GB1125417A - Transistor assembly - Google Patents

Transistor assembly

Info

Publication number
GB1125417A
GB1125417A GB35124/66A GB3512466A GB1125417A GB 1125417 A GB1125417 A GB 1125417A GB 35124/66 A GB35124/66 A GB 35124/66A GB 3512466 A GB3512466 A GB 3512466A GB 1125417 A GB1125417 A GB 1125417A
Authority
GB
United Kingdom
Prior art keywords
preform
transistor
emitter
wires
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB35124/66A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Publication of GB1125417A publication Critical patent/GB1125417A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Microwave Amplifiers (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
  • Amplifiers (AREA)
  • Power Conversion In General (AREA)
GB35124/66A 1965-08-19 1966-08-05 Transistor assembly Expired GB1125417A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US480870A US3387190A (en) 1965-08-19 1965-08-19 High frequency power transistor having electrodes forming transmission lines

Publications (1)

Publication Number Publication Date
GB1125417A true GB1125417A (en) 1968-08-28

Family

ID=23909674

Family Applications (1)

Application Number Title Priority Date Filing Date
GB35124/66A Expired GB1125417A (en) 1965-08-19 1966-08-05 Transistor assembly

Country Status (5)

Country Link
US (1) US3387190A (https=)
DE (1) DE1539863C3 (https=)
ES (1) ES330410A1 (https=)
GB (1) GB1125417A (https=)
NL (1) NL151840B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2238908A (en) * 1989-12-05 1991-06-12 Mitsubishi Electric Corp High-frequency semiconductor device

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3479570A (en) * 1966-06-14 1969-11-18 Rca Corp Encapsulation and connection structure for high power and high frequency semiconductor devices
JPS4697Y1 (https=) * 1967-03-09 1971-01-06
DE1914442C3 (de) * 1969-03-21 1978-05-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiteranordnung
US3671793A (en) * 1969-09-16 1972-06-20 Itt High frequency transistor structure having an impedance transforming network incorporated on the semiconductor chip
US3614546A (en) * 1970-01-07 1971-10-19 Rca Corp Shielded semiconductor device
US3649872A (en) * 1970-07-15 1972-03-14 Trw Inc Packaging structure for high-frequency semiconductor devices
US3710202A (en) * 1970-09-09 1973-01-09 Rca Corp High frequency power transistor support
US3641398A (en) * 1970-09-23 1972-02-08 Rca Corp High-frequency semiconductor device
US3728589A (en) * 1971-04-16 1973-04-17 Rca Corp Semiconductor assembly
US3715635A (en) * 1971-06-25 1973-02-06 Bendix Corp High frequency matched impedance microcircuit holder
US3784883A (en) * 1971-07-19 1974-01-08 Communications Transistor Corp Transistor package
US3855606A (en) * 1971-12-23 1974-12-17 Licentia Gmbh Semiconductor arrangement
US3733525A (en) * 1972-03-20 1973-05-15 Collins Radio Co Rf microwave amplifier and carrier
US3916434A (en) * 1972-11-30 1975-10-28 Power Hybrids Inc Hermetically sealed encapsulation of semiconductor devices
US3898594A (en) * 1973-11-02 1975-08-05 Trw Inc Microwave semiconductor device package
US3996603A (en) * 1974-10-18 1976-12-07 Motorola, Inc. RF power semiconductor package and method of manufacture
US4213141A (en) * 1978-05-12 1980-07-15 Solid State Scientific Inc. Hybrid transistor
US4183041A (en) * 1978-06-26 1980-01-08 Rca Corporation Self biasing of a field effect transistor mounted in a flip-chip carrier
JPS6022345A (ja) * 1983-07-19 1985-02-04 Toyota Central Res & Dev Lab Inc 半導体装置
JP3364404B2 (ja) * 1997-02-12 2003-01-08 株式会社東芝 半導体の入出力接続構造
US8034666B2 (en) * 2009-11-15 2011-10-11 Microsemi Corporation Multi-layer thick-film RF package
US8410601B2 (en) * 2009-11-15 2013-04-02 Microsemi Corporation RF package

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3259814A (en) * 1955-05-20 1966-07-05 Rca Corp Power semiconductor assembly including heat dispersing means
US3021461A (en) * 1958-09-10 1962-02-13 Gen Electric Semiconductor device
US3257588A (en) * 1959-04-27 1966-06-21 Rca Corp Semiconductor device enclosures
DE1113718B (de) * 1959-05-15 1961-09-14 Telefunken Patent Halbleiteranordnung mit kleiner Zuleitungsinduktivitaet
NL275288A (https=) * 1961-02-28
US3267341A (en) * 1962-02-09 1966-08-16 Hughes Aircraft Co Double container arrangement for transistors
BE631066A (https=) * 1962-04-16

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2238908A (en) * 1989-12-05 1991-06-12 Mitsubishi Electric Corp High-frequency semiconductor device
GB2238908B (en) * 1989-12-05 1993-09-22 Mitsubishi Electric Corp High-frequency semiconductor device

Also Published As

Publication number Publication date
DE1539863A1 (de) 1970-01-22
ES330410A1 (es) 1967-06-16
DE1539863B2 (https=) 1979-06-13
NL151840B (nl) 1976-12-15
NL6611693A (https=) 1967-02-20
US3387190A (en) 1968-06-04
DE1539863C3 (de) 1980-02-21

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