) Gate controlled switch
US3170098A (en) Compression contacted semiconductor devices
GB1065897A (en) A semiconductor arrangement
GB992472A (en) Semiconductor devices
US3142791A (en) Transistor and housing assembly
GB919947A (en) Semiconductor device
US3293510A (en) Semiconductor controlled rectifier with spring biased electrode contacts
GB992588A (en) Semi-conductor devices
US3377523A (en) Semiconductor device cooled from one side
US3447042A (en) Semi-conductor device comprising two parallel - connected semi - conductor systems in pressure contact
GB1469973A (en) Semiconductor device incorporating a control electrode
GB1177031A (en) Pressure Assembled Semiconductor Device using Massive Flexibly Mounted Terminals
GB1070394A (en) Electron tube assembly
ES448545A1 (en) A controllable semiconductor component having massive heat dissipating conically shaped metal bodies
GB1099874A (en) Semi-conductor devices for high currents