GB1072775A - Improvements in electric structural elements - Google Patents

Improvements in electric structural elements

Info

Publication number
GB1072775A
GB1072775A GB32447/64A GB3244764A GB1072775A GB 1072775 A GB1072775 A GB 1072775A GB 32447/64 A GB32447/64 A GB 32447/64A GB 3244764 A GB3244764 A GB 3244764A GB 1072775 A GB1072775 A GB 1072775A
Authority
GB
United Kingdom
Prior art keywords
printed circuit
carrier
conductors
envelope
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB32447/64A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1072775A publication Critical patent/GB1072775A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB32447/64A 1963-08-13 1964-08-10 Improvements in electric structural elements Expired GB1072775A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL296629 1963-08-13

Publications (1)

Publication Number Publication Date
GB1072775A true GB1072775A (en) 1967-06-21

Family

ID=19754959

Family Applications (1)

Application Number Title Priority Date Filing Date
GB32447/64A Expired GB1072775A (en) 1963-08-13 1964-08-10 Improvements in electric structural elements

Country Status (3)

Country Link
US (1) US3363146A (enExample)
GB (1) GB1072775A (enExample)
NL (1) NL296629A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2295570A1 (fr) * 1974-12-20 1976-07-16 Ibm Assemblage electrique pour circuits integres et son procede de montage
EP0152818A3 (de) * 1984-02-23 1986-12-03 Asea Brown Boveri Aktiengesellschaft Leistungshalbleitermodul

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3662230A (en) * 1968-06-25 1972-05-09 Texas Instruments Inc A semiconductor interconnecting system using conductive patterns bonded to thin flexible insulating films
US3780352A (en) * 1968-06-25 1973-12-18 J Redwanz Semiconductor interconnecting system using conductive patterns bonded to thin flexible insulating films
US4271426A (en) * 1978-08-10 1981-06-02 Minnesota Mining And Manufacturing Company Leaded mounting and connector unit for an electronic device
US4251852A (en) * 1979-06-18 1981-02-17 International Business Machines Corporation Integrated circuit package
TW200836315A (en) * 2007-02-16 2008-09-01 Richtek Techohnology Corp Electronic package structure and method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3052822A (en) * 1958-05-28 1962-09-04 Globe Union Inc Modular electrical unit
US3159770A (en) * 1961-09-11 1964-12-01 Sylvania Electric Prod Multiple component electrical enclosure having identifying ring plate short-circuiting one component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2295570A1 (fr) * 1974-12-20 1976-07-16 Ibm Assemblage electrique pour circuits integres et son procede de montage
EP0152818A3 (de) * 1984-02-23 1986-12-03 Asea Brown Boveri Aktiengesellschaft Leistungshalbleitermodul

Also Published As

Publication number Publication date
NL296629A (enExample)
US3363146A (en) 1968-01-09

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