GB1095387A - - Google Patents

Info

Publication number
GB1095387A
GB1095387A GB1095387A GB1095387A GB1095387A GB 1095387 A GB1095387 A GB 1095387A GB 1095387 A GB1095387 A GB 1095387A GB 1095387 A GB1095387 A GB 1095387A GB 1095387 A GB1095387 A GB 1095387A
Authority
GB
United Kingdom
Prior art keywords
transistor
encapsulated
wires
magnesia
harden
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1095387A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1095387A publication Critical patent/GB1095387A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W74/43—
    • H10W74/016—
    • H10W76/40—
    • H10W90/00—

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB1095387A 1965-03-11 1966-03-09 Expired GB1095387A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0095884 1965-03-11

Publications (1)

Publication Number Publication Date
GB1095387A true GB1095387A (enExample) 1967-12-20

Family

ID=7519680

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1095387A Expired GB1095387A (enExample) 1965-03-11 1966-03-09

Country Status (3)

Country Link
DE (1) DE1514413A1 (enExample)
GB (1) GB1095387A (enExample)
NL (1) NL6601941A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10593608B2 (en) 2014-06-18 2020-03-17 Heraeus Deutschland GmbH & Co. KG Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component
US10685894B2 (en) 2013-11-07 2020-06-16 Heraeus Deutschland GmbH & Co. KG Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component
WO2022139674A1 (en) * 2020-12-23 2022-06-30 Heraeus Deutschland Gmbh & Co. Kg. Process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packages
US12133366B2 (en) 2019-05-02 2024-10-29 Danfoss Silicon Power Gmbh Power electronics module with improved cooling
US12136585B2 (en) 2019-05-02 2024-11-05 Danfoss Silicon Power Gmbh Compact power electronics module with increased cooling surface

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015102041A1 (de) 2015-02-12 2016-08-18 Danfoss Silicon Power Gmbh Leistungsmodul
DE102015223467A1 (de) * 2015-11-26 2017-06-01 Robert Bosch Gmbh Elektrische Vorrichtung mit einer Umhüllmasse
DE102018215694A1 (de) * 2018-09-14 2020-03-19 Robert Bosch Gmbh Vergussmasse, elektrisch isoliertes elektrisches oder elektronisches Bauteil und Verfahren zu dessen elektrischer Isolierung
EP4095894A1 (de) * 2021-05-26 2022-11-30 Heraeus Deutschland GmbH & Co. KG Mit einer umhüllung aus einer hydraulisch gehärteten anorganischen zementzusammensetzung versehenes elektronikobjekt

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10685894B2 (en) 2013-11-07 2020-06-16 Heraeus Deutschland GmbH & Co. KG Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component
US10593608B2 (en) 2014-06-18 2020-03-17 Heraeus Deutschland GmbH & Co. KG Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component
US12133366B2 (en) 2019-05-02 2024-10-29 Danfoss Silicon Power Gmbh Power electronics module with improved cooling
US12136585B2 (en) 2019-05-02 2024-11-05 Danfoss Silicon Power Gmbh Compact power electronics module with increased cooling surface
WO2022139674A1 (en) * 2020-12-23 2022-06-30 Heraeus Deutschland Gmbh & Co. Kg. Process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packages

Also Published As

Publication number Publication date
DE1514413A1 (de) 1969-06-12
NL6601941A (enExample) 1966-09-12

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