SE321741B - - Google Patents

Info

Publication number
SE321741B
SE321741B SE231566A SE231566A SE321741B SE 321741 B SE321741 B SE 321741B SE 231566 A SE231566 A SE 231566A SE 231566 A SE231566 A SE 231566A SE 321741 B SE321741 B SE 321741B
Authority
SE
Sweden
Application number
SE231566A
Inventor
G Lilja
Original Assignee
Asea Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Ab filed Critical Asea Ab
Priority to SE231566A priority Critical patent/SE321741B/xx
Priority to DE19671589428 priority patent/DE1589428A1/en
Priority to FR95807A priority patent/FR1512055A/en
Priority to GB843267A priority patent/GB1168554A/en
Publication of SE321741B publication Critical patent/SE321741B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
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    • H01L2924/01005—Boron [B]
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    • H01L2924/01051—Antimony [Sb]
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    • H01L2924/0106—Neodymium [Nd]
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    • H01L2924/01074—Tungsten [W]
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    • H01L2924/01079—Gold [Au]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13034—Silicon Controlled Rectifier [SCR]
SE231566A 1966-02-23 1966-02-23 SE321741B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE231566A SE321741B (en) 1966-02-23 1966-02-23
DE19671589428 DE1589428A1 (en) 1966-02-23 1967-02-18 Semiconductor device
FR95807A FR1512055A (en) 1966-02-23 1967-02-21 Semiconductor device
GB843267A GB1168554A (en) 1966-02-23 1967-02-22 Semiconductor Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE231566A SE321741B (en) 1966-02-23 1966-02-23

Publications (1)

Publication Number Publication Date
SE321741B true SE321741B (en) 1970-03-16

Family

ID=20259739

Family Applications (1)

Application Number Title Priority Date Filing Date
SE231566A SE321741B (en) 1966-02-23 1966-02-23

Country Status (4)

Country Link
DE (1) DE1589428A1 (en)
FR (1) FR1512055A (en)
GB (1) GB1168554A (en)
SE (1) SE321741B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
US4646131A (en) * 1983-01-28 1987-02-24 Mitsubishi Denki Kabushiki Kaisha Rectifier device
DE3703873A1 (en) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr HEAT SINK, ESPECIALLY FOR COOLING ELECTRONIC COMPONENTS

Also Published As

Publication number Publication date
DE1589428A1 (en) 1970-04-09
FR1512055A (en) 1968-02-02
GB1168554A (en) 1969-10-29

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