GB1023683A - A device for use in producing a block of thermo-electric elements - Google Patents

A device for use in producing a block of thermo-electric elements

Info

Publication number
GB1023683A
GB1023683A GB18944/63A GB1894463A GB1023683A GB 1023683 A GB1023683 A GB 1023683A GB 18944/63 A GB18944/63 A GB 18944/63A GB 1894463 A GB1894463 A GB 1894463A GB 1023683 A GB1023683 A GB 1023683A
Authority
GB
United Kingdom
Prior art keywords
members
frame
thermo
bridges
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB18944/63A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Publication of GB1023683A publication Critical patent/GB1023683A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/813—Structural details of the junction the junction being separable, e.g. using a spring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

Abstract

1,023,683. Semi-conductor devices. SIEMENS-SCHUCKERTWERKE A.G. May 13, 1963 [May 12, 1962], No. 18944/63. Heading H1K. A jig for the assembly of a block of seriesconnected thermo-electric elements comprises a frame which supports a lattice formed of two sets of crossed members one set being notched to engage the other set, a wall closing one face of the frame, and spaces provided between the frame and the lattice for receiving the connecting bridges of the block. As shown, Fig. 2, the lattice 8 comprises members 17 provided with notches in theirupper and lower edges to locate cross-members 15 and 16. The ends of the members engage slots in the frame 7 which is closed on the underside by a base wall 9, Fig. 3 (not shown). Conductive bridges 6 and associated solder strips 5 are placed on wall 9 between members 16 and 17 and passing under certain members 15. Thermo-electric elements 3, 4 of opposite conductivity types have their ends coated with bismuth to facilitate soldering, are placed in the openings of the lattice and are topped by solder strips 2 and conductive bridges 1. A lid 12 is attached to the frame and is provided with spring-loaded pins 11 which press the bridges 1 on to the elements 3, 4. The whole arrangement is then heated to solder the bridges to the elements. The jig is then dismantled, members 16 being formed in two parts to facilitate this, and the thermo-electric block is provided at its edges, and/or in the gaps between the elements, with an envelope of transparent plastic.
GB18944/63A 1962-05-12 1963-05-13 A device for use in producing a block of thermo-electric elements Expired GB1023683A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES79422A DE1195835B (en) 1962-05-12 1962-05-12 Soldering device for the production of thermocouple blocks

Publications (1)

Publication Number Publication Date
GB1023683A true GB1023683A (en) 1966-03-23

Family

ID=7508185

Family Applications (1)

Application Number Title Priority Date Filing Date
GB18944/63A Expired GB1023683A (en) 1962-05-12 1963-05-13 A device for use in producing a block of thermo-electric elements

Country Status (3)

Country Link
US (1) US3223406A (en)
DE (1) DE1195835B (en)
GB (1) GB1023683A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3730511A (en) * 1971-03-12 1973-05-01 Burroughs Corp Clamp for use in assembling display device
FR2332545A1 (en) * 1975-11-21 1977-06-17 Cit Alcatel SUPPORT OF CONNECTIONS FOR FIBER OPTICS AND PROCESS FOR ITS IMPLEMENTATION
GB8520844D0 (en) * 1985-08-20 1985-09-25 Sun Ind Coatings Holding electrical/electronic components
EP0572151A3 (en) * 1992-05-28 1995-01-18 Avx Corp Varistors with sputtered terminations and a method of applying sputtered teminations to varistors and the like.
JP4488778B2 (en) * 2003-07-25 2010-06-23 株式会社東芝 Thermoelectric converter
DE102015207941A1 (en) * 2015-04-29 2016-11-03 Robert Bosch Gmbh Thermoelectric generator and method of manufacturing a thermoelectric generator
CN105081508A (en) * 2015-07-29 2015-11-25 浙江大学 Positioning and clamping device applied to thermoelectric module preparation process
CN106505143B (en) * 2016-12-28 2018-12-14 浙江大学 Thermoelectric arm positioning device in thermoelectricity mould group manufacturing process

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE633828C (en) * 1936-08-08 Heraeus Vacuumschmelze Akt Ges Thermocouple with high thermal power
US2289152A (en) * 1939-06-13 1942-07-07 Westinghouse Electric & Mfg Co Method of assembling thermoelectric generators
US2749716A (en) * 1954-11-19 1956-06-12 Rca Corp Refrigeration
GB876294A (en) * 1958-02-20 1961-08-30 Gen Electric Co Ltd Improvements in or relating to the manufacture of thermoelectric devices
DE1165050B (en) * 1958-12-04 1964-03-12 Siemens Elektrogeraete Gmbh Cooling device with two electrothermal cooling devices
US3053969A (en) * 1959-04-02 1962-09-11 Electric Furnace Co Method and apparatus for metal structural panel construction

Also Published As

Publication number Publication date
US3223406A (en) 1965-12-14
DE1195835B (en) 1965-07-01

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