GB1041308A - Improvements in or relating to electrical circuitry - Google Patents

Improvements in or relating to electrical circuitry

Info

Publication number
GB1041308A
GB1041308A GB1118964A GB1118964A GB1041308A GB 1041308 A GB1041308 A GB 1041308A GB 1118964 A GB1118964 A GB 1118964A GB 1118964 A GB1118964 A GB 1118964A GB 1041308 A GB1041308 A GB 1041308A
Authority
GB
United Kingdom
Prior art keywords
plate
tracks
grooves
metallized
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1118964A
Inventor
John Albert Leno
Kenneth Albert Matthews
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB1118964A priority Critical patent/GB1041308A/en
Priority to BE661217D priority patent/BE661217A/xx
Priority to FR9527A priority patent/FR87816E/en
Priority to NL6503359A priority patent/NL6503359A/xx
Publication of GB1041308A publication Critical patent/GB1041308A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

1,041,308. Circuit assemblies. STANDARD TELEPHONES & CABLES Ltd. March 17, 1964, No. 11189/64. Addition to 981,104. Heading H1R. In an electrical logical circuit comprising an insulating plate having first and second sets of parallel conductive tracks disposed mutually at an angle on opposite faces thereof, circuit elements connected to individual tracks, and interconnections between the tracks of said sets at selected cross-points, either the tracks are located in grooves in a rigid insulating plate, or the insulating plate is flexible and the circuit is folded concertina-wise. In Fig. 1, mutually orthogonal sets of parallel grooves 2, 3 in opposite faces of plate 1 of ceramic or plastics material are metallized, together with further grooves 4 used for power and signal inputs &c., by electroless chemical plating of Cu, Ni &c., followed by electrodeposition of further metal; holes 8, 9 through plate 1 are similarly metallized at the same time. Margin 10, which is metallized to provide a bus-bar for the electroplating step, is subsequently removed mechanically. Circuit elements 11, 13 are disposed in cavities 5, 6 on either side of the plate 1, their leads being soldered or welded into the metallized grooves. Further elements are housed in holes 9 in the plate, and are connected to grooves on either side, while holes 8 form direct connections between grooves of the two sets. A multi-pin plug connector 16 is provided, and cover plates (not shown) may be stuck to each face of the plate to seal the unit. In Fig. 3, conductive tracks 22, 23 are applied to opposite sides of a flexible plate 21, interconnections between tracks being effected by components or connectors located in holes 27 punched in the plate. Circuit elements 24 are secured to tracks 22, and the assembly is folded concertinawise (Fig. 5, not shown), and fitted into a rectangular casing of cardboard &c., and housed in a modular framework (Fig. 7, not shown).
GB1118964A 1961-05-08 1964-03-17 Improvements in or relating to electrical circuitry Expired GB1041308A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB1118964A GB1041308A (en) 1964-03-17 1964-03-17 Improvements in or relating to electrical circuitry
BE661217D BE661217A (en) 1964-03-17 1965-03-17
FR9527A FR87816E (en) 1961-05-08 1965-03-17 Construction of electrical circuits
NL6503359A NL6503359A (en) 1964-03-17 1965-03-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1118964A GB1041308A (en) 1964-03-17 1964-03-17 Improvements in or relating to electrical circuitry

Publications (1)

Publication Number Publication Date
GB1041308A true GB1041308A (en) 1966-09-01

Family

ID=9981656

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1118964A Expired GB1041308A (en) 1961-05-08 1964-03-17 Improvements in or relating to electrical circuitry

Country Status (3)

Country Link
BE (1) BE661217A (en)
GB (1) GB1041308A (en)
NL (1) NL6503359A (en)

Also Published As

Publication number Publication date
NL6503359A (en) 1965-09-20
BE661217A (en) 1965-09-17

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