GB0813487D0 - Variable thermal conductance cooling device - Google Patents

Variable thermal conductance cooling device

Info

Publication number
GB0813487D0
GB0813487D0 GBGB0813487.6A GB0813487A GB0813487D0 GB 0813487 D0 GB0813487 D0 GB 0813487D0 GB 0813487 A GB0813487 A GB 0813487A GB 0813487 D0 GB0813487 D0 GB 0813487D0
Authority
GB
United Kingdom
Prior art keywords
cooling device
thermal conductance
variable thermal
variable
conductance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0813487.6A
Other versions
GB2462098A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THERMACORE EUROPE Ltd
Boyd Technologies Ashington UK Ltd
Original Assignee
THERMACORE EUROPE Ltd
Thermacore Europe Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THERMACORE EUROPE Ltd, Thermacore Europe Ltd filed Critical THERMACORE EUROPE Ltd
Priority to GB0813487A priority Critical patent/GB2462098A/en
Publication of GB0813487D0 publication Critical patent/GB0813487D0/en
Publication of GB2462098A publication Critical patent/GB2462098A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB0813487A 2008-07-23 2008-07-23 Thermal management device comprising heat pipes Withdrawn GB2462098A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0813487A GB2462098A (en) 2008-07-23 2008-07-23 Thermal management device comprising heat pipes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0813487A GB2462098A (en) 2008-07-23 2008-07-23 Thermal management device comprising heat pipes

Publications (2)

Publication Number Publication Date
GB0813487D0 true GB0813487D0 (en) 2008-08-27
GB2462098A GB2462098A (en) 2010-01-27

Family

ID=39737527

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0813487A Withdrawn GB2462098A (en) 2008-07-23 2008-07-23 Thermal management device comprising heat pipes

Country Status (1)

Country Link
GB (1) GB2462098A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2962625B1 (en) * 2010-07-07 2018-03-16 Renault S.A.S DEVICE FOR COOLING AT LEAST ONE ELEMENT COMPRISING AT LEAST ONE ELECTRONIC COMPONENT

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3198771B2 (en) * 1993-12-20 2001-08-13 日立電線株式会社 heatsink
JPH08136170A (en) * 1994-11-07 1996-05-31 Mitsubishi Cable Ind Ltd Heat pipe type cooler
JP2000150751A (en) * 1998-11-11 2000-05-30 Toshiba Transport Eng Inc Semiconductor cooling device
JP3900830B2 (en) * 1999-03-19 2007-04-04 株式会社日立製作所 Heat pipe type cooling device and power conversion device
JP2004061081A (en) * 2002-07-31 2004-02-26 Hitachi Cable Ltd Heat pipe
JP2006278717A (en) * 2005-03-29 2006-10-12 Toshiba Corp Heating part heat radiation mechanism and ttl transmitting set using the same
TW200815968A (en) * 2006-09-28 2008-04-01 Jun-Guang Luo Phase change heat dissipation device and method

Also Published As

Publication number Publication date
GB2462098A (en) 2010-01-27

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)