GB1029322A - Improvements in or relating to temperature-sensitive device protection enclosures - Google Patents
Improvements in or relating to temperature-sensitive device protection enclosuresInfo
- Publication number
- GB1029322A GB1029322A GB400264A GB400264A GB1029322A GB 1029322 A GB1029322 A GB 1029322A GB 400264 A GB400264 A GB 400264A GB 400264 A GB400264 A GB 400264A GB 1029322 A GB1029322 A GB 1029322A
- Authority
- GB
- United Kingdom
- Prior art keywords
- components
- temperature
- relating
- sensitive device
- device protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 abstract 1
- 230000000087 stabilizing effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR923879A FR1363163A (fr) | 1963-02-06 | 1963-02-06 | Perfectionnements aux étuves pour composants électroniques |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1029322A true GB1029322A (en) | 1966-05-11 |
Family
ID=8796406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB400264A Expired GB1029322A (en) | 1963-02-06 | 1964-01-30 | Improvements in or relating to temperature-sensitive device protection enclosures |
Country Status (5)
| Country | Link |
|---|---|
| AT (1) | AT248149B (OSRAM) |
| BE (1) | BE643044A (OSRAM) |
| DE (1) | DE1473247A1 (OSRAM) |
| FR (1) | FR1363163A (OSRAM) |
| GB (1) | GB1029322A (OSRAM) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3539875A (en) * | 1968-09-25 | 1970-11-10 | Philips Corp | Hardware envelope with semiconductor mounting arrangements |
| FR2504293A1 (fr) * | 1981-04-20 | 1982-10-22 | Burr Brown Res Corp | Procede et module de regulation de temperature pour un circuit electronique |
| GB2198593A (en) * | 1986-12-08 | 1988-06-15 | Fluke Mfg Co John | Temperature controlled hybrid circuit |
| USRE34179E (en) * | 1986-12-08 | 1993-02-16 | John Fluke Mfg. Co., Inc. | Temperature controlled hybrid assembly |
-
1963
- 1963-02-06 FR FR923879A patent/FR1363163A/fr not_active Expired
-
1964
- 1964-01-28 DE DE19641473247 patent/DE1473247A1/de active Pending
- 1964-01-28 BE BE643044D patent/BE643044A/xx unknown
- 1964-01-30 AT AT73464A patent/AT248149B/de active
- 1964-01-30 GB GB400264A patent/GB1029322A/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3539875A (en) * | 1968-09-25 | 1970-11-10 | Philips Corp | Hardware envelope with semiconductor mounting arrangements |
| FR2504293A1 (fr) * | 1981-04-20 | 1982-10-22 | Burr Brown Res Corp | Procede et module de regulation de temperature pour un circuit electronique |
| GB2198593A (en) * | 1986-12-08 | 1988-06-15 | Fluke Mfg Co John | Temperature controlled hybrid circuit |
| GB2198593B (en) * | 1986-12-08 | 1991-07-03 | Fluke Mfg Co John | Temperature controlled hybrid assembly |
| USRE34179E (en) * | 1986-12-08 | 1993-02-16 | John Fluke Mfg. Co., Inc. | Temperature controlled hybrid assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1473247A1 (de) | 1969-11-06 |
| BE643044A (OSRAM) | 1964-05-15 |
| AT248149B (de) | 1966-07-11 |
| FR1363163A (fr) | 1964-06-12 |
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