GB1015560A - A process for the production of semi-conductor wafers - Google Patents

A process for the production of semi-conductor wafers

Info

Publication number
GB1015560A
GB1015560A GB2262564A GB2262564A GB1015560A GB 1015560 A GB1015560 A GB 1015560A GB 2262564 A GB2262564 A GB 2262564A GB 2262564 A GB2262564 A GB 2262564A GB 1015560 A GB1015560 A GB 1015560A
Authority
GB
United Kingdom
Prior art keywords
semi
wafers
conductor
film
wound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2262564A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of GB1015560A publication Critical patent/GB1015560A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
GB2262564A 1963-06-01 1964-06-01 A process for the production of semi-conductor wafers Expired GB1015560A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES85497A DE1224192B (de) 1963-06-01 1963-06-01 Verfahren zum Umhuellen eines Halbleiterstabes zum Zwecke des anschliessenden Abtrennens von Scheiben

Publications (1)

Publication Number Publication Date
GB1015560A true GB1015560A (en) 1966-01-05

Family

ID=7512400

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2262564A Expired GB1015560A (en) 1963-06-01 1964-06-01 A process for the production of semi-conductor wafers

Country Status (5)

Country Link
BE (1) BE648587A (enrdf_load_stackoverflow)
CH (1) CH407337A (enrdf_load_stackoverflow)
DE (1) DE1224192B (enrdf_load_stackoverflow)
GB (1) GB1015560A (enrdf_load_stackoverflow)
NL (1) NL302762A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3597658A (en) * 1969-11-26 1971-08-03 Rca Corp High current semiconductor device employing a zinc-coated aluminum substrate
US4564494A (en) * 1982-07-06 1986-01-14 Honeywell Inc. Encapsulant of CdTe boules for multiblade wafering
CN109808271A (zh) * 2018-12-30 2019-05-28 苏州润德新材料有限公司 一种硅片切割用塑料支撑板及其制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0210727A (ja) * 1988-06-28 1990-01-16 Naoetsu Denshi Kogyo Kk 半導体ウエハの分割方法および装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2813326A (en) * 1953-08-20 1957-11-19 Liebowitz Benjamin Transistors
DE1059571B (de) * 1957-08-13 1959-06-18 Siemens Ag Trockengleichrichteranordnung kleiner Bauweise und Verfahren zu ihrer Herstellung
DE1066282B (enrdf_load_stackoverflow) * 1958-03-26 1900-01-01
US2968866A (en) * 1958-05-21 1961-01-24 Sylvania Electric Prod Method of producing thin wafers of semiconductor materials

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3597658A (en) * 1969-11-26 1971-08-03 Rca Corp High current semiconductor device employing a zinc-coated aluminum substrate
US4564494A (en) * 1982-07-06 1986-01-14 Honeywell Inc. Encapsulant of CdTe boules for multiblade wafering
CN109808271A (zh) * 2018-12-30 2019-05-28 苏州润德新材料有限公司 一种硅片切割用塑料支撑板及其制备方法

Also Published As

Publication number Publication date
DE1224192B (de) 1966-09-01
BE648587A (enrdf_load_stackoverflow) 1964-11-30
NL302762A (enrdf_load_stackoverflow)
CH407337A (de) 1966-02-15

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