GB1098398A - Improvements relating to the manufacture of semi-conductor devices - Google Patents

Improvements relating to the manufacture of semi-conductor devices

Info

Publication number
GB1098398A
GB1098398A GB1752565A GB1752565A GB1098398A GB 1098398 A GB1098398 A GB 1098398A GB 1752565 A GB1752565 A GB 1752565A GB 1752565 A GB1752565 A GB 1752565A GB 1098398 A GB1098398 A GB 1098398A
Authority
GB
United Kingdom
Prior art keywords
metal
silicon
plate
semi
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1752565A
Inventor
Rigobert Schimmer
Johannes Wulf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of GB1098398A publication Critical patent/GB1098398A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

Abstract

1,098,398. Severing by grinding. LICENTIA PATENT - VERWALTUNGS G.m.b.H. April 26, 1965, No. 17525/65. Heading B3D. [Also in Division H1] A metal-coated silicon plate 2 is divided into smaller rectangular discs by the use of a cutting tool consisting of a set of spaced diamond saw blades 5. The blades and the spacers 6 between them are secured to a common rotary shaft 3 and each blade is a disc of steel or bronze with a bevelled edge clad with diamond powder, the included angle 8 of the symmetrically bevelled tip being between 30 and 120 degrees. The metal of the metal-coated plate may be gold, with or without an underlying layer of nickel. The silicon may contain one or more PN junctions, the completed devices thus constituting diodes or transistors. The silicon is supported during cutting by cementing it to a support plate, e.g. of glass.
GB1752565A 1964-02-05 1965-04-26 Improvements relating to the manufacture of semi-conductor devices Expired GB1098398A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEL0046966 1964-02-05

Publications (1)

Publication Number Publication Date
GB1098398A true GB1098398A (en) 1968-01-10

Family

ID=7271832

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1752565A Expired GB1098398A (en) 1964-02-05 1965-04-26 Improvements relating to the manufacture of semi-conductor devices

Country Status (1)

Country Link
GB (1) GB1098398A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2408218A1 (en) * 1977-11-03 1979-06-01 Gen Electric PROCESS FOR DIVIDING A SLICE OF SEMICONDUCTOR INTO PELLETS
EP0228863A2 (en) * 1985-12-20 1987-07-15 Seiko Instruments Inc. Method of dividing a substrate into a plurality of substrate portions

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2408218A1 (en) * 1977-11-03 1979-06-01 Gen Electric PROCESS FOR DIVIDING A SLICE OF SEMICONDUCTOR INTO PELLETS
EP0228863A2 (en) * 1985-12-20 1987-07-15 Seiko Instruments Inc. Method of dividing a substrate into a plurality of substrate portions
EP0228863A3 (en) * 1985-12-20 1988-03-09 Seiko Instruments Inc. Method of dividing a substrate into a plurality of substrate portions

Also Published As

Publication number Publication date
DE1427726B2 (en) 1972-07-27
DE1427726A1 (en) 1969-01-16

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