GB1117713A - Method of manufacture of an integrated circuit - Google Patents
Method of manufacture of an integrated circuitInfo
- Publication number
- GB1117713A GB1117713A GB355167A GB355167A GB1117713A GB 1117713 A GB1117713 A GB 1117713A GB 355167 A GB355167 A GB 355167A GB 355167 A GB355167 A GB 355167A GB 1117713 A GB1117713 A GB 1117713A
- Authority
- GB
- United Kingdom
- Prior art keywords
- manufacture
- integrated circuit
- integrated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76297—Dielectric isolation using EPIC techniques, i.e. epitaxial passivated integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH126866A CH428947A (fr) | 1966-01-31 | 1966-01-31 | Procédé de fabrication d'un circuit intégré |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1117713A true GB1117713A (en) | 1968-06-19 |
Family
ID=4206417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB355167A Expired GB1117713A (en) | 1966-01-31 | 1967-01-24 | Method of manufacture of an integrated circuit |
Country Status (8)
Country | Link |
---|---|
AT (1) | AT262383B (de) |
BE (1) | BE693141A (de) |
CH (1) | CH428947A (de) |
DE (1) | DE1619949A1 (de) |
FR (1) | FR1509644A (de) |
GB (1) | GB1117713A (de) |
NL (1) | NL6701103A (de) |
SE (1) | SE309453B (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5635024B2 (de) * | 1973-12-14 | 1981-08-14 | ||
JPS6022497B2 (ja) * | 1974-10-26 | 1985-06-03 | ソニー株式会社 | 半導体装置 |
JPS5718341B2 (de) * | 1974-12-11 | 1982-04-16 | ||
DE2632647A1 (de) * | 1976-07-20 | 1978-01-26 | Siemens Ag | Halbleiterbauelement mit passivierender schutzschicht |
DE102007032577B4 (de) | 2007-07-09 | 2011-07-21 | ADC GmbH, 14167 | Endverschluss für die Telekommunikations- und Datentechnik |
-
1966
- 1966-01-31 CH CH126866A patent/CH428947A/fr unknown
-
1967
- 1967-01-23 AT AT64367A patent/AT262383B/de active
- 1967-01-24 NL NL6701103A patent/NL6701103A/xx unknown
- 1967-01-24 GB GB355167A patent/GB1117713A/en not_active Expired
- 1967-01-25 BE BE693141D patent/BE693141A/xx unknown
- 1967-01-26 DE DE19671619949 patent/DE1619949A1/de active Pending
- 1967-01-30 FR FR92980A patent/FR1509644A/fr not_active Expired
- 1967-01-31 SE SE134767A patent/SE309453B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
SE309453B (de) | 1969-03-24 |
FR1509644A (fr) | 1968-01-12 |
DE1619949A1 (de) | 1970-07-30 |
AT262383B (de) | 1968-06-10 |
NL6701103A (de) | 1967-08-01 |
BE693141A (de) | 1967-07-03 |
CH428947A (fr) | 1967-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA938384A (en) | Method of making semiconductor integrated circuit elements | |
MY7300359A (en) | Integrated circuit fabrication | |
MY6900361A (en) | Methods and components for making structures comprising electrical circuits | |
GB1117579A (en) | Manufacture of integrated circuits | |
GB1117713A (en) | Method of manufacture of an integrated circuit | |
IL28409A (en) | Manufacture of epoxides | |
GB1121424A (en) | Electronic timepiece | |
GB1121419A (en) | Electronic timepiece | |
CA726650A (en) | Method of making printed circuits | |
GB1122749A (en) | Manufacture of integrated circuits | |
CA767367A (en) | Method of making circuit components | |
CA727834A (en) | Method of making integrated semiconductor devices | |
AU518366A (en) | Improved electronic circuit | |
CA936624A (en) | Method of making an integrated circuit | |
CA739152A (en) | Manufacture of printed circuit components | |
CA733482A (en) | Method of fabricating magnetic circuit devices | |
AU284817B2 (en) | Method of making semiconductor integrated circuit elements | |
AU411561B2 (en) | Method of producing miniaturised circuits | |
CA743285A (en) | Method of making semiconductor devices | |
AU407040B2 (en) | Method of contacting semiconductor components | |
AU409822B2 (en) | Methods and components for making structures comprising electrical circuits | |
GB1200789A (en) | Circuits for reducing electrical noise | |
CA735000A (en) | Fabrication of electronic units | |
AU405084B2 (en) | Method of testing printed circuits | |
AU403000B2 (en) | Method of producing semiconductor arrangements |