GB1047778A - A semiconductor device - Google Patents
A semiconductor deviceInfo
- Publication number
- GB1047778A GB1047778A GB31775/63A GB3177563A GB1047778A GB 1047778 A GB1047778 A GB 1047778A GB 31775/63 A GB31775/63 A GB 31775/63A GB 3177563 A GB3177563 A GB 3177563A GB 1047778 A GB1047778 A GB 1047778A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wafer
- powder
- housing
- piston
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
Landscapes
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0080982 | 1962-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1047778A true GB1047778A (en) | 1966-11-09 |
Family
ID=7509244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB31775/63A Expired GB1047778A (en) | 1962-08-18 | 1963-08-12 | A semiconductor device |
Country Status (3)
| Country | Link |
|---|---|
| CH (1) | CH399602A (https=) |
| DE (1) | DE1251442B (https=) |
| GB (1) | GB1047778A (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3513360A (en) * | 1966-12-27 | 1970-05-19 | Asea Ab | Semi-conductor device |
| EP2037498A1 (de) * | 2007-09-11 | 2009-03-18 | Siemens Aktiengesellschaft | Hochwärmebeständiges Leistungshalbleitermodul |
| DE102008034075A1 (de) * | 2008-07-22 | 2010-04-22 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Verfahren zu dessen Herstellung |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1489097B1 (de) * | 1964-12-16 | 1970-10-22 | Licentia Gmbh | Halbleiter-Gleichrichterzelle |
| DE2633810A1 (de) * | 1976-07-28 | 1978-02-02 | Sihn Jr Kg Wilhelm | Gekuehlter abschlusswiderstand fuer koaxiale hochfrequenzleitungen |
| DE8909244U1 (de) * | 1989-07-31 | 1989-09-21 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement |
| DE102012211446B4 (de) * | 2012-07-02 | 2016-05-12 | Infineon Technologies Ag | Explosionsgeschütztes halbleitermodul |
-
0
- DE DES80982A patent/DE1251442B/de active Pending
-
1963
- 1963-05-29 CH CH671063A patent/CH399602A/de unknown
- 1963-08-12 GB GB31775/63A patent/GB1047778A/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3513360A (en) * | 1966-12-27 | 1970-05-19 | Asea Ab | Semi-conductor device |
| EP2037498A1 (de) * | 2007-09-11 | 2009-03-18 | Siemens Aktiengesellschaft | Hochwärmebeständiges Leistungshalbleitermodul |
| DE102008034075A1 (de) * | 2008-07-22 | 2010-04-22 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Verfahren zu dessen Herstellung |
| DE102008034075B4 (de) * | 2008-07-22 | 2012-06-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Verfahren zu dessen Herstellung |
Also Published As
| Publication number | Publication date |
|---|---|
| CH399602A (de) | 1965-09-30 |
| DE1251442B (https=) |
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