GB1055073A - Improvements in or relating to photographic processes - Google Patents

Improvements in or relating to photographic processes

Info

Publication number
GB1055073A
GB1055073A GB2479964A GB2479964A GB1055073A GB 1055073 A GB1055073 A GB 1055073A GB 2479964 A GB2479964 A GB 2479964A GB 2479964 A GB2479964 A GB 2479964A GB 1055073 A GB1055073 A GB 1055073A
Authority
GB
United Kingdom
Prior art keywords
rinsed
developed
bleach
etch solution
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2479964A
Inventor
Hugh Harry Donald Hussey
Michael Basil Davies
Jean Paul Lenoble
Alan David Russell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to GB2479964A priority Critical patent/GB1055073A/en
Priority to FR20175A priority patent/FR1444977A/en
Publication of GB1055073A publication Critical patent/GB1055073A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/26—Processes using silver-salt-containing photosensitive materials or agents therefor
    • G03C5/40—Chemically transforming developed images

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Surface Treatment Of Glass (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

An electrically conductive surface is formed on a base of e.g ceramic, mica, wood, paper, glass or plastics, by partly exposing and developing a silver halide emulsion, removing the exposed part with a bleach-etch solution and then fully exposing and developing the remaining unexposed part. In an example for forming a printed circuit, a film is partly exposed through a negative mask, developed, rinsed, immersed in a bleach-etch solution comprising cupric sulphate, citric acid, potassium bromide, and hydrogen peroxide, reexposed, developed, rinsed, immersed in a similar bleach-etch solution, rinsed, fully exposed, developed, rinsed, and the printed wiring so formed is polished. The wiring may be built up by electroless deposition of copper using an alkaline solution of copper sulphate with formaldehyde. The conductive layer may be baked to remove residues of gelatine, and lacquered to make the surface non-hygroscopic.
GB2479964A 1964-06-15 1964-06-15 Improvements in or relating to photographic processes Expired GB1055073A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB2479964A GB1055073A (en) 1964-06-15 1964-06-15 Improvements in or relating to photographic processes
FR20175A FR1444977A (en) 1964-06-15 1965-06-10 Improvements to photographic processes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2479964A GB1055073A (en) 1964-06-15 1964-06-15 Improvements in or relating to photographic processes

Publications (1)

Publication Number Publication Date
GB1055073A true GB1055073A (en) 1967-01-11

Family

ID=10217405

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2479964A Expired GB1055073A (en) 1964-06-15 1964-06-15 Improvements in or relating to photographic processes

Country Status (2)

Country Link
FR (1) FR1444977A (en)
GB (1) GB1055073A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3634084A (en) * 1967-07-03 1972-01-11 Ibm Multiple light flash photographic process
WO2002092878A2 (en) * 2001-05-10 2002-11-21 Ebara Corporation Electroless plating method and device, and substrate processing method and apparatus
WO2004019666A1 (en) * 2002-08-22 2004-03-04 Agfa-Gevaert Process for preparing a substantially transparent conductive layer configuration
US7026079B2 (en) 2002-08-22 2006-04-11 Agfa Gevaert Process for preparing a substantially transparent conductive layer configuration

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3634084A (en) * 1967-07-03 1972-01-11 Ibm Multiple light flash photographic process
WO2002092878A2 (en) * 2001-05-10 2002-11-21 Ebara Corporation Electroless plating method and device, and substrate processing method and apparatus
WO2002092878A3 (en) * 2001-05-10 2004-04-15 Ebara Corp Electroless plating method and device, and substrate processing method and apparatus
WO2004019666A1 (en) * 2002-08-22 2004-03-04 Agfa-Gevaert Process for preparing a substantially transparent conductive layer configuration
US7026079B2 (en) 2002-08-22 2006-04-11 Agfa Gevaert Process for preparing a substantially transparent conductive layer configuration

Also Published As

Publication number Publication date
FR1444977A (en) 1966-07-08

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