GB0719805D0 - Method and device for supplying electrical power - Google Patents

Method and device for supplying electrical power

Info

Publication number
GB0719805D0
GB0719805D0 GBGB0719805.4A GB0719805A GB0719805D0 GB 0719805 D0 GB0719805 D0 GB 0719805D0 GB 0719805 A GB0719805 A GB 0719805A GB 0719805 D0 GB0719805 D0 GB 0719805D0
Authority
GB
United Kingdom
Prior art keywords
electrical power
supplying electrical
supplying
power
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0719805.4A
Other versions
GB2453560A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renewable Energy Corp ASA
Original Assignee
Renewable Energy Corp ASA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renewable Energy Corp ASA filed Critical Renewable Energy Corp ASA
Priority to GB0719805A priority Critical patent/GB2453560A/en
Publication of GB0719805D0 publication Critical patent/GB0719805D0/en
Priority to JP2010528823A priority patent/JP2011500960A/en
Priority to PCT/NO2008/000359 priority patent/WO2009048338A1/en
Priority to US12/682,473 priority patent/US20100307926A1/en
Priority to DE112008002725T priority patent/DE112008002725T5/en
Priority to CN200880119132.9A priority patent/CN101883880B/en
Publication of GB2453560A publication Critical patent/GB2453560A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
GB0719805A 2007-10-10 2007-10-10 Wafer electroplating apparatus Withdrawn GB2453560A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB0719805A GB2453560A (en) 2007-10-10 2007-10-10 Wafer electroplating apparatus
JP2010528823A JP2011500960A (en) 2007-10-10 2008-10-09 Method and apparatus for supplying power
PCT/NO2008/000359 WO2009048338A1 (en) 2007-10-10 2008-10-09 Method and device for supplying electrical power
US12/682,473 US20100307926A1 (en) 2007-10-10 2008-10-09 Method and device for supplying electrical power
DE112008002725T DE112008002725T5 (en) 2007-10-10 2008-10-09 Method and apparatus for supplying electricity
CN200880119132.9A CN101883880B (en) 2007-10-10 2008-10-09 Method and device for supplying electrical power

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0719805A GB2453560A (en) 2007-10-10 2007-10-10 Wafer electroplating apparatus

Publications (2)

Publication Number Publication Date
GB0719805D0 true GB0719805D0 (en) 2007-11-21
GB2453560A GB2453560A (en) 2009-04-15

Family

ID=38787940

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0719805A Withdrawn GB2453560A (en) 2007-10-10 2007-10-10 Wafer electroplating apparatus

Country Status (6)

Country Link
US (1) US20100307926A1 (en)
JP (1) JP2011500960A (en)
CN (1) CN101883880B (en)
DE (1) DE112008002725T5 (en)
GB (1) GB2453560A (en)
WO (1) WO2009048338A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2459124A (en) * 2008-04-10 2009-10-14 Rec Solar As Wafer holder for electroplating apparatus

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB709619A (en) 1951-12-14 1954-05-26 Metro Cutanit Ltd Improvements in or relating to securing a steel or other metallic part to another part of hard and difficult to work material, such as a shaft to a turbine wheel
DE3624481A1 (en) * 1986-07-19 1988-01-28 Schering Ag ARRANGEMENT FOR THE ELECTROLYTIC TREATMENT OF PLATE-SHAPED OBJECTS
JPS63117818A (en) * 1986-10-31 1988-05-21 Showa Electric Wire & Cable Co Ltd Plating device
JP3239534B2 (en) * 1993-04-28 2001-12-17 イビデン株式会社 Plating rack
JPH09195092A (en) * 1996-01-09 1997-07-29 Ibiden Co Ltd Continuous electrolytic device
US5893966A (en) * 1997-07-28 1999-04-13 Micron Technology, Inc. Method and apparatus for continuous processing of semiconductor wafers
US6261426B1 (en) * 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
US7022211B2 (en) * 2000-01-31 2006-04-04 Ebara Corporation Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
JP3284496B2 (en) * 2000-08-09 2002-05-20 株式会社荏原製作所 Plating apparatus and plating solution removal method
US20020097562A1 (en) * 2000-12-18 2002-07-25 Tdk Corporation Electronic device and manufacturing same
US6558750B2 (en) * 2001-07-16 2003-05-06 Technic Inc. Method of processing and plating planar articles
US6524463B2 (en) * 2001-07-16 2003-02-25 Technic, Inc. Method of processing wafers and other planar articles within a processing cell
JP2004292907A (en) * 2003-03-27 2004-10-21 Fujitsu Ltd Electrolysis device, and method for manufacturing semiconductor device
US7172184B2 (en) * 2003-08-06 2007-02-06 Sunpower Corporation Substrate carrier for electroplating solar cells
DE102004025827B3 (en) * 2004-05-24 2005-06-30 Höllmüller Maschinenbau GmbH Electrical contacting device for circuit board or conductor foil passed through electrolytic cell using contacts alternating with transport rollers along each side edge

Also Published As

Publication number Publication date
WO2009048338A1 (en) 2009-04-16
JP2011500960A (en) 2011-01-06
GB2453560A (en) 2009-04-15
CN101883880A (en) 2010-11-10
DE112008002725T5 (en) 2010-08-26
US20100307926A1 (en) 2010-12-09
CN101883880B (en) 2012-10-03

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)