GB1140228A - Improvements in or relating to electric semiconductor arrangements - Google Patents

Improvements in or relating to electric semiconductor arrangements

Info

Publication number
GB1140228A
GB1140228A GB35896/66A GB3589666A GB1140228A GB 1140228 A GB1140228 A GB 1140228A GB 35896/66 A GB35896/66 A GB 35896/66A GB 3589666 A GB3589666 A GB 3589666A GB 1140228 A GB1140228 A GB 1140228A
Authority
GB
United Kingdom
Prior art keywords
conductor
semi
housing
arrangement
aug
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB35896/66A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB1140228A publication Critical patent/GB1140228A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01063—Europium [Eu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Rectifiers (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

1,140,228. Semi-conductor devices. SIEMENS - SCHUCKERTWERKE A.G. 10 Aug., 1966 [12 Aug., 1965], No. 35896/66. Heading H1K. A semi-conductor arrangement (such as the bridge rectifier of Fig. 4), consisting of one or more semi-conductor elements sandwiched between members such as conductor bars 11, 12, 13, 14 extending substantially beyond the edges of the semi-conductor element or elements, is fitted into an oblong section housing as shown in section in Fig. 2, by sliding members 11, 14 of the arrangement into guideways 5, 6 in the shorter side walls of the housing. The housing may subsequently be filled and sealed with solid insulation, preferably by filling the housing with a resinous insulant in liquid form before inserting the semi-conductor arrangement, and heating to cure the resin after insertion. The invention is particularly applicable to the encapsulation of an arrangement having the constructional features and/or produced by the method claimed in Specification 1,057,003.
GB35896/66A 1963-05-29 1966-08-10 Improvements in or relating to electric semiconductor arrangements Expired GB1140228A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0085453 1963-05-29
DE1965S0098794 DE1514531B2 (en) 1963-05-29 1965-08-12 SEMICONDUCTOR COMPONENT AND METHOD FOR ITS PRODUCTION

Publications (1)

Publication Number Publication Date
GB1140228A true GB1140228A (en) 1969-01-15

Family

ID=25997254

Family Applications (2)

Application Number Title Priority Date Filing Date
GB22462/64A Expired GB1057003A (en) 1963-05-29 1964-05-29 Improvements in or relating to electric semiconductor arrangements
GB35896/66A Expired GB1140228A (en) 1963-05-29 1966-08-10 Improvements in or relating to electric semiconductor arrangements

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB22462/64A Expired GB1057003A (en) 1963-05-29 1964-05-29 Improvements in or relating to electric semiconductor arrangements

Country Status (6)

Country Link
CH (2) CH421307A (en)
DE (2) DE1439244B2 (en)
FR (1) FR1396814A (en)
GB (2) GB1057003A (en)
NL (2) NL6406071A (en)
SE (2) SE316529B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8638535B2 (en) * 2011-01-10 2014-01-28 Hamilton Sundstrand Corporation Vertical mount transient voltage suppressor array

Also Published As

Publication number Publication date
NL6406071A (en) 1964-11-30
SE316529B (en) 1969-10-27
CH452060A (en) 1968-05-31
DE1439244A1 (en) 1969-04-03
NL6611316A (en) 1967-02-13
DE1514531B2 (en) 1976-08-12
SE345039B (en) 1972-05-08
DE1514531A1 (en) 1970-03-26
CH421307A (en) 1966-09-30
FR1396814A (en) 1965-04-23
DE1439244B2 (en) 1971-06-09
GB1057003A (en) 1967-02-01

Similar Documents

Publication Publication Date Title
GB1282251A (en) Shielded semiconductor device
AT245247B (en) Vulcanizable composition, in particular for insulating electrical conductors in the high voltage area
IT1046891B (en) PROCEDURE FOR ENCAPSULATING ELECTRICAL COMPONENTS AND FORM USED FOR THAT PROCEDURE
SE411974B (en) PROCEDURE FOR INSULATING ELECTRICAL CONDUCTORS WITH SOLVENT-FREE CURABLE POLYESTERIMIDE RESIN
GB1254034A (en) Improvements in or relating to a sealing device for a terminal for a multi-conductor cable cooled by a circulating fluid
GB961057A (en) Improvements in or relating to encapsulated assemblies
GB1117297A (en) Voltage lead entrance for encapsulated electrical devices
GB1140228A (en) Improvements in or relating to electric semiconductor arrangements
CH543802A (en) Plastic electrical insulator
GB719126A (en) Improvements in connecting terminal leads to electrical circuit elements
JPS5710952A (en) Resin sealed type semiconductor device
SE8204203L (en) ELECTRIC CIRCUIT
ES313785A1 (en) Method of making a battery
GB1083488A (en) Electrical conductors
SE381271B (en) METHOD OF MANUFACTURING AN ELECTRIC HIGH VOLTAGE CONDUCTOR WITH AN INSULATING COVER OF AN ETHEN POLYMER
JPS52149481A (en) Semiconductor integrated circuit device and its production
DK139997B (en) Method for insulating electrical conductors using a polyesterimide resin melt.
GB1255780A (en) Thyristor assemblies
JPS51140104A (en) Winding of three-phase electric machinery
CH521675A (en) Gas-insulated, encapsulated high-voltage switchgear with connected electrical component
DE1236076B (en)
JPS55108771A (en) Semiconductor device
GB1311238A (en) Electric cable sealing end
GB1190166A (en) Random Wound Encapsulated Coil Assembly
GB1109597A (en) Semi-conductor assemblies