GB1037272A - Improvements relating to semi-conductors - Google Patents

Improvements relating to semi-conductors

Info

Publication number
GB1037272A
GB1037272A GB1851263A GB1851263A GB1037272A GB 1037272 A GB1037272 A GB 1037272A GB 1851263 A GB1851263 A GB 1851263A GB 1851263 A GB1851263 A GB 1851263A GB 1037272 A GB1037272 A GB 1037272A
Authority
GB
United Kingdom
Prior art keywords
sleeve
semi
lead
aperture
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1851263A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB1037272A publication Critical patent/GB1037272A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/32—Seals for leading-in conductors
    • H01J5/40—End-disc seals, e.g. flat header
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0034—Lamp bases
    • H01J2893/0035—Lamp bases shaped as flat plates, in particular metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Abstract

1,037,272. Semi-conductor devices. ROBERT BOSCH G.m.b.H. May 10, 1963 [May 12, 1962], No. 18512/63. Heading H1K. A semi-conductor body is sealed in a metal casing by a metal disc having an aperture through which passes a connecting lead of the body insulated and spaced from the edges of the aperture by a sleeve of cast resin which has a wall thickness less than the sleeve length. In one embodiment (Fig. 1) a silica body 11 is sandwiched between molybdenum plates 12 and 13 disposed within a copper housing 10. A connecting lead 14 of the silicon body passes through an aperture in a metal disc 17, soldered and hermetically sealed at its periphery to the housing 10, and between the lead and the disc is provided a cast resin sleeve 18. A layer of varnish 15 protects the semi-conductor assembly and the housing is filled with a silicone casting compound 16. In a further embodiment (Fig. 2, not shown) a metal sleeve is soldered to the connector lead and provided between the lead and the cast resin sleeve.
GB1851263A 1962-05-12 1963-05-10 Improvements relating to semi-conductors Expired GB1037272A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEB67219A DE1188728B (en) 1962-05-12 1962-05-12 Semiconductor device

Publications (1)

Publication Number Publication Date
GB1037272A true GB1037272A (en) 1966-07-27

Family

ID=6975442

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1851263A Expired GB1037272A (en) 1962-05-12 1963-05-10 Improvements relating to semi-conductors

Country Status (2)

Country Link
DE (1) DE1188728B (en)
GB (1) GB1037272A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1057694B (en) * 1957-08-01 1959-05-21 Siemens Ag Encapsulated semiconductor device with one or more p-n junctions

Also Published As

Publication number Publication date
DE1188728B (en) 1965-03-11

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