GB1152165A - Polishing Apparatus - Google Patents

Polishing Apparatus

Info

Publication number
GB1152165A
GB1152165A GB24790/67A GB2479067A GB1152165A GB 1152165 A GB1152165 A GB 1152165A GB 24790/67 A GB24790/67 A GB 24790/67A GB 2479067 A GB2479067 A GB 2479067A GB 1152165 A GB1152165 A GB 1152165A
Authority
GB
United Kingdom
Prior art keywords
layer
polishing
adhesive
porous
affixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB24790/67A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Geoscience Instruments Corp
Original Assignee
Geoscience Instruments Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Geoscience Instruments Corp filed Critical Geoscience Instruments Corp
Publication of GB1152165A publication Critical patent/GB1152165A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/02—Wheels in one piece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

1,152,165. Polishing. GEOSCIENCE INSTRUMENTS CORP. 30 May, 1967 [5 July, 1966], No. 24790/67. Heading B3D. An assembly for polishing a workpiece comprises an active polishing layer having first and second surfaces, a lapping substrate, and means for mounting said polishing layer with said second surface disposed on said lapping substrate, said active polishing layer comprising a micro-porous and permeable coriaceous non- woven sheet material having a urethane polymer base reinforced with polyester. A layer 20 of " Corfam " (Registered Trade Mark) has affixed thereto by adhesive 30 a layer 35 of nitrile rubber having a coating 40 of pressure sensitive, clean release adhesive for removable attachment to a metal plate 45. Workpieces 15, e.g. semi-conductor wafers, are mounted on a rotating block 10. Polishing slurry is supplied through a nozzle 51. A porous film 23, e.g. of foam polyurethane, may be affixed by porous adhesive 25 to the upper surface of the layer 20.
GB24790/67A 1966-07-05 1967-05-30 Polishing Apparatus Expired GB1152165A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56275766A 1966-07-05 1966-07-05

Publications (1)

Publication Number Publication Date
GB1152165A true GB1152165A (en) 1969-05-14

Family

ID=24247641

Family Applications (1)

Application Number Title Priority Date Filing Date
GB24790/67A Expired GB1152165A (en) 1966-07-05 1967-05-30 Polishing Apparatus

Country Status (2)

Country Link
US (1) US3504457A (en)
GB (1) GB1152165A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0239040A1 (en) * 1986-03-25 1987-09-30 Rodel, Inc. Pad material for grinding, lapping and polishing

