FR1352431A - semiconductor element - Google Patents

semiconductor element

Info

Publication number
FR1352431A
FR1352431A FR929661A FR929661A FR1352431A FR 1352431 A FR1352431 A FR 1352431A FR 929661 A FR929661 A FR 929661A FR 929661 A FR929661 A FR 929661A FR 1352431 A FR1352431 A FR 1352431A
Authority
FR
France
Prior art keywords
cover
semi
casing
wall
connecting lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR929661A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Application granted granted Critical
Publication of FR1352431A publication Critical patent/FR1352431A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Abstract

968,652. Semi-conductor devices. ROBERT BOSCH G.m.b.H. May 15, 1963 [May 16, 1962], No. 19202/63. Heading H1K. A semi-conductor body 11 is housed in a metal casing 10 closed by a cover 15 having a connecting lead for the semi-conductor body rigidly affixed thereto, that part of the wall of the casing which extends beyond the cover 15 being bent over to form an inwardly-directed flange 18 retaining the cover and an insulating foil 17 being provided between the cover and the wall of the casing. The connecting lead may be in two portions as shown, an inner resilient portion 14 and an outer portion 19 formed integrally with the cover 15, or it may pass through a hole in the centre of the cover, Figs. 2 and 3 (not shown).
FR929661A 1962-05-16 1963-03-28 semiconductor element Expired FR1352431A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEB0049229 1962-05-16

Publications (1)

Publication Number Publication Date
FR1352431A true FR1352431A (en) 1964-02-14

Family

ID=25965281

Family Applications (1)

Application Number Title Priority Date Filing Date
FR929661A Expired FR1352431A (en) 1962-05-16 1963-03-28 semiconductor element

Country Status (2)

Country Link
FR (1) FR1352431A (en)
GB (1) GB968652A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3281606A (en) * 1963-07-26 1966-10-25 Texas Instruments Inc Small light sensor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3281606A (en) * 1963-07-26 1966-10-25 Texas Instruments Inc Small light sensor package

Also Published As

Publication number Publication date
GB968652A (en) 1964-09-02

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