GB1065672A - Densifier for powdery substances - Google Patents

Densifier for powdery substances

Info

Publication number
GB1065672A
GB1065672A GB2316864A GB2316864A GB1065672A GB 1065672 A GB1065672 A GB 1065672A GB 2316864 A GB2316864 A GB 2316864A GB 2316864 A GB2316864 A GB 2316864A GB 1065672 A GB1065672 A GB 1065672A
Authority
GB
United Kingdom
Prior art keywords
plunger
gate
cake
hopper
june
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2316864A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weyerhaeuser Co
Original Assignee
Weyerhaeuser Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Weyerhaeuser Co filed Critical Weyerhaeuser Co
Publication of GB1065672A publication Critical patent/GB1065672A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B9/00—Making granules

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Press Drives And Press Lines (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

1,065,672. Compacting powdery substances. WEYERHAEUSER CO. June 4, 1964 [June 12, 1963], No. 23168/64. Heading B5A. Prior to granulating by rolling, powdery material such as powdered epoxy resin is compacted into friable cakes by a plunger 14 which is vertically reciprocated between a hopper 21 and a cylinder 25, the cake being formed as the plunger 14 descends by air entrained in the powder escaping through vents 16 and compression taking place between the plunger and a horizontally reciprocable gate 17. To prevent sticking of the plunger and undue egress of the powder therethrough, two vented plates are mounted in tandem and preferably the lower is provided with a filter-like material such as coarse felt. The gate 17 is provided with cams 17a and cam surfaces 18a which co-operate with cam surfaces 17b and adjustable cams 18b respectively so that a resilient surface 18 is brought into sealing contact with the lower end of cylinder 25. In operation, material is fed to hopper 21 via a funnel (24), Fig. 1 (not shown), when the plunger 14, Fig. 2, is in its raised position and after compression the plunger is slightly raised to relieve pressure on gate 17 and thereafter the gate is moved to allow the cake to be discharged through port 32. If necessary, discharge of the cake may be facilitated by a small downwards movement of plunger 14.
GB2316864A 1963-06-12 1964-06-04 Densifier for powdery substances Expired GB1065672A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US28739963A 1963-06-12 1963-06-12

Publications (1)

Publication Number Publication Date
GB1065672A true GB1065672A (en) 1967-04-19

Family

ID=23102728

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2316864A Expired GB1065672A (en) 1963-06-12 1964-06-04 Densifier for powdery substances

Country Status (2)

Country Link
DE (1) DE1454889A1 (en)
GB (1) GB1065672A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1498244A1 (en) * 2003-07-17 2005-01-19 Nitto Denko Corporation Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same
JP2005048173A (en) * 2003-07-17 2005-02-24 Nitto Denko Corp Manufacturing method for tablet for sealing semiconductor, tablet for sealing semiconductor obtained thereby, and semiconductor device using the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2629509C3 (en) * 1976-06-30 1980-07-31 Klaus Prof. Dr.-Ing. 7500 Karlsruhe Schoenert Method and device for the fine comminution of inelastic materials
DE3528892A1 (en) * 1985-08-12 1987-02-19 Wacker Chemie Gmbh Process for improving the further processing properties of polymers

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1498244A1 (en) * 2003-07-17 2005-01-19 Nitto Denko Corporation Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same
JP2005048173A (en) * 2003-07-17 2005-02-24 Nitto Denko Corp Manufacturing method for tablet for sealing semiconductor, tablet for sealing semiconductor obtained thereby, and semiconductor device using the same
CN100339457C (en) * 2003-07-17 2007-09-26 日东电工株式会社 Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same
JP4634083B2 (en) * 2003-07-17 2011-02-16 日東電工株式会社 Manufacturing method of tablets for semiconductor encapsulation

Also Published As

Publication number Publication date
DE1454889A1 (en) 1969-04-10

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