GB1146223A - Heat producing apparatus - Google Patents

Heat producing apparatus

Info

Publication number
GB1146223A
GB1146223A GB210167A GB210167A GB1146223A GB 1146223 A GB1146223 A GB 1146223A GB 210167 A GB210167 A GB 210167A GB 210167 A GB210167 A GB 210167A GB 1146223 A GB1146223 A GB 1146223A
Authority
GB
United Kingdom
Prior art keywords
plate
diodes
diode
heating element
heat sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB210167A
Inventor
Sydney Dix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
G T I CORP OF PROVIDENCE
Original Assignee
G T I CORP OF PROVIDENCE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by G T I CORP OF PROVIDENCE filed Critical G T I CORP OF PROVIDENCE
Priority to GB210167A priority Critical patent/GB1146223A/en
Publication of GB1146223A publication Critical patent/GB1146223A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D11/00—Arrangement of elements for electric heating in or on furnaces
    • F27D11/02—Ohmic resistance heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Die Bonding (AREA)

Abstract

1,146,223. Resistance heating. G.T.I. CORP. 14 Jan., 1967, No. 2101/67. Heading H5H. A heating apparatus which may be used for instance to heat seal semi-conductor diodes comprises a metal or carbon heating element 200 formed with a plurality of recesses 210 into each of which a diode is inserted to be heated by the element when a heavy current passes through it. The diode terminals 220, 222 are urged together during heat sealing by weights 232 loosely held in a plate 226. The assembly is mounted upon current supplying pillars 202 within a chamber (Figs. 1-3, not shown) which can be evacuated and filled with inert gas such as nitrogen or argon. In a modification (Fig. 5, not shown) the diodes are separately supported in a work carrier (300) which serves as a heat sink and the heating element (328) surrounds only the tip of the diode to be sealed. Heater (328) and the weight plate 226 can be raised or lowered by gearing (340). In a further modification (Fig. 11, not shown) the weights 232 are replaced by a spring device (578) acting on the lower lead of the diode while the upper one is firmly supported. In another embodiment (Fig. 6, not shown) the heating element (402) is in two parts, the diodes being held in recesses between them. The two parts are urged together and into engagement with current supplying pillars (430, 432) by spring mechanism operated by closing the lid (460) of the chamber. The temperature of the plate (402) may be controlled by a thermostat (480). The, diodes may be weighted as before or the weight may be supported directly upon the upper heater plate (626), (Fig. 13, not shown). As well as heat sealing similar apparatus may be used to solder on the leads of the diodes (Figs. 9, 10, not shown) and also for heat sealing the casings of reed contact devices (Fig. 12, not shown) or integrated circuit devices (Figs. 14, 15, not shown). The ends of the graphite heater plate may be clamped between metal bus-bars extending across the plate to ensure an even distribution of the current through the plate.
GB210167A 1967-01-14 1967-01-14 Heat producing apparatus Expired GB1146223A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB210167A GB1146223A (en) 1967-01-14 1967-01-14 Heat producing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB210167A GB1146223A (en) 1967-01-14 1967-01-14 Heat producing apparatus

Publications (1)

Publication Number Publication Date
GB1146223A true GB1146223A (en) 1969-03-19

Family

ID=9733628

Family Applications (1)

Application Number Title Priority Date Filing Date
GB210167A Expired GB1146223A (en) 1967-01-14 1967-01-14 Heat producing apparatus

Country Status (1)

Country Link
GB (1) GB1146223A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0450713A1 (en) * 1990-03-30 1991-10-09 Rjr Polymers Inc Iso-thermal seal process for electronic devices
WO2014025607A1 (en) * 2012-08-07 2014-02-13 Excelitas Technologies Singapore, Pte. Ltd. Panelized process for smt sensor devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0450713A1 (en) * 1990-03-30 1991-10-09 Rjr Polymers Inc Iso-thermal seal process for electronic devices
WO2014025607A1 (en) * 2012-08-07 2014-02-13 Excelitas Technologies Singapore, Pte. Ltd. Panelized process for smt sensor devices
US8806743B2 (en) 2012-08-07 2014-08-19 Excelitas Technologies Singapore Pte. Ltd Panelized process for SMT sensor devices

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