GB1029322A - Improvements in or relating to temperature-sensitive device protection enclosures - Google Patents

Improvements in or relating to temperature-sensitive device protection enclosures

Info

Publication number
GB1029322A
GB1029322A GB4002/64A GB400264A GB1029322A GB 1029322 A GB1029322 A GB 1029322A GB 4002/64 A GB4002/64 A GB 4002/64A GB 400264 A GB400264 A GB 400264A GB 1029322 A GB1029322 A GB 1029322A
Authority
GB
United Kingdom
Prior art keywords
components
temperature
relating
sensitive device
device protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4002/64A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Publication of GB1029322A publication Critical patent/GB1029322A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Thermistors And Varistors (AREA)
GB4002/64A 1963-02-06 1964-01-30 Improvements in or relating to temperature-sensitive device protection enclosures Expired GB1029322A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR923879A FR1363163A (fr) 1963-02-06 1963-02-06 Perfectionnements aux étuves pour composants électroniques

Publications (1)

Publication Number Publication Date
GB1029322A true GB1029322A (en) 1966-05-11

Family

ID=8796406

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4002/64A Expired GB1029322A (en) 1963-02-06 1964-01-30 Improvements in or relating to temperature-sensitive device protection enclosures

Country Status (5)

Country Link
AT (1) AT248149B (enExample)
BE (1) BE643044A (enExample)
DE (1) DE1473247A1 (enExample)
FR (1) FR1363163A (enExample)
GB (1) GB1029322A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3539875A (en) * 1968-09-25 1970-11-10 Philips Corp Hardware envelope with semiconductor mounting arrangements
FR2504293A1 (fr) * 1981-04-20 1982-10-22 Burr Brown Res Corp Procede et module de regulation de temperature pour un circuit electronique
GB2198593A (en) * 1986-12-08 1988-06-15 Fluke Mfg Co John Temperature controlled hybrid circuit
USRE34179E (en) * 1986-12-08 1993-02-16 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3539875A (en) * 1968-09-25 1970-11-10 Philips Corp Hardware envelope with semiconductor mounting arrangements
FR2504293A1 (fr) * 1981-04-20 1982-10-22 Burr Brown Res Corp Procede et module de regulation de temperature pour un circuit electronique
GB2198593A (en) * 1986-12-08 1988-06-15 Fluke Mfg Co John Temperature controlled hybrid circuit
GB2198593B (en) * 1986-12-08 1991-07-03 Fluke Mfg Co John Temperature controlled hybrid assembly
USRE34179E (en) * 1986-12-08 1993-02-16 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly

Also Published As

Publication number Publication date
AT248149B (de) 1966-07-11
DE1473247A1 (de) 1969-11-06
FR1363163A (fr) 1964-06-12
BE643044A (enExample) 1964-05-15

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