GB1113359A - Deposition of particles on an object - Google Patents

Deposition of particles on an object

Info

Publication number
GB1113359A
GB1113359A GB8091/66A GB809166A GB1113359A GB 1113359 A GB1113359 A GB 1113359A GB 8091/66 A GB8091/66 A GB 8091/66A GB 809166 A GB809166 A GB 809166A GB 1113359 A GB1113359 A GB 1113359A
Authority
GB
United Kingdom
Prior art keywords
spring
platform
container
wafer
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8091/66A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1113359A publication Critical patent/GB1113359A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23D—ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
    • C23D11/00—Continuous processes; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23D—ENAMELLING OF, OR APPLYING A VITREOUS LAYER TO, METALS
    • C23D5/00—Coating with enamels or vitreous layers
    • C23D5/02—Coating with enamels or vitreous layers by wet methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H01B3/088—Shaping of glass or deposition of glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
    • H01J9/22—Applying luminescent coatings
    • H01J9/221—Applying luminescent coatings in continuous layers
    • H01J9/223—Applying luminescent coatings in continuous layers by uniformly dispersing of liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

<PICT:1113359/C1/1> <PICT:1113359/C1/2> To deposit glass particles 30 on an object 28, the object 28 is supported above a fluid 27 containing the particles 30 in a container 12, the container 12 is centrifuged at such a speed that the object moves below the fluid, then at a speed so that particles 30 are deposited on the object 28 and then the speed is reduced so that the object moves above the fluid level before centrifuging of the container 12 is stopped. The object 28, such as a silicon wafer, is supported on a platform 26 having an annular flange 36, a spring 24 being secured to a loop 32 on the platform 26 and extending to the bottom of the container 12. In the compressed state, the spring 24 is contained by the flange 36. The containers 12 are mounted in carriers (14) as in Specification 992,044 which move from a vertical position to a horizontal position at about a force of 6 G and the weight of the spring 24, the platform 26 and wafer 28 and the strength of spring 24 are chosen so that the spring collapses at about 12 G. The particles 30 start to deposit at about 64 G and normally the centrifuge is operated for about 1-2 minutes at a speed to give a force of 1000-2500 G. As the centrifuge is slowed, the spring 24 operates to move the wafer 28 out of the fluid 27 before the carrier (14) moves out of the horizontal position and unevenness of coating is thereby prevented. To assist removal of the wafer 28 from the platform 26, a number of holes 38 and edge cut-outs (40) are provided in the top disc shown, or the platform may consist of the flange 36 with a loop to retain the spring 24 with or without one or more cross wires. Three guide pins 34 are provided between the flange 36 and the container 12 and they also assist in retaining the wafer 28.
GB8091/66A 1965-03-08 1966-02-24 Deposition of particles on an object Expired GB1113359A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US437805A US3406041A (en) 1965-03-08 1965-03-08 Method and apparatus for depositing particles onto an object

Publications (1)

Publication Number Publication Date
GB1113359A true GB1113359A (en) 1968-05-15

Family

ID=23737956

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8091/66A Expired GB1113359A (en) 1965-03-08 1966-02-24 Deposition of particles on an object

Country Status (2)

Country Link
US (1) US3406041A (en)
GB (1) GB1113359A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819129B2 (en) * 1975-12-10 1983-04-16 株式会社東芝 Handout Taisouchino Seizouhouhou
JP2010135763A (en) * 2008-11-05 2010-06-17 Toshiba Corp Apparatus for manufacturing led device, method for manufacturing the same, and led device
CN114682347B (en) * 2022-05-07 2023-04-28 大连大学 Centrifuge-assisted small-size nanomaterial separation method and device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB587741A (en) * 1945-01-13 1947-05-05 George Bernard Francis Goff Improvements in or relating to screens for cathode ray tubes and the like

Also Published As

Publication number Publication date
US3406041A (en) 1968-10-15

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