GB0921428D0 - Method for the injection of cmp slurry - Google Patents

Method for the injection of cmp slurry

Info

Publication number
GB0921428D0
GB0921428D0 GBGB0921428.9A GB0921428A GB0921428D0 GB 0921428 D0 GB0921428 D0 GB 0921428D0 GB 0921428 A GB0921428 A GB 0921428A GB 0921428 D0 GB0921428 D0 GB 0921428D0
Authority
GB
United Kingdom
Prior art keywords
injection
cmp slurry
cmp
slurry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0921428.9A
Other versions
GB2470246A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Araca Inc
Original Assignee
Araca Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Araca Inc filed Critical Araca Inc
Publication of GB0921428D0 publication Critical patent/GB0921428D0/en
Publication of GB2470246A publication Critical patent/GB2470246A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
GB0921428A 2009-02-25 2009-12-07 Method for the injection of CMP slurry Withdrawn GB2470246A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/392,676 US20100216373A1 (en) 2009-02-25 2009-02-25 Method for cmp uniformity control

Publications (2)

Publication Number Publication Date
GB0921428D0 true GB0921428D0 (en) 2010-01-20
GB2470246A GB2470246A (en) 2010-11-17

Family

ID=41642066

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0921428A Withdrawn GB2470246A (en) 2009-02-25 2009-12-07 Method for the injection of CMP slurry

Country Status (5)

Country Link
US (1) US20100216373A1 (en)
JP (1) JP2010206167A (en)
KR (1) KR20100096999A (en)
GB (1) GB2470246A (en)
TW (1) TW201039978A (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012082126A1 (en) * 2010-12-16 2012-06-21 Araca, Inc. Method and device for the injection of cmp slurry
US8845395B2 (en) 2008-10-31 2014-09-30 Araca Inc. Method and device for the injection of CMP slurry
US8197306B2 (en) * 2008-10-31 2012-06-12 Araca, Inc. Method and device for the injection of CMP slurry
US20130233356A1 (en) * 2012-03-12 2013-09-12 Lam Research Ag Process and apparatus for treating surfaces of wafer-shaped articles
US8860040B2 (en) 2012-09-11 2014-10-14 Dow Corning Corporation High voltage power semiconductor devices on SiC
US9018639B2 (en) 2012-10-26 2015-04-28 Dow Corning Corporation Flat SiC semiconductor substrate
KR102229556B1 (en) 2013-01-11 2021-03-18 어플라이드 머티어리얼스, 인코포레이티드 Chemical mechanical polishing apparatus and methods
US9797064B2 (en) 2013-02-05 2017-10-24 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a support shelf which permits thermal expansion
US9738991B2 (en) 2013-02-05 2017-08-22 Dow Corning Corporation Method for growing a SiC crystal by vapor deposition onto a seed crystal provided on a supporting shelf which permits thermal expansion
CN104742007B (en) * 2013-12-30 2017-08-25 中芯国际集成电路制造(北京)有限公司 Chemical mechanical polishing device and chemical and mechanical grinding method
US20160027668A1 (en) * 2014-07-25 2016-01-28 Applied Materials, Inc. Chemical mechanical polishing apparatus and methods
US9279192B2 (en) 2014-07-29 2016-03-08 Dow Corning Corporation Method for manufacturing SiC wafer fit for integration with power device manufacturing technology
US20170355059A1 (en) * 2016-06-14 2017-12-14 Confluense Llc Slurry Slip Stream Controller For CMP System
US11266344B2 (en) 2016-09-21 2022-03-08 Samsung Electronics Co., Ltd. Method for measuring skin condition and electronic device therefor
KR101969637B1 (en) 2017-03-20 2019-08-14 한국표준과학연구원 Apparatus and Method for Automatic Injection of Polishing Composition for Large Area Mirror System
KR101964633B1 (en) 2017-06-08 2019-04-02 일진파워텍(주) Apparatus for Installing Underground Cable Using Vehicle
KR200488907Y1 (en) 2017-06-14 2019-04-03 김광일 Heater for a Permanent Rod
KR20190000016U (en) 2017-06-23 2019-01-03 김근식 Correcting Apparatus for Toes with Improved function of correction and Acupressure Function
KR102041680B1 (en) 2017-10-16 2019-11-28 현대건설주식회사 Method for constructing of caisson with friction increased structure
KR101967108B1 (en) 2018-08-22 2019-04-08 주식회사 비앤엠 Impact Bar with a Reinforced Creases for a Vehicle Door
KR101967109B1 (en) 2018-08-22 2019-04-08 주식회사 비앤엠 Integrated Type Impact Bar for a Vehicle Door
JP7339824B2 (en) * 2019-09-17 2023-09-06 株式会社ディスコ Flow rate adjustment method and pressure adjustment method
KR102290360B1 (en) 2019-09-25 2021-08-17 현대건설주식회사 Method for constructing of caisson with friction increased structure
KR102754098B1 (en) * 2019-12-24 2025-01-14 에스케이하이닉스 주식회사 Apparatus of chemical mechanical polishing And Method of driving the same
CN112936066A (en) * 2021-01-29 2021-06-11 褚洪海 Copper polishing equipment with clamping induction width spraying adaptive polishing solution
WO2024049719A2 (en) * 2022-08-29 2024-03-07 Rajeev Bajaj Advanced fluid delivery

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6007411A (en) * 1997-06-19 1999-12-28 Interantional Business Machines Corporation Wafer carrier for chemical mechanical polishing
KR100550034B1 (en) * 1998-04-06 2006-02-08 가부시키가이샤 에바라 세이사꾸쇼 Polishing device
US6347979B1 (en) * 1998-09-29 2002-02-19 Vsli Technology, Inc. Slurry dispensing carrier ring
US6939198B1 (en) * 2001-12-28 2005-09-06 Applied Materials, Inc. Polishing system with in-line and in-situ metrology
TWI252791B (en) * 2002-01-18 2006-04-11 Promos Technologies Inc Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus
KR100506942B1 (en) * 2003-09-03 2005-08-05 삼성전자주식회사 Chemical mechanical polishing apparatus
US6908370B1 (en) * 2003-12-04 2005-06-21 Intel Corporation Rinse apparatus and method for wafer polisher
US7201634B1 (en) * 2005-11-14 2007-04-10 Infineon Technologies Ag Polishing methods and apparatus
DE102006056623A1 (en) * 2006-11-30 2008-06-05 Advanced Micro Devices, Inc., Sunnyvale System for chemical mechanical polishing, has controllable movable foreman head, which is formed to mount substrate and to hold in position, and foreman cushion, is mounted on plate, which is coupled with drive arrangement

Also Published As

Publication number Publication date
KR20100096999A (en) 2010-09-02
GB2470246A (en) 2010-11-17
JP2010206167A (en) 2010-09-16
TW201039978A (en) 2010-11-16
US20100216373A1 (en) 2010-08-26

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)