CH399602A - Semiconductor component enclosed in a housing - Google Patents
Semiconductor component enclosed in a housingInfo
- Publication number
- CH399602A CH399602A CH671063A CH671063A CH399602A CH 399602 A CH399602 A CH 399602A CH 671063 A CH671063 A CH 671063A CH 671063 A CH671063 A CH 671063A CH 399602 A CH399602 A CH 399602A
- Authority
- CH
- Switzerland
- Prior art keywords
- housing
- semiconductor component
- component enclosed
- enclosed
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0080982 | 1962-08-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH399602A true CH399602A (en) | 1965-09-30 |
Family
ID=7509244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH671063A CH399602A (en) | 1962-08-18 | 1963-05-29 | Semiconductor component enclosed in a housing |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH399602A (en) |
DE (1) | DE1251442B (en) |
GB (1) | GB1047778A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2360184A1 (en) * | 1976-07-28 | 1978-02-24 | Sihn Jr Kg Wilhelm | Cooled resistor closing coaxial HF lines - consists of resistance and cooling elements separated by electrically insulating and heat conductive intermediate layer |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE333197B (en) * | 1966-12-27 | 1971-03-08 | Asea Ab | SEMICONDUCTOR FOR GREAT CURRENTS |
DE8909244U1 (en) * | 1989-07-31 | 1989-09-21 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De | |
EP2037498A1 (en) * | 2007-09-11 | 2009-03-18 | Siemens Aktiengesellschaft | High performance highly heat resistant semiconductor module |
DE102008034075B4 (en) * | 2008-07-22 | 2012-06-06 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module and method for its production |
DE102012211446B4 (en) * | 2012-07-02 | 2016-05-12 | Infineon Technologies Ag | EXPLOSION-PROTECTED SEMICONDUCTOR MODULE |
-
0
- DE DES80982A patent/DE1251442B/de active Pending
-
1963
- 1963-05-29 CH CH671063A patent/CH399602A/en unknown
- 1963-08-12 GB GB3177563A patent/GB1047778A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2360184A1 (en) * | 1976-07-28 | 1978-02-24 | Sihn Jr Kg Wilhelm | Cooled resistor closing coaxial HF lines - consists of resistance and cooling elements separated by electrically insulating and heat conductive intermediate layer |
Also Published As
Publication number | Publication date |
---|---|
DE1251442B (en) | |
GB1047778A (en) | 1966-11-09 |
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