GB1155865A - Stripping Nickel from Metal Substrates - Google Patents
Stripping Nickel from Metal SubstratesInfo
- Publication number
- GB1155865A GB1155865A GB2970266A GB2970266A GB1155865A GB 1155865 A GB1155865 A GB 1155865A GB 2970266 A GB2970266 A GB 2970266A GB 2970266 A GB2970266 A GB 2970266A GB 1155865 A GB1155865 A GB 1155865A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cooh
- acids
- choh
- water soluble
- ammonium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract 6
- 229910052759 nickel Inorganic materials 0.000 title abstract 2
- 239000002184 metal Substances 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- 150000003839 salts Chemical class 0.000 abstract 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 4
- 239000000243 solution Substances 0.000 abstract 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 abstract 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract 2
- 229910000831 Steel Inorganic materials 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 150000001991 dicarboxylic acids Chemical class 0.000 abstract 2
- 239000003112 inhibitor Substances 0.000 abstract 2
- 150000002500 ions Chemical class 0.000 abstract 2
- 229910052708 sodium Inorganic materials 0.000 abstract 2
- 239000011734 sodium Substances 0.000 abstract 2
- 239000010959 steel Substances 0.000 abstract 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 abstract 2
- SLAMLWHELXOEJZ-UHFFFAOYSA-M 2-nitrobenzoate Chemical compound [O-]C(=O)C1=CC=CC=C1[N+]([O-])=O SLAMLWHELXOEJZ-UHFFFAOYSA-M 0.000 abstract 1
- HWTDMFJYBAURQR-UHFFFAOYSA-N 80-82-0 Chemical compound OS(=O)(=O)C1=CC=CC=C1[N+]([O-])=O HWTDMFJYBAURQR-UHFFFAOYSA-N 0.000 abstract 1
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 abstract 1
- 239000004135 Bone phosphate Substances 0.000 abstract 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910001369 Brass Inorganic materials 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric Acid Chemical class [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 abstract 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract 1
- 150000007513 acids Chemical class 0.000 abstract 1
- -1 alkaryl sulphonate Chemical compound 0.000 abstract 1
- 239000001099 ammonium carbonate Substances 0.000 abstract 1
- 235000012501 ammonium carbonate Nutrition 0.000 abstract 1
- 150000003863 ammonium salts Chemical class 0.000 abstract 1
- SOIFLUNRINLCBN-UHFFFAOYSA-N ammonium thiocyanate Chemical compound [NH4+].[S-]C#N SOIFLUNRINLCBN-UHFFFAOYSA-N 0.000 abstract 1
- XYXNTHIYBIDHGM-UHFFFAOYSA-N ammonium thiosulfate Chemical compound [NH4+].[NH4+].[O-]S([O-])(=O)=S XYXNTHIYBIDHGM-UHFFFAOYSA-N 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 150000001491 aromatic compounds Chemical class 0.000 abstract 1
- 239000010951 brass Substances 0.000 abstract 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 150000001735 carboxylic acids Chemical class 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 235000014655 lactic acid Nutrition 0.000 abstract 1
- 235000011090 malic acid Nutrition 0.000 abstract 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 abstract 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 1
- 230000003381 solubilizing effect Effects 0.000 abstract 1
- 235000011044 succinic acid Nutrition 0.000 abstract 1
- 235000002906 tartaric acid Nutrition 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46885665A | 1965-07-01 | 1965-07-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1155865A true GB1155865A (en) | 1969-06-25 |
Family
ID=23861526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2970266A Expired GB1155865A (en) | 1965-07-01 | 1966-07-01 | Stripping Nickel from Metal Substrates |
Country Status (5)
| Country | Link |
|---|---|
| BR (1) | BR6680464D0 (enExample) |
| DE (1) | DE1621634A1 (enExample) |
| ES (1) | ES328510A1 (enExample) |
| GB (1) | GB1155865A (enExample) |
| SE (1) | SE328170B (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2072639A1 (en) * | 2007-12-12 | 2009-06-24 | Rohm and Haas Electronic Materials LLC | Method for adhesion promotion between the nickel and nickel alloy layer and another metal or a dielectric, such as in the manufacture of lead frames for semiconductor devices |
| CN112410791A (zh) * | 2020-04-03 | 2021-02-26 | 上海昕沐化学科技有限公司 | 一种用于镍镀层的高速环保化学退镀液及其制备方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111235619B (zh) * | 2020-01-15 | 2022-05-31 | 东莞市四辉表面处理科技有限公司 | 铝材阳极封孔后高效除镍清洗粉及其制备方法 |
-
1966
- 1966-06-16 BR BR18046466A patent/BR6680464D0/pt unknown
- 1966-06-28 SE SE877666A patent/SE328170B/xx unknown
- 1966-06-28 ES ES0328510A patent/ES328510A1/es not_active Expired
- 1966-06-29 DE DE19661621634 patent/DE1621634A1/de active Pending
- 1966-07-01 GB GB2970266A patent/GB1155865A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2072639A1 (en) * | 2007-12-12 | 2009-06-24 | Rohm and Haas Electronic Materials LLC | Method for adhesion promotion between the nickel and nickel alloy layer and another metal or a dielectric, such as in the manufacture of lead frames for semiconductor devices |
| CN112410791A (zh) * | 2020-04-03 | 2021-02-26 | 上海昕沐化学科技有限公司 | 一种用于镍镀层的高速环保化学退镀液及其制备方法 |
| CN112410791B (zh) * | 2020-04-03 | 2023-01-10 | 上海昕沐化学科技有限公司 | 一种用于镍镀层的高速环保化学退镀液及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| ES328510A1 (es) | 1967-08-16 |
| SE328170B (enExample) | 1970-09-07 |
| BR6680464D0 (pt) | 1973-08-28 |
| DE1621634A1 (de) | 1971-06-03 |
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