GB1054670A - - Google Patents

Info

Publication number
GB1054670A
GB1054670A GB1054670DA GB1054670A GB 1054670 A GB1054670 A GB 1054670A GB 1054670D A GB1054670D A GB 1054670DA GB 1054670 A GB1054670 A GB 1054670A
Authority
GB
United Kingdom
Prior art keywords
strips
terminal areas
substrate
july
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of GB1054670A publication Critical patent/GB1054670A/en
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
GB1054670D 1964-07-31 Active GB1054670A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3031564 1964-07-31

Publications (1)

Publication Number Publication Date
GB1054670A true GB1054670A (enExample)

Family

ID=10305709

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1054670D Active GB1054670A (enExample) 1964-07-31

Country Status (2)

Country Link
DE (1) DE1514768B2 (enExample)
GB (1) GB1054670A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1909480A1 (de) * 1968-03-01 1970-01-15 Gen Electric Halbleiterbauelement und Verfahren zu seiner Herstellung

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2840973A1 (de) * 1978-09-20 1980-03-27 Siemens Ag Verfahren zur herstellung pruefbarer halbleiter-miniaturgehaeuse in bandform

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1909480A1 (de) * 1968-03-01 1970-01-15 Gen Electric Halbleiterbauelement und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
DE1514768A1 (de) 1969-07-24
DE1514768B2 (de) 1972-05-10

Similar Documents

Publication Publication Date Title
GB1068208A (en) Semiconductor device
US3591839A (en) Micro-electronic circuit with novel hermetic sealing structure and method of manufacture
US3691289A (en) Packaging of semiconductor devices
GB1331901A (en) Metallic leads for electronic devices
CA1007760A (en) Solder bond between the semiconductor chip and substrate
EP0169241A4 (en) METHOD FOR FORMING HERMETICALLY CLOSED ELECTRICAL APPLICATION LADDER.
GB1213726A (en) Improvements relating to electrical circuit assemblies
GB1499358A (en) Integrated circuit packages and method of manufacturing same
GB1151165A (en) Face-Bonded Semiconductor Devices
GB1038007A (en) Electrical assembly
GB822711A (en) Improvements relating to sealed rectifier units employing semi-conductors
GB1152809A (en) Electric Circuit Assembly
GB1054670A (enExample)
US3244939A (en) Encapsulated die bonded hybrid integrated circuit
US3833753A (en) Hermetically sealed mounting structure for miniature electronic circuitry
GB1190290A (en) Method of Fitting Semiconductor Pellet on Metal Body
JPS5817646A (ja) 半導体装置の製造方法
GB1255073A (en) Improvements relating to electrical circuit assemblies
GB1470630A (en) Manufacture of thermistor devices
GB1329810A (en) Semiconductor device packaging
GB1280610A (en) Improvements in or relating to semiconductor components
GB1018876A (en) Semiconductor device header
JPH0432243A (ja) 半導体装置及びその製造方法
GB1156146A (en) Method of making Contact to Semiconductor Components
JPS5795651A (en) Semiconductor device