GB1048214A - Improvements in or relating to semiconductor devices - Google Patents

Improvements in or relating to semiconductor devices

Info

Publication number
GB1048214A
GB1048214A GB4215/64A GB421564A GB1048214A GB 1048214 A GB1048214 A GB 1048214A GB 4215/64 A GB4215/64 A GB 4215/64A GB 421564 A GB421564 A GB 421564A GB 1048214 A GB1048214 A GB 1048214A
Authority
GB
United Kingdom
Prior art keywords
plate
contacts
wiring
components
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4215/64A
Other languages
English (en)
Inventor
Carl Peter Sandbach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB4215/64A priority Critical patent/GB1048214A/en
Priority to CH116865A priority patent/CH494475A/de
Priority to FR3691A priority patent/FR87966E/fr
Priority to NL6501144A priority patent/NL6501144A/xx
Priority to DEST23285A priority patent/DE1244889B/de
Priority to BE659092D priority patent/BE659092A/xx
Publication of GB1048214A publication Critical patent/GB1048214A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB4215/64A 1964-01-31 1964-01-31 Improvements in or relating to semiconductor devices Expired GB1048214A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB4215/64A GB1048214A (en) 1964-01-31 1964-01-31 Improvements in or relating to semiconductor devices
CH116865A CH494475A (de) 1964-01-31 1965-01-26 Verfahren zur Herstellung eines Schaltungsmoduls mit einer integrierten Halbleiterschaltanordnung
FR3691A FR87966E (fr) 1964-01-31 1965-01-29 Couche métallique adhérente pour connexions électriques, en particulier pour les organes semi-conducteurs
NL6501144A NL6501144A (https=) 1964-01-31 1965-01-29
DEST23285A DE1244889B (de) 1964-01-31 1965-01-30 Verfahren zum Herstellen einer Halbleiterschaltung in Mikromodulbauweise
BE659092D BE659092A (https=) 1964-01-31 1965-02-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4215/64A GB1048214A (en) 1964-01-31 1964-01-31 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB1048214A true GB1048214A (en) 1966-11-16

Family

ID=9772919

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4215/64A Expired GB1048214A (en) 1964-01-31 1964-01-31 Improvements in or relating to semiconductor devices

Country Status (5)

Country Link
BE (1) BE659092A (https=)
CH (1) CH494475A (https=)
DE (1) DE1244889B (https=)
GB (1) GB1048214A (https=)
NL (1) NL6501144A (https=)

Also Published As

Publication number Publication date
NL6501144A (https=) 1965-08-02
CH494475A (de) 1970-07-31
DE1244889B (de) 1967-07-20
BE659092A (https=) 1965-08-02

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