GB1065182A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
GB1065182A
GB1065182A GB14373/65A GB1437365A GB1065182A GB 1065182 A GB1065182 A GB 1065182A GB 14373/65 A GB14373/65 A GB 14373/65A GB 1437365 A GB1437365 A GB 1437365A GB 1065182 A GB1065182 A GB 1065182A
Authority
GB
United Kingdom
Prior art keywords
header
insulating material
semi
wires
oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB14373/65A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB1065182A publication Critical patent/GB1065182A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
GB14373/65A 1964-04-22 1965-04-05 Semiconductor device Expired GB1065182A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US361645A US3278813A (en) 1964-04-22 1964-04-22 Transistor housing containing packed, earthy, nonmetallic, electrically insulating material

Publications (1)

Publication Number Publication Date
GB1065182A true GB1065182A (en) 1967-04-12

Family

ID=23422903

Family Applications (1)

Application Number Title Priority Date Filing Date
GB14373/65A Expired GB1065182A (en) 1964-04-22 1965-04-05 Semiconductor device

Country Status (4)

Country Link
US (1) US3278813A (https=)
DE (1) DE1489916B2 (https=)
GB (1) GB1065182A (https=)
SE (1) SE319835B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3449641A (en) * 1966-01-11 1969-06-10 Gen Electric Epoxy encapsulated semiconductor device wherein the encapsulant comprises an epoxy novolak
US3492157A (en) * 1966-06-20 1970-01-27 Tokyo Shibaura Electric Co Resin-sealed semiconductor device and manufacturing method for the same
US3659164A (en) * 1970-11-23 1972-04-25 Rca Corp Internal construction for plastic semiconductor packages
US3742599A (en) * 1970-12-14 1973-07-03 Gen Electric Processes for the fabrication of protected semiconductor devices
SE381947B (sv) * 1971-10-01 1975-12-22 Gen Electric Metalloxidvaristor
JP2513055B2 (ja) * 1990-02-14 1996-07-03 日本電装株式会社 半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL241488A (https=) * 1958-07-21 1900-01-01
US3200310A (en) * 1959-09-22 1965-08-10 Carman Lab Inc Glass encapsulated semiconductor device
US3212160A (en) * 1962-05-18 1965-10-19 Transitron Electronic Corp Method of manufacturing semiconductive devices

Also Published As

Publication number Publication date
US3278813A (en) 1966-10-11
SE319835B (https=) 1970-01-26
DE1489916B2 (de) 1971-04-15
DE1489916A1 (de) 1970-07-16

Similar Documents

Publication Publication Date Title
GB822770A (en) Improvements in semiconductor device construction
GB1384823A (en) Hermetic power package
GB1510294A (en) Passivated and encapsulated semiconductors and method of making same
GB1065182A (en) Semiconductor device
GB862453A (en) Improvements in or relating to semi-conductor devices
GB1214200A (en) Improvements in or relating to semiconductor devices
GB1300248A (en) Light activated semiconductor device
GB926828A (en) Semiconductor device
GB1264055A (en) Semiconductor device
NL6405157A (https=)
GB1002725A (en) Semiconductor device
US2888736A (en) Transistor packages
NL7504380A (nl) Keramisch pakket zonder aansluitleidingen, be- stemd voor een geintegreerde keten.
GB1181336A (en) Strip Mounted Semiconductor Device
GB1206759A (en) Semiconductor devices
GB1145434A (en) Epoxy encapsulated semiconductor device
GB1268335A (en) Semiconductor device
GB956934A (en) Sealed semiconductor devices and mounting means therefor
GB1192341A (en) Improved Resin Encapsulated Semiconductor Device
JPS5458359A (en) Package and semiconductor device providing it
JPS5588358A (en) Resin-sealed semiconductor device
GB1329810A (en) Semiconductor device packaging
ES360707A1 (es) Un dispositivo semiconductor.
GB1282740A (en) Radiation resistant semiconductor device
GB1240417A (en) Semiconductor device