GB1028190A - Improvements in or relating to dry plate rectifier assemblies - Google Patents

Improvements in or relating to dry plate rectifier assemblies

Info

Publication number
GB1028190A
GB1028190A GB42764/65A GB4276465A GB1028190A GB 1028190 A GB1028190 A GB 1028190A GB 42764/65 A GB42764/65 A GB 42764/65A GB 4276465 A GB4276465 A GB 4276465A GB 1028190 A GB1028190 A GB 1028190A
Authority
GB
United Kingdom
Prior art keywords
assembly
members
slot
relating
slots
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB42764/65A
Inventor
Sidney Hughes Marrow
Henry William Ernest Warner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB15793/58A external-priority patent/GB852937A/en
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority claimed from GB2601563A external-priority patent/GB1021149A/en
Publication of GB1028190A publication Critical patent/GB1028190A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

1,028,190. Rectifier assemblies. STANDARDS TELEPHONES & CABLES Ltd. July 1, 1963, No. 42764/65. Divided out of 1,021,149. Addition to 852,937. Heading H1K. The rectifier assembly of the parent Specification has a casing formed by two similar insulating members, such as shown in Fig. 1, each part having an integral end cap 42 at one end which, on assembly fits into a corresponding recess 45 at the other end of the other part. The casing may be provided with a slot, or slots, formed either by recessing one or both longitudinal edges of one or both members to either the full or half the required width of the slot, or by forming a slot in the wall of one or both members between the longitudinal edges of the member, Fig. 3 (not shown). If two slots are provided, the assembly may be of the type disclosed in Specification 1,021,149 using double-ended terminal members 20 and 24, Fig. 5 (not shown). The completed assembly may be encapsulated in, e.g., synthetic resin or sealed in the cylindrical plastics envelope in the manner described in Specification 951,354.
GB42764/65A 1958-05-16 1963-07-01 Improvements in or relating to dry plate rectifier assemblies Expired GB1028190A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB15793/58A GB852937A (en) 1958-05-16 1958-05-16 Improvements in or relating to dry plate rectifier assemblies
GB2601563A GB1021149A (en) 1963-07-01 1963-07-01 Improvements in or relating to dry plate rectifier assemblies

Publications (1)

Publication Number Publication Date
GB1028190A true GB1028190A (en) 1966-05-04

Family

ID=26251542

Family Applications (1)

Application Number Title Priority Date Filing Date
GB42764/65A Expired GB1028190A (en) 1958-05-16 1963-07-01 Improvements in or relating to dry plate rectifier assemblies

Country Status (1)

Country Link
GB (1) GB1028190A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2535111A1 (en) * 1982-10-22 1984-04-27 Westinghouse Electric Corp HEAT RADIATOR ASSEMBLY FOR SEMICONDUCTOR DEVICES

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2535111A1 (en) * 1982-10-22 1984-04-27 Westinghouse Electric Corp HEAT RADIATOR ASSEMBLY FOR SEMICONDUCTOR DEVICES

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