GB1126986A - Improvements in hybrid microcircuits - Google Patents

Improvements in hybrid microcircuits

Info

Publication number
GB1126986A
GB1126986A GB1925066A GB1925066A GB1126986A GB 1126986 A GB1126986 A GB 1126986A GB 1925066 A GB1925066 A GB 1925066A GB 1925066 A GB1925066 A GB 1925066A GB 1126986 A GB1126986 A GB 1126986A
Authority
GB
United Kingdom
Prior art keywords
plate
plates
kovar
conductors
cavities
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1925066A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUROP DES SEMICONDUCTEURS SOC
Original Assignee
EUROP DES SEMICONDUCTEURS SOC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUROP DES SEMICONDUCTEURS SOC filed Critical EUROP DES SEMICONDUCTEURS SOC
Publication of GB1126986A publication Critical patent/GB1126986A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

1,126,986. Semi-conductor devices; circuit assemblies. SOC. EUROPEENNE DES SEMICONDUCTEURS. 2 May, 1966 [30 April, 1965], No. 19250/66. Headings H1K and H1R. A hybrid microcircuit is made by depositing passive components and conductors 6, 9 on one face of a first insulating plate 19, and locating semi-conductor devices such as transistors 1, 2 in cavities 21, 22 in a second insulating plate 20; the two plates 19, 20 are placed together, planar terminal areas on devices 1, 2 being, urged against connection areas on plate 19 by molybdenum springs 23, 24 in cavities 21, 22, and the plates are sealed together by. the insertion of a peripheral frame 25, of, e.g. "Kovar" (Registered Trade-Mark), followed by heating in a rare gas atmosphere. A plurality of "Kovar" tapes (or wires) 13 are sealed through plate 19, which may be of glass or ceramic, preferably during the formation of. the plate, and are levelled off flush with the internal face of the plate. The invention is described with reference to the manufacture of a transistorized two-stage amplifier (Fig. 1, not shown). Passive components and connections, which, are deposited on. plate 19 by evaporation in vacuo, comprise resistors of Ni-Cr, alloy, conductors of Cr or Ni-Cr having a coating of Au thereon, and capacitors of which the dielectric is-formed by SiO. The terminal areas ontransistors 1, 2 areformed of Cr or Ni-Cr coated with. Au, and may be bonded to adjacent connection areas on plate 19 by heating. The plates may be made of-soft glass, and sealed together with an insert of copper-clad: Ni-Fe alloy wire.
GB1925066A 1965-04-30 1966-05-02 Improvements in hybrid microcircuits Expired GB1126986A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR15369A FR1441753A (en) 1965-04-30 1965-04-30 Improvements to hybrid microcircuits

Publications (1)

Publication Number Publication Date
GB1126986A true GB1126986A (en) 1968-09-11

Family

ID=8577734

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1925066A Expired GB1126986A (en) 1965-04-30 1966-05-02 Improvements in hybrid microcircuits

Country Status (2)

Country Link
FR (1) FR1441753A (en)
GB (1) GB1126986A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089936A (en) * 1988-09-09 1992-02-18 Hitachi, Ltd. Semiconductor module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089936A (en) * 1988-09-09 1992-02-18 Hitachi, Ltd. Semiconductor module

Also Published As

Publication number Publication date
FR1441753A (en) 1966-06-10

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