GB1087271A - Method of producing an electrical component - Google Patents

Method of producing an electrical component

Info

Publication number
GB1087271A
GB1087271A GB66665A GB66665A GB1087271A GB 1087271 A GB1087271 A GB 1087271A GB 66665 A GB66665 A GB 66665A GB 66665 A GB66665 A GB 66665A GB 1087271 A GB1087271 A GB 1087271A
Authority
GB
United Kingdom
Prior art keywords
layer
layers
temporary support
resin
flush
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB66665A
Inventor
Noel Percival Parkinson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Control Techniques Dynamics Ltd
Original Assignee
Moore Reed and Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Moore Reed and Company Ltd filed Critical Moore Reed and Company Ltd
Priority to GB66665A priority Critical patent/GB1087271A/en
Publication of GB1087271A publication Critical patent/GB1087271A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

1,087,271. Printed circuits. MOORE REED & CO. Ltd. Jan. 7, 1965, No. 666/65. Heading H1R. In a method of making a flush-bonded printed circuit of the kind in which a conductive pattern is formed on a temporary support and a layer of resin material is applied to the pattern and cured to form a permanent insulating support, after which the temporary support is removed, shrinkage of the resin material during curing is compensated by the provision of raised areas on the temporary support in register with the conductive pattern. As shown, Fig. 5, a plate 1 of etchable metal e.g. Cu, Ni, brass, has raised portions 4 of similar metal deposited thereon by electro-deposition through a photographicallyformed plating-resist mask (not shown). A layer 5 of non-etchable metal, e.g. Au, Ag, Rh, is then deposited, followed if required by a layer 6 of Cu or Ni. The resist is removed, and the layers 4, 5, 6 may be coated with adhesive. A number of sheets 7 of resin-impregnated paper or glass fibre are then applied to the layers 4, 5, 6 with heat and pressure. As the resin cures it shrinks back until it is level with the interface of layers 4 and 5. Finally plate 1 and layer 4 are etched away, leaving layer 5 as the exposed layer of the flush-bonded circuit.
GB66665A 1965-01-07 1965-01-07 Method of producing an electrical component Expired GB1087271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB66665A GB1087271A (en) 1965-01-07 1965-01-07 Method of producing an electrical component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB66665A GB1087271A (en) 1965-01-07 1965-01-07 Method of producing an electrical component

Publications (1)

Publication Number Publication Date
GB1087271A true GB1087271A (en) 1967-10-18

Family

ID=9708397

Family Applications (1)

Application Number Title Priority Date Filing Date
GB66665A Expired GB1087271A (en) 1965-01-07 1965-01-07 Method of producing an electrical component

Country Status (1)

Country Link
GB (1) GB1087271A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2160715A1 (en) * 1971-11-23 1973-07-06 Thomson Csf Electrolytic gilding - using a mask of photosensitive resin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2160715A1 (en) * 1971-11-23 1973-07-06 Thomson Csf Electrolytic gilding - using a mask of photosensitive resin

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