GB1153002A - Vibratory Bonding methods and apparatus - Google Patents

Vibratory Bonding methods and apparatus

Info

Publication number
GB1153002A
GB1153002A GB2695166A GB2695166A GB1153002A GB 1153002 A GB1153002 A GB 1153002A GB 2695166 A GB2695166 A GB 2695166A GB 2695166 A GB2695166 A GB 2695166A GB 1153002 A GB1153002 A GB 1153002A
Authority
GB
United Kingdom
Prior art keywords
bonding
pulse
signal
microseconds
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2695166A
Other languages
English (en)
Inventor
Frank Wamboldt Christensen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB1153002A publication Critical patent/GB1153002A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
GB2695166A 1965-07-19 1966-06-16 Vibratory Bonding methods and apparatus Expired GB1153002A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47299965 US3458921A (en) 1965-07-19 1965-07-19 Short pulse vibratory bonding

Publications (1)

Publication Number Publication Date
GB1153002A true GB1153002A (en) 1969-05-21

Family

ID=23877760

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2695166A Expired GB1153002A (en) 1965-07-19 1966-06-16 Vibratory Bonding methods and apparatus

Country Status (7)

Country Link
US (1) US3458921A (US07922777-20110412-C00004.png)
BE (1) BE684350A (US07922777-20110412-C00004.png)
DE (1) DE1577011A1 (US07922777-20110412-C00004.png)
FR (1) FR1487050A (US07922777-20110412-C00004.png)
GB (1) GB1153002A (US07922777-20110412-C00004.png)
NL (1) NL6610145A (US07922777-20110412-C00004.png)
SE (1) SE333413B (US07922777-20110412-C00004.png)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL162580B (nl) * 1970-12-17 1980-01-15 Philips Nv Werkwijze voor het ultrasoonlassen van draden op het metalen oppervlak van een drager.
US3791028A (en) * 1971-09-17 1974-02-12 Ibm Ultrasonic bonding of cubic crystal-structure metals
US4047657A (en) * 1976-11-01 1977-09-13 Branson Ultrasonics Corporation Method and apparatus for joining metal workpieces using high frequency vibratory energy
US4373653A (en) * 1981-09-10 1983-02-15 Raytheon Company Method and apparatus for ultrasonic bonding
KR20030066344A (ko) * 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법
EP1332826A1 (de) * 2002-02-01 2003-08-06 Esec Trading S.A. Verfahren für die Bestimmung optimaler Bondparameter beim Bonden mit einem Wire Bonder
TWI229397B (en) * 2002-10-16 2005-03-11 Esec Trading Sa Method for determining optimum bond parameters when bonding with a wire bonder
DE10347984A1 (de) * 2003-10-15 2005-05-19 Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co Verfahren zum Vibrationsschweißen mit verkürtzter Ausschwingzeit
US7044356B2 (en) * 2003-12-11 2006-05-16 Texas Instruments Incorporated Roller wire brake for wire bonding machine
DE102007054626A1 (de) * 2007-11-12 2009-05-14 Hesse & Knipps Gmbh Verfahren und Vorrichtung zum Ultraschallbonden
DE102009059307A1 (de) * 2009-12-23 2011-06-30 Schunk Sonosystems GmbH, 35435 Verfahren zum elektrisch leitenden Verbinden von Drähten
US20120074206A1 (en) * 2010-09-27 2012-03-29 Kulicke And Soffa Industries, Inc. Methods of forming wire bonds for wire loops and conductive bumps
CN114705357B (zh) * 2022-04-19 2024-03-26 上海工业自动化仪表研究院有限公司 用于磁弹性传感器的相敏解调修正方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056192A (en) * 1957-12-30 1962-10-02 Sonobond Corp Vibratory welding process and apparatus
US3017792A (en) * 1958-07-08 1962-01-23 Aeroprojects Inc Vibratory device
DE1281812C2 (de) * 1961-08-30 1973-04-26 Western Electric Co Vorrichtung zum anschweissen von duennen draehten an halbleiterbauteile mit hilfe der presschweissung (kalt- und warmschweissung), mit einer zufuhr fuer den draht an einem, den pressdruck auf den draht uebertragenden schweisskopf, der an seinem schweissende zur aufnahme des drahtes profiliert ist
US3158928A (en) * 1962-03-30 1964-12-01 Aeroprojects Inc Method and means for operating a generating means coupled through a transducer to a vibratory energy work performing device
US3153850A (en) * 1962-07-18 1964-10-27 Daniel C Worlton Method and device for controlling ultrasonic welding apparatus
US3341935A (en) * 1964-04-23 1967-09-19 Cavitron Ultrasonics Inc Energy storage in high frequency vibratory devices

Also Published As

Publication number Publication date
US3458921A (en) 1969-08-05
BE684350A (US07922777-20110412-C00004.png) 1967-01-03
SE333413B (US07922777-20110412-C00004.png) 1971-03-15
NL6610145A (US07922777-20110412-C00004.png) 1967-01-20
FR1487050A (fr) 1967-06-30
DE1577011A1 (de) 1969-07-10

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees