GB1131462A - Process for preheating shaped bodies in the deposition of semiconductor materials - Google Patents

Process for preheating shaped bodies in the deposition of semiconductor materials

Info

Publication number
GB1131462A
GB1131462A GB104966A GB104966A GB1131462A GB 1131462 A GB1131462 A GB 1131462A GB 104966 A GB104966 A GB 104966A GB 104966 A GB104966 A GB 104966A GB 1131462 A GB1131462 A GB 1131462A
Authority
GB
United Kingdom
Prior art keywords
deposition
heater
semi
conductor material
semiconductor materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB104966A
Inventor
Eduard Enk
Horst Teich
Julius Nickl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacker Chemie AG
Original Assignee
Wacker Chemie AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemie AG filed Critical Wacker Chemie AG
Publication of GB1131462A publication Critical patent/GB1131462A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/02Silicon
    • C01B33/021Preparation
    • C01B33/027Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
    • C01B33/035Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/08Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal halides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

1,131,462. Deposition of semi-conductor material. WACKER-CHEMIE G.m.b.H. 10 Jan., 1966, No. 1049/66. Heading C1A. [Also in Divisions C7 and H5] In a process for depositing an elemental semiconductor material from a gaseous compound thereof on to a body of the same semi-conductor material heated by direct passage of current, in a metal vessel internally plated with Ti, Ag, Au, or Pt, and having a diameter greater than 150 mm., the body is preheated by an electric heater, fed by a different circuit from that used for direct heating, which is removed from the vessel, or swung away from the body, before deposition is effected. The semi-conductor material may be Si or B. The heater may be a strip heater swung away from the wall to a position 5-10 mm. from 1 or 2 bodies, or a rod heater introduced from above symmetrically between several bodies. It may be enclosed in a jacket of quartz, noble metal, or Al 2 O 3 .
GB104966A 1965-10-27 1966-01-10 Process for preheating shaped bodies in the deposition of semiconductor materials Expired GB1131462A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6513928A NL6513928A (en) 1965-10-27 1965-10-27

Publications (1)

Publication Number Publication Date
GB1131462A true GB1131462A (en) 1968-10-23

Family

ID=19794484

Family Applications (1)

Application Number Title Priority Date Filing Date
GB104966A Expired GB1131462A (en) 1965-10-27 1966-01-10 Process for preheating shaped bodies in the deposition of semiconductor materials

Country Status (2)

Country Link
GB (1) GB1131462A (en)
NL (1) NL6513928A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009120859A1 (en) * 2008-03-26 2009-10-01 Gt Solar, Inc. Gold-coated polysilicon reactor system and method
US20110318909A1 (en) * 2010-06-29 2011-12-29 Gt Solar Incorporated System and method of semiconductor manufacturing with energy recovery
KR101145014B1 (en) * 2011-09-15 2012-05-11 웅진폴리실리콘주식회사 Cvd reactor formed with ni-mn alloy layer on its inner wall for reflecting radiant heat and protecting diffusion of impurities and method of manufacturing the same
EP2578724A1 (en) 2011-10-07 2013-04-10 Wacker Chemie AG Apparatus and process for deposition of polycrystalline silicon
CN103098173A (en) * 2010-07-19 2013-05-08 瑞科硅公司 Polycrystalline silicon production
US10450649B2 (en) 2014-01-29 2019-10-22 Gtat Corporation Reactor filament assembly with enhanced misalignment tolerance
US11015244B2 (en) 2013-12-30 2021-05-25 Advanced Material Solutions, Llc Radiation shielding for a CVD reactor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009120859A1 (en) * 2008-03-26 2009-10-01 Gt Solar, Inc. Gold-coated polysilicon reactor system and method
TWI464292B (en) * 2008-03-26 2014-12-11 Gtat Corp Gold-coated polysilicon reactor system and method
US20110318909A1 (en) * 2010-06-29 2011-12-29 Gt Solar Incorporated System and method of semiconductor manufacturing with energy recovery
CN103098173A (en) * 2010-07-19 2013-05-08 瑞科硅公司 Polycrystalline silicon production
KR101145014B1 (en) * 2011-09-15 2012-05-11 웅진폴리실리콘주식회사 Cvd reactor formed with ni-mn alloy layer on its inner wall for reflecting radiant heat and protecting diffusion of impurities and method of manufacturing the same
EP2578724A1 (en) 2011-10-07 2013-04-10 Wacker Chemie AG Apparatus and process for deposition of polycrystalline silicon
DE102011084137A1 (en) 2011-10-07 2013-04-11 Wacker Chemie Ag Apparatus and method for depositing polycrystalline silicon
US9534290B2 (en) 2011-10-07 2017-01-03 Wacker Chemie Ag Apparatus for deposition of polycrystalline silicon comprising uniformly spaced filament rods and gas inlet orifices, and process for deposition of polycrystalline silicon using same
US11015244B2 (en) 2013-12-30 2021-05-25 Advanced Material Solutions, Llc Radiation shielding for a CVD reactor
US10450649B2 (en) 2014-01-29 2019-10-22 Gtat Corporation Reactor filament assembly with enhanced misalignment tolerance

Also Published As

Publication number Publication date
NL6513928A (en) 1967-04-28

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