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3857123A (en) * 1970-10-21 1974-12-31 Monsanto Co Apparatus for waxless polishing of thin wafers
US3841031A (en) * 1970-10-21 1974-10-15 Monsanto Co Process for polishing thin elements
US3947953A (en) * 1974-08-23 1976-04-06 Nitto Electric Industrial Co., Ltd. Method of making plastic sealed cavity molded type semi-conductor devices
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
JPS63283857A (en) * 1987-05-15 1988-11-21 Asahi Chem Ind Co Ltd Polishing cloth
US4841680A (en) * 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
EP0304645B1 (en) * 1987-08-25 1993-08-25 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
JPH01193166A (en) * 1988-01-28 1989-08-03 Showa Denko Kk Pad for specularly grinding semiconductor wafer
US5257478A (en) * 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
DE69110456T2 (en) * 1990-03-22 1995-12-14 Westech Systems Inc DEVICE FOR INTERLAYER PLANNING OF SEMICONDUCTORS.
JPH0697132A (en) * 1992-07-10 1994-04-08 Lsi Logic Corp Mechanochemical polishing apparatus of semiconductor wafer, mounting method of semiconductor-wafer polishing pad to platen of above apparatus and polishing composite pad of above apparatus
JP2655975B2 (en) * 1992-09-18 1997-09-24 三菱マテリアル株式会社 Wafer polishing equipment
US5435772A (en) * 1993-04-30 1995-07-25 Motorola, Inc. Method of polishing a semiconductor substrate
JP2509870B2 (en) * 1993-06-30 1996-06-26 千代田株式会社 Polishing cloth
EP1080797A3 (en) * 1994-06-28 2005-10-05 Ebara Corporation Method and apparatus for cleaning workpiece
JP2616736B2 (en) * 1995-01-25 1997-06-04 日本電気株式会社 Wafer polishing equipment
JP3329644B2 (en) * 1995-07-21 2002-09-30 株式会社東芝 Polishing pad, polishing apparatus and polishing method
JPH0955362A (en) * 1995-08-09 1997-02-25 Cypress Semiconductor Corp Manufacture of integrated circuit for reduction of scratch
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
KR100487455B1 (en) * 1997-01-13 2005-05-09 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 Polymeric Polishing Pad Having Photolithographically Induced Surface Pattern(s) and Methods Relating Thereto
US8092707B2 (en) 1997-04-30 2012-01-10 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication
US6284114B1 (en) 1997-09-29 2001-09-04 Rodel Holdings Inc. Method of fabricating a porous polymeric material by electrophoretic deposition
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US6095902A (en) * 1998-09-23 2000-08-01 Rodel Holdings, Inc. Polyether-polyester polyurethane polishing pads and related methods
US6238592B1 (en) 1999-03-10 2001-05-29 3M Innovative Properties Company Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
US6431959B1 (en) 1999-12-20 2002-08-13 Lam Research Corporation System and method of defect optimization for chemical mechanical planarization of polysilicon
EP1212171A1 (en) 1999-12-23 2002-06-12 Rodel Holdings, Inc. Self-leveling pads and methods relating thereto
US6746311B1 (en) * 2000-01-24 2004-06-08 3M Innovative Properties Company Polishing pad with release layer
US6676497B1 (en) * 2000-09-08 2004-01-13 Applied Materials Inc. Vibration damping in a chemical mechanical polishing system
US7497767B2 (en) * 2000-09-08 2009-03-03 Applied Materials, Inc. Vibration damping during chemical mechanical polishing
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
JP4177100B2 (en) * 2000-12-01 2008-11-05 東洋ゴム工業株式会社 Polishing pad, method for producing the same, and cushion layer for polishing pad
US6863774B2 (en) * 2001-03-08 2005-03-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
JP2003100682A (en) 2001-09-25 2003-04-04 Jsr Corp Polishing pad for semiconductor wafer
US7037184B2 (en) * 2003-01-22 2006-05-02 Raytech Innovation Solutions, Llc Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
US6852020B2 (en) * 2003-01-22 2005-02-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
US7025668B2 (en) * 2002-06-18 2006-04-11 Raytech Innovative Solutions, Llc Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
US20070087177A1 (en) * 2003-10-09 2007-04-19 Guangwei Wu Stacked pad and method of use
US7618529B2 (en) 2004-05-25 2009-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc Polishing pad for electrochemical mechanical polishing
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
WO2007016498A2 (en) * 2005-08-02 2007-02-08 Raytech Composites, Inc. Nonwoven polishing pads for chemical mechanical polishing
KR20110010727A (en) * 2008-05-16 2011-02-07 도레이 카부시키가이샤 Polishing pad
TWI510328B (en) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd Base layer, polishing pad including the same and polishing method
JP6016301B2 (en) 2013-02-13 2016-10-26 昭和電工株式会社 Surface processing method of single crystal SiC substrate, manufacturing method thereof, and grinding plate for surface processing of single crystal SiC substrate
JP6401988B2 (en) * 2014-09-24 2018-10-10 株式会社ディスコ Processing apparatus and wafer processing method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3123953A (en) * 1964-03-10 merkl
CA681832A (en) * 1964-03-10 Dominion Rubber Company Flexible laminate
US671130A (en) * 1900-05-02 1901-04-02 Newton J Darden Pencil-sharpener.
US804853A (en) * 1905-03-17 1905-11-21 Charles L Ireson Method of attachment of rubber and leather.
US1923719A (en) * 1931-04-27 1933-08-22 Gen Electric Stropping material
US2650158A (en) * 1950-08-03 1953-08-25 Carborundum Co Scouring implement
US2644280A (en) * 1950-09-13 1953-07-07 Carborundum Co Sanding disk accessory
NL248517A (en) * 1959-02-18
US3082582A (en) * 1960-07-21 1963-03-26 Formax Mfg Corp Sanding pad assembly
US3360889A (en) * 1962-12-31 1968-01-02 Indiana Contact Lens Inc Method for altering the power of a corneal contact lens

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0239040A1 (en) * 1986-03-25 1987-09-30 Rodel, Inc. Pad material for grinding, lapping and polishing
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing

Also Published As

Publication number Publication date
US3504457A (en) 1970-04-07
DE1652046A1 (en) 1970-05-14

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees