GB0813487D0 - Variable thermal conductance cooling device - Google Patents
Variable thermal conductance cooling deviceInfo
- Publication number
- GB0813487D0 GB0813487D0 GBGB0813487.6A GB0813487A GB0813487D0 GB 0813487 D0 GB0813487 D0 GB 0813487D0 GB 0813487 A GB0813487 A GB 0813487A GB 0813487 D0 GB0813487 D0 GB 0813487D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- cooling device
- thermal conductance
- variable thermal
- variable
- conductance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001816 cooling Methods 0.000 title 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0813487A GB2462098A (en) | 2008-07-23 | 2008-07-23 | Thermal management device comprising heat pipes |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0813487A GB2462098A (en) | 2008-07-23 | 2008-07-23 | Thermal management device comprising heat pipes |
Publications (2)
Publication Number | Publication Date |
---|---|
GB0813487D0 true GB0813487D0 (en) | 2008-08-27 |
GB2462098A GB2462098A (en) | 2010-01-27 |
Family
ID=39737527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0813487A Withdrawn GB2462098A (en) | 2008-07-23 | 2008-07-23 | Thermal management device comprising heat pipes |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2462098A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2962625B1 (en) * | 2010-07-07 | 2018-03-16 | Renault S.A.S | DEVICE FOR COOLING AT LEAST ONE ELEMENT COMPRISING AT LEAST ONE ELECTRONIC COMPONENT |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3198771B2 (en) * | 1993-12-20 | 2001-08-13 | 日立電線株式会社 | heatsink |
JPH08136170A (en) * | 1994-11-07 | 1996-05-31 | Mitsubishi Cable Ind Ltd | Heat pipe type cooler |
JP2000150751A (en) * | 1998-11-11 | 2000-05-30 | Toshiba Transport Eng Inc | Semiconductor cooling device |
JP3900830B2 (en) * | 1999-03-19 | 2007-04-04 | 株式会社日立製作所 | Heat pipe type cooling device and power conversion device |
JP2004061081A (en) * | 2002-07-31 | 2004-02-26 | Hitachi Cable Ltd | Heat pipe |
JP2006278717A (en) * | 2005-03-29 | 2006-10-12 | Toshiba Corp | Heating part heat radiation mechanism and ttl transmitting set using the same |
TW200815968A (en) * | 2006-09-28 | 2008-04-01 | Jun-Guang Luo | Phase change heat dissipation device and method |
-
2008
- 2008-07-23 GB GB0813487A patent/GB2462098A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2462098A (en) | 2010-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |