GB1039257A - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB1039257A
GB1039257A GB21600/65A GB2160065A GB1039257A GB 1039257 A GB1039257 A GB 1039257A GB 21600/65 A GB21600/65 A GB 21600/65A GB 2160065 A GB2160065 A GB 2160065A GB 1039257 A GB1039257 A GB 1039257A
Authority
GB
United Kingdom
Prior art keywords
layer
grown
semi
wafer
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB21600/65A
Other languages
English (en)
Inventor
Roger Cullis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB21600/65A priority Critical patent/GB1039257A/en
Priority to DE19661564147 priority patent/DE1564147A1/de
Priority to NL6606800A priority patent/NL6606800A/xx
Priority to FR62316A priority patent/FR1500841A/fr
Publication of GB1039257A publication Critical patent/GB1039257A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Recrystallisation Techniques (AREA)
  • Die Bonding (AREA)
GB21600/65A 1965-05-21 1965-05-21 Semiconductor devices Expired GB1039257A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB21600/65A GB1039257A (en) 1965-05-21 1965-05-21 Semiconductor devices
DE19661564147 DE1564147A1 (de) 1965-05-21 1966-05-07 Halbleiterbauelement und Herstellungsverfahren
NL6606800A NL6606800A (https=) 1965-05-21 1966-05-17
FR62316A FR1500841A (fr) 1965-05-21 1966-05-20 Procédé de fabrication d'un transistor planar au silicium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB21600/65A GB1039257A (en) 1965-05-21 1965-05-21 Semiconductor devices

Publications (1)

Publication Number Publication Date
GB1039257A true GB1039257A (en) 1966-08-17

Family

ID=10165646

Family Applications (1)

Application Number Title Priority Date Filing Date
GB21600/65A Expired GB1039257A (en) 1965-05-21 1965-05-21 Semiconductor devices

Country Status (4)

Country Link
DE (1) DE1564147A1 (https=)
FR (1) FR1500841A (https=)
GB (1) GB1039257A (https=)
NL (1) NL6606800A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8004139A (nl) * 1980-07-18 1982-02-16 Philips Nv Halfgeleiderinrichting.
DE10149774A1 (de) 2001-10-09 2003-04-24 Bosch Gmbh Robert Verfahren zum Verpacken von elektronischen Baugruppen und Mehrfachchipverpackung

Also Published As

Publication number Publication date
NL6606800A (https=) 1966-11-22
DE1564147A1 (de) 1969-10-02
FR1500841A (fr) 1967-11-10

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